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Geometry
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Front-end
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Day Camera Testing
CI Systems' CCD test stations are used to carry out all the necessary tests to verify and compare the quality of a CCD based camera. These stations are based on CI Systems' reflective collimators, Visible Radiation Sources, special targets and integrated software, to project standard patterns with known geometry and intensity to the Unit Under Test. As a result, these stations are turnkey solutions for the CCD camera testing needs.
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3D Sensors (Main Screen)
surfaceCONTROL
surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as shape deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.
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3D Form Measurement
Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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UltraScan VIS Spectrophotometer
Hunter Associates Laboratory, Inc.
The UltraScan VIS easily measures both reflected and transmitted color as well as transmission haze and meets CIE, ASTM and USP guidelines for accurate color measurement. UltraScan VIS uses diffuse/8° geometry with automated specular component inclusion/exclusion. For transmission measurement, the use of a robust CIE-conforming sphere instrument (TTRAN Total Transmission mode) effectively negates the effects of minor scattering typically found in transparent samples.
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Correlation Analysis
EDM Modal Correlation Analysis allows the user to correlate two modal models; EMA and/or FEA models. Comparing the experimental data with that acquired through finite element analysis helps in validating the test results. Users can import the geometry model and mode shape data from FEA or EMA software.
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Turret Kelvin Test Contactor
cHybrid
cHybrid™ Kelvin contactor contains a new and unique contact spring architecture which allows the test socket to adapt to challenging IC pad geometry requirements of todays and future small package types. Great lifetime up to 3 million touchdowns, with best-in-class contact resistance repeatability reduces cost of test significantly. A multi-beam contact structure optimizes signal integrity and current capability according to challenging electrical test requirements.cHybrid Kelvin contactor with multi-beam contact spring architecture delivers improved yield and long life minimizing cleaning cycles. This innovative solution will help customers reduce cost and maximize productivity.
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XRD System
SmartLab®
SmartLab includes as standard Rigaku's patented Cross Beam Optical™ (CBO) technology. CBO technology uses simultaneously mounted, simultaneously aligned optical components for both focusing (Bragg-Brentano) and parallel beam diffractometer geometries. Users can switch between the two geometries without the need to remove, replace, or realign optical components.
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Benchtop Sphere (d/8°) Geometry Spectrophotometers
Hunter Associates Laboratory, Inc.
Diffuse d/8° benchtop sphere spectrophotometers are recommended for transmittance color and haze measurements of transparent liquid and solid samples, and color measurements of opaque samples where it is desired to negate the effects of sample gloss and texture, as is necessary in the color formulation process when determining the effect of pigment variations irrespective of surface characteristics.
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Impedance Measurement
CITS880s
Finer geometries and thinner copper can present a challenge for fabricators measuring impedance on leading edge PCBs. The CITS880s answers that challenge with the introduction of Launch Point Extrapolation (LPE). LPE extrapolates the TDR response back to a point close to the start of the transmission line effectively allowing to users more accurately to measure the instantaneous or incident impedance of the line.
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Probe Positioners (Probe Manipulators)
PacketMicro offers a broad ranges of probe positioners to allow designers to guide standard oscilloscope/TDR/RF/microwave probes onto the small geometries of fine-pitch interconnects, SMD packages, MCMs, hybrids and ICs.
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3D Roughness Measurement System
IF-Profiler
The If-Profiler is a handheld 3D roughness measurement system for high resolution measurement of surface finish. You measure roughness of flat and curved components with only one system. Measurements are performed both profile based (ISO 4287) and areal based (ISO 25178). The measurement system achieves flexible measurements and applications at high measurement speed. Various positions and measurement fields are traceably and intuitively measured. The IF-Profiler is also used to measure geometries with steep flanks and various coatings.
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Refractive Index Profiler
S14
The S14 Refractive Index Profiler complements optical fiber preform analysis measurements by providing highly accurate and precise characterization of the refractive index profile of drawn single-mode, multimode, and specialty fibers using the RNF (Refracted Near Field) technique. The S14 index profile data produces fiber geometry information directly. Manufacturers can also use S14 data for the prediction of fiber transmission parameters such as mode field diameter, cut-off wavelength, and chromatic dispersion.
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Step Probes
*Precisely controlled probe travel*Step tip geometry*Replaceable and non-replaceable versions*Plating options available
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Straightness Measurement Kit
55283A
The Keysight 55283A Straightness Measurement Kit, used with the Keysight 5530 Laser Calibration System, makes straightness, squareness and parallelism measurements to identify geometry errors that seriously degrade machine tool performance. These measurements allow documentation, analysis and diagnosis of machine tool travel and parallel axes of motion.
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TDR Structural Health Monitoring
Material Sensing & Instrumentation
MSI Time-Domain-Reflectometry (TDR) Structural-Health Monitoring probes the structural health of a composite part by propagating a fast electrical pulse along a distributed linear sensor which has been fabricated directly in the laminate. The sensor is formed from the native graphite fibers already used in composite manufacture, and constitutes zero defect. Fibers are patterned into a microwave waveguide geometry, or transmission line, and interrogated by a rapid pulse as shown below. Structural faults along the line cause distortions in waveguide geometry, producing reflected pulses similar to radar. Cracking, delamination, disbonds, moisture penetration, marcelling, and strain are all detected by propagation delay, for sensor lengths up to several meters.
