Metrology
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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Product
OCD Solutions
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Onto Innovation’s OCD technology offers powerful OCD modeling and advanced machine learning capability, as well as next-generation real-time regression, offline sensitivity analysis tools and comprehensive GUI and structure input for true multi-variant modeling. Both the Ai Diffract and SpectraProbe software packages deliver advanced capabilities in intuitive and easy to deploy hardware form factors.
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Unlisted Product
Film Analysis System
NanoSpec® II
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Extending the range and performance of the industry proven NanoSpec series, the NanoSpec II introduces a new design with automated sample alignment, fast autofocus and measurement repeatability better than 1Å*. The system can be incorporated with Onto Innovation’s spectroscopic reflectivity analysis software, image processing for automated pattern alignment and various optical configuration options, making the NanoSpec II automated the most powerful thin film system in its class.
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Product
Metrology System
IMPULSE V
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With tighter wafer-to-wafer and within-wafer uniformity tolerances, integrated metrology systems are in use across various semiconductor processing steps. Based on demonstrated high-resolution optical technology, the IMPULSE V system provides higher sensitivity to thin film residue measurements during the CMP process. The IMPULSE platform boasts the industry’s most reliable hardware with best-in-class reliability and productivity metrics.
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Product
Metrology System
Atlas V
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The new Atlas V metrology system is designed to measure several key steps that include buried features, not visible by CD-SEM and other techniques. Through remarkable improvements in the optical systems, mechanical sub-systems and software algorithms, the Atlas V system can precisely measure the very subtle variations for device parameters and reveal weak process corners for engineers to improve their process robustness in the fab.
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Product
Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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Product
Metrology System
IVS
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The IVS 220 system is the latest generation in the IVS series and has been designed for ultimate precision, TIS (tool induced shift) and throughput on 200mm wafers. The cornerstone of the system’s reliability and stability is its mean time between failure (MTBF) of 2,100 hours. The IVS 280 provides the same capability in a package designed for overhead track handling with full E84 GEM300 capability.
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Unlisted Product
Metrology System
Iris
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The Iris series is targeted to provide our customer the best cost-of-ownership with a dedicated application-specific optical configuration for HVM applications in semiconductor manufacturing.
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Product
Metrology System
Echo
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The Echo system is a comprehensive in-line metal film metrology tool for single and multi-layer metal film measurements in leading-edge logic, memory, advanced packaging, and specialty semiconductor devices.
