Evolved Packet Core
LTE system core voice and data network.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 2 HDMI, DisplayPort, 4 GbE LAN, 6 USB, PCIe X4/PCI Slot And 9 To 36 VDC
eBOX700-891-FL
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The eBOX700-891-FL is an expansion-rich fanless embedded system powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Kaby Lake) with the Intel® H110 chipset. It supports dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. This embedded box PC comes with a user-friendly mechanism design and offers great flexibility, reliability, and scalability, well suited for vision inspection (USB/PoE), motion control, security surveillance and industrial automation. The eBOX700-891-FL is designed with user friendliness in mind. Its heatsink top cover can simply be opened by unfastening the four screws for the access to the processor and DRAM. Moreover, its bottom cover adopts a convenient flip lid design along with easy-to-access brackets for securing the USB dongle and hard drive. Axiomtek has obtained patents, No. M511183 and No. M531115, for the special chassis design of the eBOX700-891-FL. Easy maintenance is one of the advantages we are offering to our customers and one of the main focuses of our product development. We will continue pursuing excellence and innovation in design and manufacturing.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
Compact Fanless System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-770 V3
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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipsetWide operating temperature (-20 ~ 60 °C)2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)1 x 2.5" HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power rangeIP40 dust proof for deployment in harsh environmentSupports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IOSupports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIsSupports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
6U VME 3rd Gen Core 17 Computer
VM6054
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The VM6054 6U VME 2eSST Single Board Computer is built around Intel®’s state-of-the-art 3rd Generation Core™ i7 quad-core processor.
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Product
Intel Coffee Lake Platform To Support Intel® 9th & 8th Gen Core™ I Processor With One Low-Profile PCIe Expansion Slot
EPC-B2276
Embedded PC
Supports Intel® 9th & 8th Gen Core™ i processor (LGA1151) with Intel Q370.Two 260-pin SO-DIMM up to 32GB DDR4 2133 MHz SDRAM.Supports triple display of 2x DP/HDMI.One low-profile PCIe expansion slot.Reserved 2 USB, 2 COM, punchouts on front panel.Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
2U Rackmount Network Appliance Platform Based On Intel® Xeon® E3 Series And 6th/7th Generation Intel® Core™ I7/i5/i3 Processors, Up To 4NMC Slots
FWA-4030
Network Appliance
Intel® Xeon® E3 Series and 6th/ 7th Generation, Intel® Core™ i7/ i5/ i3 Processors4 x DDR4 2133/2400MHz ECC (Xeon CPU only) UDIMMs, up to 64GB6x 1GbE RJ-45 w/ 2 pairs of LAN bypass, 4x 1GbE LAN of RJ-45 or SFP (optional)4 x Advantech network module expansions1 x PCIe x4 slot on rear, supports FH/HL add-on cards4 x 3.5" HDD bays (internal or external), 1 x CF slot, 1 x mSATA
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Product
100Gbps Ethernet Packet Generators
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Axtrinet (AXTRINET IS A TRADING NAME )
1x 100GbE QSFP28 port, 4x 25GbE SFP28 / 10GbE SFP+ / 1GbE SFP ports, Status Indicators
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Product
3U Intel® Core™ i7-7820EQ Quad-Core Processor-Based PXI Express Gen3 Controller
PXIe-3987
Controller
The ADLINK PXIe-3987 PXI Express embedded controller, based on the 7th gen Intel® Core™ i7 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0105
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The AWS-0105 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
Toroid Core Coil Turns Testers
SS107A
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The magnetic torrid ring core winding coil turns tester (SS107A) adopts the high speed center microprocessing unit circuits and precise measurement A/D circuits. This coil turns tester is used to count the coil turns of various torrid core winding coils. Like as: torrid core inductors, torrid core transformers, torrid core sensors, wate meter sensors, torrid current transformers, torrid core choke coils, etc. The tone tester is named magnetic ring core coil turn tester also.
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Product
19" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-319S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
THIN 1U Embedded PC - Intel® 8th Generation Desktop Core™ I3/i5/i7
EPC-T2286
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Thin design with 44.2mm in height.Support Intel® 8th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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Product
2-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, Front-access I/O, PCIe And PCI Slots
IPC932-230-FL
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The IPC932-230-FL is an expandable fanless barebone system with various front-facing I/O connectors. The powerful embedded system IPC932-230-FL supports LGA1150 socket for the 4th generation Intel® Core™ processors coupled with the Intel® Q87 Express chipset. Two 204-pin SO-DIMM sockets support up to 16 GB DDR3-1333/1600 system memory in maximum. To fulfill different application needs, the compact industrial PC provides two flexible PCI/PCIe expansion slots with two different combinations: one PCIe x1 and one PCIe x4 or one PCIe x4 and one PCI. Its DVI-I output on the front panel allows user to directly connect to a LCD panel and four COM ports and a DIO are provided for general industrial control. This all-in-one barebone system also has two easy-to-install 2.5 SATA HDD drive bays with RAID 0/1, and supports Intel® Active Management Technology 9.0 (AMT 9.0) to enhance overall device manageability.
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Product
MicroATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Edge Computing, Industrial Automation, And Compact Servers.
