Test Sockets
provide electro mechano connection between DUT and ATE in hand testing applications.
See Also: BGA Test Sockets, Burn-In Sockets
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Custom Test Sockets
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RTI specializes in producing custom test sockets We work with your engineering team from prototype to production, ensuring your product meets your test requirements. Contact us for a free quote.
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Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Test Sockets
Non Standard
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Chances are good Ardent can help you with that. We can adapt our technology to just about any package, device or module. Small volumes of custom sockets for higher bandwidth applications are a niche all in their own, and our engineering team has many years of experience designing custom sockets for all kinds of applications.
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Test Sockets
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socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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Test Sockets & Interposers
Silmat
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Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Off-Set Kelvin Test Sockets
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This is an innovative and robust contact technology for making Kelvin contact to 0.5mm pitch QFNs. The contact uses a tip that is angled to one side, matched to an orientation that's flat on the tip. Two such contacts placed in opposition will touch the pad within 0.125mm. And because the tip is offset, the probe diameter is a robust 0.39mm and the load board pad pitch remains 0.5mm.
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High Performance Chipscale Test Sockets
SC
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Ardent Concepts Test Sockets for ATE test deploy patented SC Contact Sets. This technology is capable of over 2 Million mechanical insertions in production environments and uses easy to replace pins with no complicated assembly procedure. It is designed to be drop-in compatible with 1mm offset and straight through footprints to ease implementation, and RC SC’s simple and robust design is extremely cost effective when compared with existing “roll” type test contactors and sockets. Designed specifically for JEDEC QFN and MLF applications, SC High Performance Test Sockets are available for most handler set-ups and offer exceptional AC performance.
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Test Sockets
QFN/QFP
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For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
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Product
Test Contactor/Probe Head
Hydra
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Engineered for excellence and efficiency, Hydra™ spring probe series offers precision, reliability, and standardized semiconductor test interface.Designed to be best-in-class at a competitive price point, Hydra is optimized to maximize your operational efficiency. Hydra is built to withstand demanding high-volume manufacturing test environments with its robust and durable design.With a common test-height, Hydra offers the ability to mix and match power, RF, and Kelvin probes within the same test socket. In addition, Hydra streamlines inventory management with fewer probe part numbers to manage and shorter lead times.
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Turret Kelvin Test Contactor
cHybrid
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cHybrid™ Kelvin contactor contains a new and unique contact spring architecture which allows the test socket to adapt to challenging IC pad geometry requirements of todays and future small package types. Great lifetime up to 3 million touchdowns, with best-in-class contact resistance repeatability reduces cost of test significantly. A multi-beam contact structure optimizes signal integrity and current capability according to challenging electrical test requirements.cHybrid Kelvin contactor with multi-beam contact spring architecture delivers improved yield and long life minimizing cleaning cycles. This innovative solution will help customers reduce cost and maximize productivity.
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Universal Test Socket Receptacle
Series 6556
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Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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DDR4 Pro Memory Test Adapter
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This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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6 Position Plug Socket Switch Life Tester
CZKS-6
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It is designed according to terms and conditions of IEC60884-1, IEC60669-1, GB2099.1-2008 and GB16915.1-2003, for life test of plug and socket and switch products of household and similar use appliances. The device can connect with matched load cabinet, in order to conduct a test of electrical life, normal operation and breaking capacity. The equipment provide some clamp, it can test plug and socket production, wall switch, rocker switch, dial plate switch and button switch.
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Near Zero Footprint SMT Spring Pin Sockets
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Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Test Probes
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Petracarbon is a leading supplier and provider of spring contact probes and semiconductor test sockets.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
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Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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High Speed Thermal Printer
6041
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• RS232C serial interface via a 6-pole RJ12 socket• Tested to comply with FCC Standards• Designed for use with Associated Model 6044 and similar devices• Four AA Batteries included• Imported
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BGA Sockets
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Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Fixture Design
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TestEdge offers quick, cost effective test fixture design services for low-speed, full-speed, and high-speed devices. Based on our experience in developing high performance test fixtures for a wide variety of devices, test sockets, and tester platforms, we provide a premium quality test and engineering validation environment for everything from high power (40W) to high pin count to high speed ECL to high speed SerDes (3.25Gb) devices.
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Burn-In Test Sockets
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The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Boundary-Scan DIMM Socket Tester
ScanDIMM
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Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Package Probe
Test Socket
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Jigs for testing the electrical characteristics of devices in the final testing stage after LSI package assembly.To match the increasingly high functionality of LSIs for communications and networks, such as mobile phones and mobile devices, we provide two types of test sockets: The "J-Contacts" series suited for high-frequency, high-performance devices, and the "BeeContacts" series, spring probes with a unique structure that delivers excellent contact stability.
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Test Socket
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Our test sockets are made for high performance and are of top quality, to guarantee a smooth, effortless process. We believe in providing our partners and customers with effective and intelligent solutions that they can apply with ease. Choose the solutions of TTS Group cater to the needs of detailed and complex systems.
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Fuel Display Unit Tester
MS 1125
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Fuel Display Unit Test Bench is a compact table-top test bench with front panel controls, indications, built-in signal simulator and necessary power supply for testing the serviceability of Fuel Display Unit of Helicopter. FTB operates on 230 V AC and supplies 28 V DC power to FDU. FTB is housed in a metallic cabinet FTB interfaces with both 61 Pin connector and 6-pin socket mounted on the rear panel of FDU by means of the cable connected to the unit. FTB is fabricated utilizing off-the-shelf standard industrial/commercial components like rotary switches, toggle switches, press switches, test sockets, fuse holders, potentiometer etc. The Frequency generation circuit is integrated into FTB for the simulation of Fuel probe and flow rate signals. The frequency of the signal can be selected by means of a rotary switch Low amplitude sine wave signal is simulated for testing flow rates. Variable voltage DC power supply with a voltage range of 24 to 29 Volts is provided within FTB to power-up FDU. 5 V DC is provided for the operation of signal generating circuit (PIC Frequency Controller Board). An off-the-shelf Hand held battery operated Digital Multimeter (DMM) procured from the prominent manufacturer (FLUKE) is supplied with FTB for setting up and measurement of various parameters like Resistance, Voltage, Frequency etc.
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General Final Test
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C.C.P. Contact Probes Co., LTD.
CCP designs and manufactures custom made test sockets.
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Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
