Grypper (Zero Footprint)
*No lid required
*Socket same size as device
Topics
-
Unlisted Product
0.35mm-0.5mm Pitch Net Zero Package Footprint Test Sockets for BGA Style Packaged Devices
Grypper G35 / G40
-
Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test.
-
Unlisted Product
0.65mm + Pitch Net Zero Package Footprint Test Sockets for BGA Style Packaged Devices
Grypper G80 / G80 LIF
-
Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test
-
Unlisted Product
Medium Insertion Count With Sliding Lid, Surface Mountable Near Zero Footprint Sockets for 0.35mm+ Pitch BGA Devices
Grypper "Y"
-
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
-
Product
Grypper G35 / G40
-
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
-
Product
Grypper
Grypper
-
*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to or smaller than the IC package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
-
Product
Grypper G80 / G80 LIF
-
*Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*No lid required: The package snaps directly without a lid, enabling easy probing, scoping and troubleshooting the topside of the device*Excellent signal performance: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection
Filter Products:
-
Unlisted Product
0.35mm-0.5mm Pitch Net Zero Package Footprint Test Sockets for BGA Style Packaged Devices
Grypper G35 / G40
-
Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test.
-
Unlisted Product
0.65mm + Pitch Net Zero Package Footprint Test Sockets for BGA Style Packaged Devices
Grypper G80 / G80 LIF
-
Package-size PCB footprint: Since the PCB footprint of G80 is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test
-
Unlisted Product
Medium Insertion Count With Sliding Lid, Surface Mountable Near Zero Footprint Sockets for 0.35mm+ Pitch BGA Devices
Grypper "Y"
-
Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
-
Product
Near Zero Footprint SMT Spring Pin Sockets
-
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
-
Product
DDR
-
These sockets are designed for standard DDR & GDDR type devices, including the newer configurations.
-
Product
eMMC
-
These sockets are specifically designed for standard 153 & 169 Ball eMMC devices. Custom probing sockets also available.
-
Product
LPDDR
-
A large number of LPDDR sockets have been developed to cover the wide variety of ball I/O configurations. This catalog supports the JEDEC 209 Standard configuration.
-
Product
ONFi
-
Open Nand Flash Interface (ONFi) specify a unique package & I/O configurations. This catalog covers the variations within the ONFi specifications.
