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Product
DDR4 MSO Probes
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The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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Product
DRAM SO-DIMM DDR4 Memory
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Improve performance up to 50% (compared to SO-DDR3.) with Advantech! We offer industrial grade SO-DDR4 2666/2400/2133 memory with 30μ" gold plating connector (260 pin) featuring 1.2v low operating voltage with faster burst accesses.
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Product
16G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U16N32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
DDR4 Parametric Test Reference Solution
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Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
DRAM DDR4 Memory
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Improve performance up to 50% (compared to DDR3.) with Advantech! We offer industrial grade DDR4 2666/2400/2133 memory with 30μ" gold plating connector (288 pin), featuring 1.2v low operating voltage and faster burst accesses.
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Product
DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
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Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
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Product
15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Supports expansion via Full-size Mini PCIe and NVMe.Diverse system I/O and isolated digital I/O via iDoor technology.Supports fieldbus protocols via iDoor technology.
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Product
LGA1700 12th/13th/14th Generation Intel® Core™ I9/i7/i5/i3 ATX Motherboard With DP/HDMI/VGA, DDR4, USB 3.2, M.2
AIMB-788
Motherboard
Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipsetFour DIMM sockets up to 128 GB DDR4 3200Triple display DP/HDMI/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2Advantech iBMC remote out-of-band power management solution on DeviceOnAWS (Amazon Web Service) IoT Greengrass qualifiedNote 1: Legacy platform is not supportedNote 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologiesNote 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11
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Product
DDR4 Protocol Debug And Analysis Solution
U4972A
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The U4972A DDR4 DRAM bundle provides software applications, probing, and hardware options for DDR4 DRAM debug, compliance validation, and analysis. The U4972A bundle includes systemization of hardware (modules installed into chassis) and software loaded onto the M9537A controller.
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Product
LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
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- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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Product
8G DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-D4U8GN32-SEW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
LGA1200 10th Generation Intel® Core™ I9/i7/i5/i3 & Pentium®/Celeron® ATX With DP/DVI/VGA, DDR4, USB 3.2, M.2
AIMB-787
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Intel® 10th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q470E chipsetFour DIMM sockets up to 128 GB DDR4 2933Triple display DP/DVI-D/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2Supports Intel vPro, AMT & TPM technologiesAdvantech iBMC 1.2 remote out-of-band power management solution on DeviceOnNote 1: dTPM 2.0 module is required to enable Intel vPro and TPM technologies.Note 2: Legacy platform is not supported.Note 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11.
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Product
Space Radiation Tolerant 4GB DDR4
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This 4GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications.
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Product
DDR4 SODIMM
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Small Outline Dual In-line Memory Module) is a compact type of RAM designed for devices with limited space, specifically laptops, mini-PCs, and embedded systems.
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Product
DDR4 RUGGED DIMM
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A Rugged DIMM (Dual In-line Memory Module) is a specialized type of computer memory module designed to operate reliably in harsh, demanding environments that would cause standard commercial RAM to fail.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
16-Channel 250 MHz A/D with DDC, Kintex UltraScale FPGA - 6U VPX
Model 58131
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports two Xilinx Kintex UltraScale FPGAs- Sixteen 250 MHz 16-bit A/Ds- Sixteen multiband DDCs (digital downconverters)10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multiboard synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available
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Product
Industrial Flash & Memory Solutions DDR4 Memory
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SQRAM DDR4 memory modules perform at superior speeds of up to 3200 MT/s, a 20% reduction in power consumption, and higher capacity than DDR3.
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
Motherboard
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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Product
RAMCHECK LX DDR4 Memory Tester
INN-8686-DDR4
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The RAMCHECK LX DDR4 quickly and accurately tests and identifies DDR4 DIMMs for servers and desktops, as well as laptop SODIMMs.
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Product
Dual LGA 3647-P0 Intel® Xeon® Scalable Proprietary Server Board with 12 DDR4, 4 PCIe x16 + 1 PCIe x8+4 PCIe x4, 14 SATA3.0, 8 USB3.0, Dual 10GbE, IPMI
ASMB-975
Server Board
- Proprietary server board with dual Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 1.5TB, support Intel Optane DC Persistent Memory- 14 SATA3.0 connectors (including two M.2 2242)- Four PCIe x16 slots (Gen3) for double-deck cards- Intel® X557-AT2 dual 10GbE ports- 0 ~ 40 °C ambient operating temperature range
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Product
8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - 3U VPX
Model 5950
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- Now available in RFSoC Gen 3 with the Model 5953- Multi-board synchronization with Quartz RFSoC video- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6001 QuartzXM- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX
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Product
4-Channel 200 MHz A/D with Multiband DDCs, Kintex UltraScale FPGA - 3U VPX
Model 52862
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Four 200 MHz 16-bit A/Ds- Four wideband DDCs and- 32 multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x4- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Intel® Core™ I Automation Computer With 2 PCI(E) Expansion Slots
UNO-3283G
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6th Generation IntelR Quad Core Processors with 8GB DDR4 Memory2 x GbE, 6 x USB 3.0, 2 x RS-232/422/485, 2 x RS-232 (pin header), 1 x DVI-I, 1 x HDMI1 x PCIex16, 1x PCI, 2 x mPCIe (2 x full), 1x CFast slot, 1 x mSATA slot (optional)Thumb screw for easy maintenanceHot-Swappable HDD/SSD support for RAID 0/1Easily exchangeable RTC batterySupports Fieldbus Protocol by iDoor TechnologyChassis Grounding ProtectionLAN Redundancy (Teaming)
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Product
8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - PCIe
Model 7050
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- Now available in RFSoC Gen 3 with the Model 7053- Supports Xilinx® Zynq® UltraScale+" RFSoC FPGA- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2, and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional front panel dual optical MPO interface for gigabit serial communication- Unique QuartzXM eXpress Module enables migration to other form factors- Navigator BSP® for software development- Navigator FDK® for custom IP development- Free lifetime applications support- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
32G SO-DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-SD4U32N32-SBW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
12.1" Panel PC With 8/9th Generation Intel® Core™ I/Celeron® Processor
PPC-6121
Panel PC
12.1" TFT XGA LCD panel with resistive touch control8/9th generation Intel® Core™ i/Celeron® processor (thermal power design: 35W)2 x 260-pin SO-DIMM DDR4 2666 MHz (max. 32 GB)1 x M.2 2230 (E key)1 x mSATA bay (SATA SSD + mSATA support RAID 0&1)1 x Optional TPM2.0 & 1 x Optional PCI/PCIe x4 expansion kit1 x Isolated RS422/485 (terminal block)1 x VGA and 1 x HDMI
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Product
SOM Module
TEO820-ZU2CG
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784EZU2, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