ASMB-589
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Powered by LGA 1851 Intel® Core™ Ultra 9/7/5 processors with W880 chipset for high-performance computing.Supports up to 192 GB of DDR5 ECC/Non-ECC UDIMM memory at speeds of 5600/4800/4400 MT/s for demanding applications.Features two PCIe x16 (Gen5) and two PCIe x8 (Gen4) slots for flexible expansion with high-speed peripherals.Offers versatile display connectivity with DisplayPort, VGA, and HDMI 2.0 ports, supporting triple simultaneous displays.Provides extensive storage options with five SATA 3 ports and eight high-speed USB 3.2 ports for peripheral connectivity.Includes one M.2 2280 slot (PCIe x4) for fast NVMe SSD storage, enhancing system boot and application load times.Designed with rackmount-optimized placement and positive airflow for enhanced thermal performance in server environments.Ensures reliable operation in industrial environments with an ambient operating temperature range of 0 ~ 60°C (32 ~ 140°F).
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
Panel PC
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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Product
Mini-ITX 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-289 A2
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Intel® Core™ Desktop Processors 12/13/14th Gen and Series 2Dual channel DDR5 5600MHz, max. 96GB with two SODIMMsRich expansion: M.2 B key for SSD Storage, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via DC Jack or ATX 4pin+5VSB pin headerWindows 10/11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOnTriple independent 4K displays with 1 DP1.4, 1 HDMI, and 1 LVDS
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Product
Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
Industrial Computer
The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
Modular Embedded Box PC With 11th Gen Intel® Core™ I CPU
UNO-2484G V2
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Intel® Core™ 11th i7/i5/i3 Processor with 8GB DDR4 3200Mb/s memory4 x GbE, 3 x USB 3.2 Gen2, 1 x USB2.0, 1 x HDMI 1.4, 1 x DP 1.4a, 4 x RS232/422/485Optional 2nd stack supports up to 2 x iDoor extension for expending wireless connectivity, industrial fieldbus or more I/OCompact fanless designRuggedized by zero cable and lockable I/O designSupports NVME storage with high data-transmission efficiency
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Product
Micro-ATX, 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-588 B1
Motherboard
Intel® Core™ 14/13/12th gen & Series 23 2.5GbE LAN and 1 GbE LAN for digital devicesUp to 192GB DDR5 UDIMMs for data transferHigh speed expansions: PCIe x16 Gen5, 8 USB3.2, 1 USB3.2 Type C1 internal USB3.2 type A to support USB keylock functionsQuad displays by 2 DPs, HDMI, and eDP
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Product
Thermal Camera Cores
Tenum® 640
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With a 10 μm pixel pitch and <30 mK NETD sensitivity, the Tenum 640 represents the latest evolution in low SWaP long-wave infrared technology. Tenum® 640 precisely balances ultra-small pixel structure with ultra-sensitive microbolometer performance at a remarkable cost advantage. The 10-micron pixel pitch Vanadium Oxide (VOx) technology behind Leonardo DRS’ Tenum® 640 is the most advanced uncooled infrared sensor design available to Original Equipment Manufacturers (OEMs) today.
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-506
Motherboard
Supports Intel® 8th/9th Gen Core i7/i5/i3 processor with H310 chipsetSupports up to 14 COM, 8 USB 3.0, 12 USB 2.0, TPM 1.2/2.0 (optional)Supports Dual display of VGA, DP, DVI, eDP, LVDS (optional) and two GbE LANTwo DIMM sockets support up to 64 GB DDR4 2666 MHz SDRAMSupports WISE PaaS/Device-On, McAfee, Acronis, Edge AI Suite and Embedded Software APIs
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Product
3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
Single Board Computer
ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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Product
Modular Compact Embedded Box PC With 6th/7th Gen Intel® Core™ I CPU
UNO-2484G
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Intel® Core™ i7/i5/i3/Celeron Processor with 8GB DDR4 built-in Memory4 x GbE, 4 x USB 3.0, 1 x HDMI, 1 x DP, 4 x RS232/422/485Stackable 2nd layer for up to 4 iDoor extension or customize for domain applicationsCompact Fanless DesignRuggedized by zero cable and lockable I/O designSupports 30+ iDOOR combination with four main categoriesDiverse system I/O and Isolated Digital I/O by iDoor TechnologySupports Fieldbus Protocol by iDoor Technology3G/GPS/GPRS/Wi-Fi Communication by iDoor Technology with RED Compliance
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Product
Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 & Intel® HM65
OPS860-HM
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The OPS860-HM Open Pluggable Specification (OPS) compliant signage player delivers high performance without the high cost of installation and maintenance. This signage player supports 2nd generation Intel® Core™ i5/i3 processors with Intel® HM65 Express chipset and has a DDR3-1333 system memory that can expand up to 4GB. The OPS860-HM connects to any OPS compliant display via a standardized JAE TX-25 plug connector, and includes HDMI/DVI, DisplayPort, UART, audio, and USB 2.0 signals. Compliant with standard OPS architecture, the OPS860-HM delivers greater interoperability and allows for easy upgrade and replacement without the need to dismantle the entire signage system.
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Product
3U Intel® Core™ i7-4700EQ Quad-Core Processor-Based PXI Express Controller
PXIe-3985
Controller
The ADLINK PXIe-3985 PXI Express embedded controller, based on the fourth generation Intel® Core™ i7 processor is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
