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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
Memory Tester for DDR4 DIMMS
RAMCHECK LX
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USBWith the RAMCHECK LX DDR4 memory tester package (part number INN-8686-DDR4) you can quickly test and identify DDR4 DIMMs that comply with JEDEC standards. Tests are fast, reliable and easy to do. The RAMCHECK LX DDR4 package includes the RAMCHECK LX base tester and 288-pin DDR4 DIMM adapter. (This package is also available with the DDR4 DIMM Pro adapter, featuring a very rugged test socket).
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Product
DDR4 Parametric Test Reference Solution
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Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
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Product
SODIMM DDR4
SQR-SD4N
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Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
DDR4 Protocol Debug And Analysis Solution
U4972A
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The U4972A DDR4 DRAM bundle provides software applications, probing, and hardware options for DDR4 DRAM debug, compliance validation, and analysis. The U4972A bundle includes systemization of hardware (modules installed into chassis) and software loaded onto the M9537A controller.
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Product
DDR4 SODIMM
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Small Outline Dual In-line Memory Module) is a compact type of RAM designed for devices with limited space, specifically laptops, mini-PCs, and embedded systems.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Ultra Grade SODIMM DDR4 2666/3200
SQR-SD4E
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Ultra Wide temperature natively support -40~125C, Micron original Ultra High grade IC adopted. An underfill technique to stronger PCB and IC structural, 30u" Golden finger & Locked BOM components list. Exclusive SQ Manager software to monitor and deliver real time information.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
17" SXGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-317
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Industrial-grade 17" SXGA TFT LCD with 50K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Dual channel memory slots support up to 64G in total.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Support expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G).Diverse system I/O and isolated digital I/O via iDoor technology.Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology.Support TPM2.0 hardware security.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
Interposer
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Product
Industrial Flash & Memory Solutions DDR4 Memory
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SQRAM DDR4 memory modules perform at superior speeds of up to 3200 MT/s, a 20% reduction in power consumption, and higher capacity than DDR3.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, Anti-sulfuration resistor. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ MicroATX Server Board with 4 DDR4, 4 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-586
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- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW1
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
ATCA PCIe Rugged Processor With Dual Xeon E5-26xx V4
ATC127
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The ATC127 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with eight banks of memory up to 256 GB DDR4 memory. Versatile connectivity includes two PCIe Gen3 x16 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector. Onboard mSATA storage is available for local boot.
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Product
Mini-ITX Embedded Board with AMD® Ryzen™ APU
AmITX-RZ-G
Motherboard
- AMD® Ryzen™ Embedded V1000 processor family- Up to 32GB dual SODIMM socket DDR4- PCIe x16, PCIe x1, M.2 and Mini-PCIe expansion- 4x DisplayPort
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Product
2U 20" Short-Depth Server
HPC-6240+ASMB-622
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2U 20" short-depth server with dual 3rd Gen Intel® Xeon® CPUs, 1TB DDR4, and 8 PCIe slots. A powerhouse for edge AI, HPC, and virtualization.
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Product
1U 18" Short-Depth Edge Server
HPC-6120+ASMB-610
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1U 18" short-depth edge server with Intel® Xeon® W CPU, 128GB DDR4, and 4 PCIe slots. Designed for reliable edge AI, automation, and data acquisition.
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Product
LGA1700 12th/13th/14th Generation Intel® Core™ I9/i7/i5/i3 ATX Motherboard With DP/HDMI/VGA, DDR4, USB 3.2, M.2
AIMB-788
Motherboard
Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipsetFour DIMM sockets up to 128 GB DDR4 3200Triple display DP/HDMI/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2Advantech iBMC remote out-of-band power management solution on DeviceOnAWS (Amazon Web Service) IoT Greengrass qualifiedNote 1: Legacy platform is not supportedNote 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologiesNote 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11
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Product
Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 and Xeon E3-1200 v5/v6 Processors
IMB-M43-C236
Motherboard
The IMB-M43-C236 is ADLINK's ATX industrial motherboard, supporting the 6th/7th Generation Intel Core and Xeon E3-1200 v5/v6 processor in the LGA1151 package, and the Intel C236 Express chipset, the IMB-M43-C236 supports such high-speed data transfer interfaces as PCIe3.0, USB 3.0 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz ECC or non-ECC memory up to 64 GB in four DIMM slots.
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Product
PXI Express Gen3 Controller
PXIe-3988
Controller
The ADLINK PXIe-3988 PXI Express embedded controller, based on the 9th gen Intel® Xeon® E processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications. By utilizing the Intel® Xeon® E-2276ME processor (6 cores, 12 threads) with up to 64 GB of 2666 MHz DDR4 memory, the PXIe-3988 easily performs execution of numerous independent tasks simultaneously in a multi-tasking environment.
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Product
1U Rackmount Network Appliance Platform
NA580
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The NA580 offers high reliability and performance through the LGA1151 socket Intel® Xeon® E3 and 7th/6th generation Intel® Core™ processors (codename: Skylake) with Intel® C236 chipset. The powerful network appliance supports up to 18 Gigabit LAN ports and allows system developers to configure their network solutions based on different performance requirements. Through the PCIe 3.0, the Axiomtek NA580 can integrate up to 18 Gigabit Ethernet ports. The standard configuration comes with 8 Gigabit Ethernet ports using Intel® i210 controller and supports 2 pairs of LAN bypass segments. Four DDR4 2133 MHz UDIMM sockets can provide storage of up to 32 GB and support both ECC and non-ECC memory types. To enhance reliability, this SMB network appliance platform supports data protection via 2 pairs of latch-type LAN bypass functions for fail-over option and features BIOS console redirection.
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Product
2-Ch 3.6 GHz or 4-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - 6U VPX
Model 58841
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- One-channel mode with two 3.6 GHz, 12-bit A/D- Two-channel mode with four 1.8 GHz, 12-bit A/D- Programmable DDCs (Digital Downconverter)- 10 GB of DDR4 SDRAM- µSync clock/sync for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
8G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U8GN32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