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Agera Spectrophotometer
Hunter Associates Laboratory, Inc.
With its 0º/45ºc circumferential geometry, 60-degree gloss meter, UV-controllable LED illumination and 5-megapixel camera, Agera makes positioning samples and measuring color as simple as a snapshot. A single measurement captures and stores the image while it analyzes color, fluorescence, and gloss. Even large samples are no problem with the largest fixed-point contact area of measurement in the industry.
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Thin Film Analyser
TFA
The TFA instrument has be designed to monitor dissolution rates with a minimal volume of developer, typically ≤ 1 ml. The design uses surface tension to hold the developer in a small gap between the sample and the detector head. The instrument allows multiple measurements on the same sample. Thickness measurement can be made in the same geometry as dissolution measurements.
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Helmholtz Coils
Helmholtz-Coils are especially designed to generate precisely defined magnetic fields from DC to the upper end of the audio frequency range and beyond. The generated fields are in a strongly linear relation to the coil current. The field- strength can be calculated exactly by analytical (or numerical) methods, based on the coils' geometry, the number of turns and the coil current.
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PAL Standard Pattern Generator
PG315P
The MicroImage PG315 pattern generator is designed for simple size and geometry reference applications. The PG315 will overlay one of five standard patterns including a centered cross line, a centered cross hair, a centered target style symbol, a dot grid (cross dot) array, a hatch grid (crosshatch) array.
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Industrial Computed Tomography
TomoScope® XS
Coordinate measuring machine for three-dimensional measurement utilizing computed tomographyFast measurement with high resolution via the next generation transmission tubeReduce measurement time by 90% with OnTheFly TechnologyLow operating costs as a result of the new monoblock designExtremely precise air bearing rotary axis for low measurement uncertaintyLow space requirement thanks to compact designLow weight allows for installation almost anywhereFast amortization through low acquisition costsStandard-compliant calibration for reliable and traceable measurement results, optionally with DAkkS certificateVersatile fields of application such as plastic, metal and multi-material componentsSoftware for 3D real-time reconstruction of workpiece geometries during tomography
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Screw Side Action Tensile Grips
2710-100 Series
The Instron screw side-action tensile grips are precision mechanical grips engineered for tensile testing across a broad spectrum of specimen materials (e.g. metals, plastics, textiles, thin foils) and geometries. Their dual-acting screw mechanism delivers concentric clamping and allows for adjustments to accommodate varying specimen thicknesses or unique components — ensuring reliable load alignment. With quick, tool-free jaw face changes and a wide assortment of interchangeable jaw face types (smooth-ground, serrated, rubber-coated, etc.), these grips offer flexibility in test setup.
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Pruning Saw Control
Creation of a system that allows measuring the geometry of the board in the stream, determining the width of the wane, clean surface, the presence of large defects. Calculate the "net" width of the board and give signals for the movement of the saws to obtain the maximum output of the edged board of the given (standard) dimensions.
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Torque Sensors
In universities and industry, for basic research or quality assurance: Kistler torque sensors guarantee precise definition of the power and friction values of drives, transmissions and pumps. Strain gage technology (DMS) is a powerful solution for measurements on rotating shafts, and also for long-term dynamic and static measurements. Maximum precision, the most rigid structure possible and high temperature stability: thanks to these assets, DMS sensors can accomplish the most demanding tasks. Piezoelectric reaction torque sensors offer convincing features such as exceptional overload protection, high signal resolution and a wide frequency range. They are ideal for measurement tasks when conditions are difficult due to geometry, temperature range or dynamics.
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Checking the Geometry and the Placement of the Weld
Based on the real geometric three-dimensional profile of the weld (groove) on the outside of a large diameter pipe, determine the offset of the center of the weld (groove) from the weld line. Provide continuous output of results through the RS-232 interface to the welding process control system. Provide a graphical picture of the current profile, the values of the specified and calculated geometric parameters to the operator.
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Fiber Geometry System
FG500
The FG500 is a fiber geometry system that measures the physical dimensions of the fiber including core, cladding, and coating diameter, non-circularity, and eccentricity. The FG500 is designed to produce accurate measurements quickly and with confidence.
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High Current Probes
*Low internal resistance to minimize arching*PogoPlus bias ball design*High current optimized base material and plating*Higher temperature spring design*Specialized high current tip geometry
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Polaris Tools And Accessories
The Polaris® optical measurement solution is designed with accuracy, reliability, and versatility in mind. Versatility is delivered in part by NDI software packages and developer tools that are available to enhance OEM application development and system customization. The Polaris solution consists of an optical tracker and navigation markers, the latter of which must be attached to a rigid body; i.e. a tool that is rigid in form to prevent unwanted marker movement. The Polaris solution requires three or more markers to be attached to the rigid body tool, the geometry (configuration) of which is unique to each tool.
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Beam Geometry & Alignment Testing
Perform quality control testing of your Digital Radiography (DR), Computed Radiography (CR) and Fluoroscopy X-ray systems with ease. Comply with local, state, federal, and governing bodies for digital and traditional analog radiographic imaging technologies.
