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Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Semi-Automatic Probe Station
P300A
The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Hot Chucks
Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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Thermal cameras
SKF Condition Monitoring Center
Using an SKF Thermal Camera is a proactive way to help you detect problems before they occur, increasing uptime and improving safety. They allow you to be able to visualise potential problems, invisible to the naked eye, by presenting a picture of the heat distribution of an asset. The thermal image, presented on a large LCD screen, shows you where the temperature is either too hot or too cold allowing you to pinpoint potential problems fast.
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Thermal Imaging
Omega's thermal imaging products are designed for non-contact temperature measurement with the unique feature to see temperature gradients. Some can capture images and measure multiple spots.
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Thermal Cameras
Megger's thermal cameras are professional and easy-to-use, and provide fast accurate readings.
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Thermal Management
Get efficient and reliable heat management and humidity control solutions geared to your specific size, location and business goals.
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Air and Thermal Management
Honeywell Aerospace Technologies
Honeywell's range of electronic and electro-pneumatic systems for air and thermal management are proven to deliver highly reliable and efficient operation with lower total costs of ownership for aircraft operators.
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Thermal Security Camera
Elara™ FC-Series O
The Elara™ FC-Series O thermal security camera is one of FLIR’s premium thermal security cameras for perimeter protection. The Elara FC-Series O integrates with external video analytics devices, such as FLIR’s TRK or third party solutions, to classify human or vehicular intrusions. The Elara FC-Series O also offers a wide range of high-performance lenses, with a choice of resolutions, offering greater flexibility for tailoring security systems to specific site conditions.
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Thermal Imager
testo 865
The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
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Thermal Bullet Camera
Elara™ FB-Series O
The compact FLIR Elara™ FB-Series O thermal security camera delivers industry-leading thermal imaging for perimeter and wide area protection around the clock. The camera also offers "plug-and-play" compatibility with external video analytics and major VMS suppliers, including FLIR United VMS, for additional functionality and a flawless user experience.
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Fixed-Mount Thermal Camera
FLIR A50/A70 Image Streaming
FLIR A50 and A70 Thermal Image Streaming Cameras are the right choice for users who want camera control capabilities and image streaming over Ethernet, as well as flexibility to perform analytics and raw data collection on thermal characteristics using preferred software applications. With options for Wi-Fi, an integrated visual camera, compressed radiometric image streaming, and ONVIF S compatibility, these small and lightweight fixed-focus automation cameras will optimize process control and quality assurance to improve yield, product quality, through-put time, and lower costs.
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Thermal Management
Our air cooling components dissipating heat to the ambient air comprise high-performance heat sinks, general purpose DC fans and AC fans for forced air ventilation, as well as filter fans with exchangeable exhaust filter inserts that ensure clean and reliable air exchange in cabinets.
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Thermal Conductivity Analyzer
TCi
The default C-Therm TCi Thermal Conductivity Analyzer employs the Modified Transient Plane Source (MTPS) technique in characterizing the thermal conductivity and effusivity of materials.
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Thermal Division Overview
MPI Thermal is a division of MPI Corporation. With over 60 years of combined thermal control system experience with our international engineering teams, this has brought about a comprehensive product portfolio of thermal air stream systems for today's manufacturer's environmental test chamber needs.
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Fluids And Thermal
Whether you’re an analyst performing advanced computational fluid dynamics (CFD) modeling or a design engineer who quickly needs to understand fluid or thermal effects on a design proposal, Altair offers a complete line of tools to support your project. From detailed component analysis to full systems performance, Altair provides a range of scalable solvers under Altair CFD™, as well as robust pre- and post-processing software for CFD.
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Thermal Imagers & Systems
Advanced Energy’s turn-key thermal imagers and systems accurately measure temperature and use reliable infrared technology. These high-tech instruments can precisely determine the temperature and temperature distribution of small and fast-moving objects.
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Thermal Shock Testing
Quest Engineering has the capability that you've been seeking to perform thermal shock on a wide array of units. Using our specially designed Thermal Shock Chamber which works like a turnstile to shuttle units between extreme hot and extreme cold conditions.
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Thermal Quad Scanner
Thermal Quad Scanner has the Highest Isolation of any 4-Terminal Scanner and operates at up to 1000V. With a Guildline model 6664C scanner and software, hard-to-make high ohm measurements (up to 100 GΩ) can be automated and scheduled at any time that is convenient to the metrologists, even at night and over the weekends.
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Field thermal needle system for thermal resistivity / conductivity measurement
FTN01
Hukseflux Thermal Sensors B.V.
The FTN01 Field Thermal Needle System allows performing fast, on-site measurements of the thermal resistivity or conductivity of soils, in particular around the typical depth of burial of high voltage cables. FTN01 is designed with a focus on robustness and saving time, while still offering sufficient accuracy for typical field measurements. The sensor is a Non-Steady-State Probe (NSSP), TP09, which is mounted at the tip of the Lance LN01. The system is operated using a hand-held Control and Readout Unit CRU01.
