-
Product
JD Edwards Load Testing
Dimension LoadTest
-
Dimension LoadTest™ is a powerful yet easy to use load testing tool for JD Edwards EnterpriseOne applications. DWS have designed Dimension LoadTest such that any experienced System Administrator/CNC should be able to setup, create, run and monitor load tests to effectively stress test JD Edwards EnterpriseOne applications.
-
Product
High Voltage Surge Testers
HVST
-
The most important features of the surge tester are its ability to test the entire winding insulation system. A high voltage surge generates turn to turn, coil to coil, and phase to phase voltage stress, as well as ground insulation stress. When used as a dielectric test, accurate voltage readings are essential. The HV Surge Tester monitors the voltage directly across the winding under test. This voltage is displayed on an oscilloscope and recorded on the Pass/ Fail LED latch monitor. This voltage will be accurate despite the impedance of the winding being tested. The insulation system can be tested way above the operating voltage because of the brief duration of the applied voltage test pulse. This allows faults to be detected long before they become apparent at operating conditions.
-
-
Product
Strain Measurements and Experimental Stress Analysis
-
Experimental structural testing using strain gauges is necessary in a wide range of applications from airframes and sub-assemblies down to individual components such as turbine blades, satellites, wind turbines, buildings, bridges and many others. These tests enable the engineers to compare the acquired data with the predicted results from the design calculations.
-
Product
Wafer Bonder
AML
-
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
-
Product
2210A & 2211A Quartz Frequency Standards
-
Precise Time and Frequency, Inc.
The ptf 2210A Quartz Frequency Standard has been designed to provide a highly stable and spectrally pure frequency reference for applications requiring the ultimate in short term frequency performance.The instrument contains a double oven controlled stress compensated (SC cut) quartz crystal oscillator (OCXO) to give the ultimate in performance.Ideal for laboratory or system use, the unit provides good stability performance at lower cost and with improved phase noise.
-
Product
Digital Shore C Rubber Hardness Tester
HS-C
-
Shenzhen Chuangxin Instruments Co., Ltd.
HS-C is a digital micropore hardness, is for the foamer rubber and plastic microporous material when the compression rate is 50%and the stress is more than 0.5 kg/cm
-
Product
kSA MOS
-
Measure and provide feedback for curvature, stress, reflectivity and growth rate to improve production processes and increase profitability with the kSA MOS.
-
Product
Missile Systems
-
IES Systems is a turnkey test system solution provider with proven experience in Acceptance Test Procedure (ATP) testing, Highly Accelerated Stress Screening (HASS) and Environmental Stress Screening (ESS) testing.
-
Product
Accelerated Product Life Cycle
-
Delserro Engineering Solutions
Under normal conditions it may take years to gather failure data on the life cycle of new products. Through accelerated life testing the overall time to failure can be reduced to weeks by increasing the frequency of the field loads and by removing insignificant stress components. In addition, life cycle testing on a product can be reduced or accelerated dramatically by increasing the stress levels to higher than normal. Putting a product through Accelerated Life Testing can reduce test time from weeks to days while still achieving satisfactory results saving both time and money.
-
Product
Polarization Tester
-
Polarization Tester is used to measure the stress value of optical glass, glass products and other optical materials, and is widely used in pharmaceutical companies, glass products factories and laboratories.
-
Product
Air Core Current Limiting Reactors
-
Current Limiting Reactor (CLR) is one of the most effective short circuit current limiting devices. It reduces stresses on busses, insulators, circuit breakers and other high voltage devices. Use of CLR is the most practical and economical approach at current limiting.
-
Product
Stylus Profilometry
Dektak®
-
Bruker's Dektak stylus profilers are the product of over four decades of proprietary technology advances. They provide repeatable, accurate measurements on varied surfaces, from traditional 2D roughness surface characterization and step height measurements to advanced 3D mapping and film stress analyses. Dektak surface profilers have been widely accepted as a superior solution for measuring thin film thickness, stress, and surface roughness and form in applications ranging from educational research verification to semiconductor process control.
-
Product
Round Wire Coil Inductors
-
Round wire coil (RWC) inductors come in six platform sizes and enable the highest efficiency of any SMT inductor through the use of a low loss ferrite core material which minimizes AC losses and also eliminates thermal ageing. The use of round magnetic wire instead of rectangular flat coils enables a lower cost while still maintaining a low DCR and small footprint. The platforms have passed the AEC-Q200 stress test qualification proving the designs robustness and suitability to difficult environments but the parts are not IATF certified. The platform range from 7.6×7.4×6.4mm to 26x26x15mm and are suitable for a wide range of applications and markets including communications, computing and industrial.
-
Product
Impact Test Apparatus
IT-50
-
Impact test is an essential physical test prescribed in many standards to test samples for mechanical shock. It is designed to perform such tests. The test is carried out to ensure that the test items have adequate mechanical strength to withstand the stresses and rough handling imposed during installation and use. It is adapted to test various types of electrical accessories such as switches, sockets, plugs, starter seats and other electrical appliances.
-
Product
HAST Accelerated Aging Test Chamber
-
Sanwood Environmental Chambers Co ., Ltd.
Sanwood is glad to be the ODM/OEM manufacturer of HAST chamber,HAST aging test chamber,HAST test chamber, HAST aging test chamber Accelerated Stress Test Chamber,High-pressure accelerated aging test sales enterprises all over the world!
