3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D Bundle
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Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
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Borehole 3D Geophones
GFA 50/100
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3D borehole geo-phone is realized with 3x high sensitive geophones (nat.freq.10 Hz- 1 vertical and 2 horizontal sensors) oriented according to a triad of orthogonal Cartesian axes XYZ. Delivered with a cleat assembly to sustain its weight at the requested depth (GFA cable is graduated in meters), this borehole geophone has a pneumatic-mechanical clamping system.
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Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
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Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
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ATD 3D Layout Machine
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ATD Model is consisted of 2 main body and one cast iron surface plate for marking work and 3D measruing.
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3D Image Processing Software
EyeVision
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EyeVision is the base for numerous measurement and inspection tasks in image processing. Features are: Creation of inspection programs with drag and drop function. EyeVision supports all hardware platforms such as; Smart Cameras, Vision Sensors, PC & Embedded support.
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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3D Solder Paste Inspection
aSPIre 3
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Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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3D Form Measurement
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Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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3D Sound Intensity Analysis Software
DS-0225A
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Finding out the position where the noise is occurring, and grasping the state of acoustic propagation are important ways to find effective noise countermeasure or improvement of acoustic environment.
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3D Profile Sensor
Z-Trak2
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Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Teledyne PDS Liteview Freeware 3D Viewer for PDS Data Files
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Teledyne PDS LiteView is a freeware 3D viewer that can be used to view Teledyne PDS data files. The viewer will read the Teledyne PDS logdata files, grid model files, 3D design model files and GeoTIFF files. The multibeam and laserscanner data will be extracted from the logdata files and will be visible in the viewer.
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Detailed Stereo Image Analysis with 3D Visualization
StereoScope Pro
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StereoScope Pro is a real time stereo field analyzer with multiple views and MIDI/automation output capabilities. It is a powerful help to analyze how the audio signal is spread in the stereo field, and you can easily detect potential phase and mono compatibilities issues.
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3D EarthWork Estimation Software
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ScienceGL offers virtual cut-and-fill excavation software for earthwork and material takeoff estimation. The software is based on latest 3D technology that lets you to accelerate your construction earthwork estimation. The most natural perception of the whole cut-and-fill process makes your job faster, easier and more accurate. Unlike of the standard software packages for estimation we provide you new realistic "virtual presence" interactive environment. Powerful estimating package for construction earthwork and material quantity calculations.
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Non-contact 3D Optical Profilers
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LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
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3D X-ray hybrid inspection system
YSi-X
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Ideal for 100% inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target. X-ray, optical, infrared, and laser height measurement as standard equipment; hybrid and high reliability with multiple inspection modes.
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3D Ground Penetrating Radar data processing & Interpretation software
Condor
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Condor is modern processing, visualisation and interpretation software for the efficient management of Raptor 3D GPR array data.Boost performance and improve workflows.- Efficient sub-surface imaging- Effective workflows- Simple and intuitive- Dedicated to processing Raptor data- Modern Windows software (64-bit)
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3D Audio Servers
GoldSeries
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AuSIM offers a growing number of prepackaged configurations, designed to meet a broad spectrum of R&D and deployment needs. These standard packages are generically called GoldSeries, and have a range of options to tune them to the needs of a specific project. If none of these are appropriate to your application, AuSIM will gladly develop a custom package for your specialized needs.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
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Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Make Your 3D Control Smarter
VALUE ADDED SOLUTIONS
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At Metrologic Group, we always seek to be a problem-solver for industrial manufacturers and quality assurance professionals. That is why, we continuously develop improvements of our software and complementary solutions to respond or even outreach customer expectations.
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Trusted Platform Module Compliant With TCG 1.2 / 2.0 Specification And TCG Software Stack 1.2 / 2.0 Via SPI Connector On CPU Card.
PCA-TPMSPI
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Trusted platform module compliant with TCG 2.0 specification and TCG software stack 2.0 via SPI connector on CPU cardHardware based data protection solution for storage device encryption and decryptionDimensions (L x H) : 20 x 22 mm (0.79" x 0.87")Support Model: PCE-5033/5133
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-03
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Ensenso 3D Cameras
X Series
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Imaging Development Systems GmbH
The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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3D CT Micro-Tomography And High Resolution Digital Radioscopy
DeskTom
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Compact system with no maintenance. 5 motion axis. Small footprint.
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FieldMaster 3D
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Field analyzer for low-frequency fields, selective and wide-band measurement simultaneously on all three axes. The sensor plates have a high-quality GOLDSCHICHTUNG, so that the calibration is guaranteed as long as possible despite harmful environmental influences.
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Area Scan 3D Camera
3D-A5000 Series
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Cognex’s 3D-A5000 series is an area scan 3D camera designed to capture high-resolution 3D images. It features 3D LightBurst technology which rapidly acquires images to maximize throughput. High-resolution 3D images combined with industry-leading Cognex 3D vision tools enable reliable and accurate solutions to applications such as assembly verification, in-line measurement, and robotic guidance.
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Economy 3D Scanners
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Cost-effective 3D scanners with high-end technology, provide you with 3D scanning capabilities to fit within your budge
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3D Measuring Laser Microscope
LEXT OLS5000
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The OLS5000 laser confocal microscope precisely measures shape and surface roughness at the submicron level. Data acquisition that's four times faster than our previous model delivers a significant boost to productivity. Measure samples that are up to 210 mm tall. Capture the shape of any surface. Total magnification: 54x - 17,280x
