3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D Scanners
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The process of analyzing a real-world object or environment to collect three dimensional data of its shape and possibly its appearance (e.g. color).
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Time-of-Flight 3D Camera with IP67 Protection Class, Sub-Millimeter Precision
LUCID Helios2
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Time-of-flight camera with IP67 protection class;Dust and water resistant; HDRmodel available ! Sony DepthSense IMX556 CMOS sensor; Resolution 0.3 MP 640 x 480; Frequency: 30 frames / s; Price: $ 1,645.00.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
Interface Module
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Inspection System for high-power precise 3D X-ray CT
X-eye PCT225
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Inspection System for 3D X-ray CT able to analyze defected area precisely by precise movement of axis with high polished Anti-vibration table. High-power X-ray Tube of max. 450kV and large area Flat Panel Detector of max.16 inches can be installed depending on the sample. Customized 3D CT equipment is available with selecting main parts by customers depends on their needs for size and material.
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Reverse Engineering 3D Scanner
peel 3.CAD
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peel 3.CAD is your go-to fully integrated 3D scanning solution for all your reverse engineering needs. Extract all the information you need and send them right to your preferred CAD software.
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3D Optical Profiler
Nexview™ NX2
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Designed for the most demanding applications, the Nexview™ NX2 3D optical profiler combines exceptional precision, advanced algorithms, application flexibility, and automation into a single package that represents ZYGO's most advanced Coherence Scanning Interferometric (CSI) profiler.
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3D Sensors
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*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
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OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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3D Guidance®
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The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.
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3D Scanning Reverse Engineering Services
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Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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3D Building Scanning Services For Existing Conditions
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Trusted by industries across USA, Tejjy 3D laser scanning company facilitates high-resolution reality capture of as-built data. Our on-site 3D scanning professionals gather accurate measurement with quality point clouds of as-built condition. We facilitate precision of 4-6 mm approx. in field measurement for renovation, surveying, facility management, digital twin, heritage preservation as per client requirements.
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High-Resolution 3D Seismic Solution
PIKSEL
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PIKSEL is an integrated and compact solution that enables high-resolution seismic data acquisition in targeted areas for offshore construction and field development.
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3D Design
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Rapid Design Exploration. Created for design engineering workflows, our intuitive product design software generates a fast user experience. Rapid design exploration includes detailed insight into real-world product performance. Live physics and accurate high-fidelity simulation combine into an easy-to-use interface that supports faster-time-to-market.
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Precise 3D Profilometry
µscan
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Using the NanoFocus µscan technology, you can measure up to 100 times faster than with conventional probe systems. Various µscan sensors are available for the different application areas. The optical profilometers of the µscan series are suitable for the fast scanning of surface profiles with precision in the low nanometer range.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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SPI | AOI | AXI
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Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
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Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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3D Surface Texture Analysis Software
TrueMap 6
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Rendering styles: solid, wireframe, wireframe + pointsFull control of surface lighting, including direction, and ambient shadingRendering options including side walls, grid lines, and countour linesEdit the z exaggeration to help visualize surface deviationsRender the axes labels relative to the surface mean, maximum, minimum, or unchanged from the values stored in the fileRender the surface using a gradient to represent the surface heights, or use a solid color, or even use the true color values from the data file if they are availableMultiple options for gradients and even an optimization feature to use the height distribution
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3D Compliance SAR System
cSAR3D
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Schmid & Partner Engineering AG
cSAR3D is our newest and most advanced system for fast, high-precision SAR measurements of wireless devices. We have realized a system concept that has been developed over the last years to meet the demands of our highly valued customers. The system uses a novel sensor concept and advanced reconstruction algorithms. The measurement system has high absolute accuracy due to the determination of all field components in a large region of the head and body phantoms.
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Low Speed Protocol Decode/Trigger Software (I2C, SPI, RS232, I2S, JTAG)
D9010LSSP
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This bundle includes powerful decoding and triggering for the following serial bus standards: I²C, SPI, Quad SPI, eSPI (including Quad eSPI), RS232/UART, Manchester, I²S, SVID, and JTAG (IEEE 1149.1). It is compatible with S-Series, V-Series, Z-Series, EXR-Series, MXR-Series, UXR-Series, 9000 Series, and 90000 Series Infiniium oscilloscopes. For detailed information on the decode and trigger settings, please refer to the datasheet.
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3D Scanners
Pro
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Capable of scanning objects of different shapes and sizes by changing the scanner's field of view (FOV). Due to the use of the structured light technology, professional RangeVision 3D scanners provide highly detailed scans of any type of object, from jewelry to large automobiles, with accuracy up to 0.018 mm and resolution up to 0.03 mm.
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3D Micro Coordinate Measurement Machine and Surface Roughness Measurement Device
InfiniteFocusSL
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With the InfiniteFocusSL you are able to measure form and roughness of your components with only one system. In addition, color images with high contrast and depth of focus are achieved. The robust frame and the intelligent illumination technology provide fast and high-resolution measurement in the laboratory and a production near environment. The measurement system is particularly attractive due to its cost effectiveness, measurement speed and usability. The long working distance in combination with the above average measurement field allows a wide range of applications. Measurements are achieved within seconds, and features, such as a coaxial laser for quick and easy focusing, enhance its usability.
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TTL/I2C/SPI Expansion Kit
OP-SB85L
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OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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DIgital 3D Image Correlation System
Q-400
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The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.The Q-400 system is used for determination of three-dimensional material properties in tensile, torsion, bending or combined tests. In addition, deformation and strain analysis can be applied to fatigue tests, fracture mechanics, FEA validation, and much more.
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Small Fanless 3D Control FAYb Laser Marker
LP-M Series
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Panasonic Industrial Devices Sales Company of America
The LP-M series offers a small, fan-less head design with an IP64 protection to prevent dust and water entering from any direction. The 3D Control capability allows marking on various types of products and complicated shapes to meet a large number of application needs. - 20, 50 & 100 Watt Models- Compact IP64 Rated Head- Full 3D Features- Auto Focus capable- Redundant Safety Features
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Process Improvement Software for SPI & AOI
SIGMA Link
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SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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Make Your 3D Control Smarter
VALUE ADDED SOLUTIONS
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At Metrologic Group, we always seek to be a problem-solver for industrial manufacturers and quality assurance professionals. That is why, we continuously develop improvements of our software and complementary solutions to respond or even outreach customer expectations.
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3D Automated Optical Inspection System
EAGLE 3D 8800 SERIES
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EAGELE 3D 8800 AOI applies 8-way projection for 3Dmeasurements to all models, minimizing shadow effectserrors and performing 100% 2D&3D examinations simultaneouslyin all FOV areas.
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3D Flexible Scanner
HDI Advance
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The HDI Advance 3D scanner offers the flexibility of scanning objects of different shapes and sizes. Simply move the camera positions to change the scanner’s field of view (FOV). The 3D scanner comes with three preset camera slots to quickly modify the field of view from 165mm up to 600mm, depending on the scanner model.