-
Product
Cellular Base Station Factory Test Systems
-
*Factory Test System*Designed and Built by BCO*100% Functional Testing*Environmental Stress Screening Testing
-
Product
Non-rotating Spindle Type Outside Micrometer
-
Non-rotating spindle type standard outside micrometer No rotation stress is provided to a workpiece.
-
Product
Software
Production C-V Measurement
-
Materials Development Corporation
The production software offers a streamlined C-V plotting and bias-temperature stress program with minimumoperator input. A single keystroke begins the measurement.
-
Product
Type T Deadweight Tester
-
AMETEK Sensors, Test & Calibration
The Type T tester is a dead weight tester that offers laboratory accuracy in an instrument designed to withstand an industrial environment or daily stresses of a manufacturing environment. Each tester features a re-entrant type measuring piston and cylinder assembly.
-
Product
Unclamped Inductive Load Tester
ITC75300
-
The ITC75300 is a 400 amp version of the ITC75100 which performs ruggedness testing of power MOSFET’s, IGBT’s and diodes that conforms to MIL-STD-750 method 3470 by stressing them to controlled energy levels, accomplished by the devices driving an unclamped inductive load. Improved Test Specifications allow complete control of test parameters.
-
Product
Fuel Cells
-
continuously variable contact pressure ensures complete reproducibility of the test conditions ● independent of the thickness of the fuel cell components due to the self-adjusting piston and special sealing concept ● no connection and disconnection of hose- or cable connections for the exchange of cellFixture necessary ● fast &Easy clamping of the cellFixture without tools and precise exchange of the internal cell components ● maximum power density by determining the optimal contact pressure on the active cell surface ● developed for high stress in the field of quality assurance and laboratory environment
-
Product
Package Handling Test
-
This test subjects packaged items to the stresses encountered during handling, transportation and storage. The tests consist of drop tests, storage tests such as stacking and compression, temperature tests and transportation vibration tests.
-
Product
Walk-In Aging Chamber
-
Aging Chamber has been designed to simulate environmental condition to test the stability and reliability of products under stressed environment. Weiber is a leading manufacturer and supplier of Aging Test Chamber in India and abroad. Weiber offers scientific equipments at the most economical rates and versatile design. Microprocessor based Aging Test Chambers are made in accordance with the international testing standards. The equipments are NABL, NSF certified and CE approved. Aging Chamber maintains 25% to 95 % RH. The Test Chamber is digitally controlled delivering accurate result under controlled environmental conditions.
-
Product
Biased and Unbiased HAST Testing
-
Considered within the semiconductor industry as the fast and effective alternative to Temperature Humidity Bias testing (THB), Highly-Accelerated Temperature and Humidity Stress Test (HAST) is a critical part of the device package Qualification process and is used to evaluate the reliability of non-hermetic packaged devices in humid environments.
-
Product
ICAP/4Windows
-
An extensive SPICE toolset for extensive circuit design. Includes everything for analog and mixed-signal circuits, less ICAP/4's Smith chart, Library Manager and model generation tool (SpiceMod). Contains newly enhanced analyses for advanced design verification, design pass/fail measurement capability and automated component stress alarms.
-
Product
Tensile Test Chamber
-
CSZ's Tensile Test Chamber is an environmental chamber that interfaces with a customer tensile tester load frame. This chamber is required to expose various materials and components to temperature conditions while undergoing tensile test. Tensile testing stresses materials by pushing, pulling, twisting, or bending intended for static and fatigue testing.
-
Product
Thermal Shock Environmental Test Chamber
-
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Thermal Shock Chamber provide the sudden temperature changes between extreme cold and extreme hot from -65℃ to 150℃ (customized available), specially for environmental stress screen test of the industries that rely on thermal testing, such as component, board electronic assemblies, defense, material stress, consumer products etc. The thermal shock test can cause faulting or cracking by the expansion and contraction on the products, indicates the hidden manufacturing defects. Bell’s Thermal Shock Chamber ensure you to launch qualified product to the market.
-
Product
Copper Diffusion TestSystems
-
Materials Development Corporation
MDC announces the addition of software and hardware for copper diffusion studies to its CSM/Win suite of semiconductor test systems and software. This new CSM/Win feature plays an important part in the development of processes and materials for the next advance in integrated circuit technology that employscopper as a conductor. Special Current-Voltage Bias-Temperature Stress (IV-BTS) software can measure the degradation of insulator quality due to copper diffusion.Multiple test sites can be stressed with a constant voltage while the current through each site is measured and recorded. The Current-Voltage Bias-Temperature Stress test supplements conventional MOS C-V measurements and Triangular Voltage Measurements (TVS) that are also employed in copper diffusion studies.
-
Product
Fiber Acceptance Test Kit
23005
-
The unique design of the splice accommodates either 125um or 140um fiber and any size buffer up to 900um. The precision made splice holder firmly holds the pigtail in position without causing stress on the fiber. The low viscosity index matching liquid has an indefinite shelf life and allows for an easy glide of the bare fiber into the splice. Within seconds, a fiber acceptance reading can be made with an OTDR or test set. Low loss with minimum back reflection can easily be achieved for more accurate signatures. Other applications for this kit: splice training aids, bare fiber adapters, and temporary splicing.
