Plasma
An ionized gas used for flat panel displays.
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Product
Process Sense™ NDIR End Point Detector For Chamber Clean
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The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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Product
High Resolution Wavefront Sensor
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Phasics wavefront sensor applies to laser beam measurement, wavefront correction through an adaptive optics loop, laser optics testing and plasma density measurement. Thus the single instrument offers true versatility to engineers and researchers in laser facility.
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Product
In Situ Diagnostics
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For researchers working on ultra thin films and novel interfaces, Neocera offers insitu, real-time process control and diagnostic tools such as high-pressure RHEED, Low Angle X-ray Spectroscopy (LAXS) and Ion Energy Spectroscopy (IES). RHEED provides exceptional growth control via RHEED intensity oscillations and the Structural data via diffraction. LAXS is a complimentary to RHEED and provides real-time Compositional information. IES provides energetics of the laser generated plasma plume which is directly responsible for obtaining high quality films and interfaces.
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Plasma Power Generators
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Advanced Energy’s field-proven, Precision PowerTM solutions offer extreme control, peerless arc handling, and cutting-edge match technology. Unlock new fabrication processes and benefit from our plasma power generators’ comprehensive capabilities.
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Product
Specialty Sources
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When conventional sources hit their limits, specialty sources step in. These custom-designed plasma and vapor sources are engineered for III-V MBE and compound semiconductor applications where unique material delivery and control are critical.
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Product
Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
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ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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Product
Tailor-Made to Simulate Low-Temperature Plasma Sources and Systems
Plasma Module
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The Plasma Module is tailor-made to model and simulate low-temperature plasma sources and systems. Engineers and scientists use it to gain insight into the physics of discharges and gauge the performance of existing or potential designs. The module can perform analysis in all space dimensions 1D, 2D, and 3D. Plasma systems are, by their very nature, complicated systems with a high degree of nonlinearity. Small changes to the electrical input or plasma chemistry can result in significant changes in the discharge characteristics.
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Remote Plasma Sources For Process Applications
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MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.
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Product
Pull Off Adhesion Tester
106
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Applications for the Elcometer 106 Adhesion Test include paint or plasma spray on bridge decking, coatings on steel, aluminium, concrete etc.Supplied in a carry case - ideal for site testsHand operated - no need for a power supplyIncludes a cutter for EN13144 and ISO 4624 tests
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Product
Plasma Emission Controller
RU-1000
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The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Product
Streak Camera
OptoScope SC-20 systems
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The SC-20 streak camera system is characterized by its large detection area of 35 mm x 4 mm and a large usable screen diagonal of 40 mm. Signals are mapped onto the fiber optic input window and measured without the need for optical reduction. In the simplest case, the entrance optics consists of a slit mask that lies directly on the entrance window. In addition, a flexible extension with a shutter, a lens mount or an adjustable slot with coupling optics is possible. The time resolution in the sub-nanosecond range qualifies the camera for many applications in detonics and plasma physics.
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Product
Thin-film deposition
Plasma Source
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SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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Product
RF Switchbox
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The RF Switchbox offers the application of a single system consisting of an RF Power Supply (AG 0x13 Generator) and Matching Network Tuner, and distributes power into multiple plasma applications. It allows operation of one source-to-load at a time.
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Product
ICP Plasma System
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The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Chemical Downstream Plasma Source
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The AX7610 is a microwave plasma source for remote plasma applications. With replaceable quartz or sapphire plasma tubes, the AX7610 downstream source offers configuration flexibility to meet the most demanding application process parameters. The quartz tube version is ideally suited for production of atomic oxygen, nitrogen or argon. The sapphire tube version is compatible with much more severe CF4 CHF3 and NF3 chemistries.
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Product
Real Time MM-Wave Frequency Analyzers up to 180 GHz
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When millimeter-wave applications came into many domains of human activity, a need for precise measurements of signal frequency spectrum has become critical. This need is quite understandable when, for example, it concerns to exploring extraterrestrial radio-sources or micro/mm-wave background emission in radio-astronomy, or measuring chemical composition of the atmosphere through the molecular emission of different its components, plasma diagnostics or many military applications.
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Product
Elite™ 13.56 MHz RF Plasma Generators
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The elite™ Series of RF plasma generators provides state-of-the art technology in a compact air-cooled package. The elite is designed with high speed closed loop control, a class E RF deck and a switching modulator for superior output performance. The elite design utilizes a single printed circuit board assembly for the full rack product virtually eliminating all internal wires and connectors and thereby providing the highest reliability available.
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Plasma Processing Systems
PlasmaSTAR
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The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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Product
Post Dicing
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Camtek offers dedicated inspection and metrology solutions for dicing-related processes, ensuring the reliability of the end product. Camtek developed new capabilities to address new dicing technologies such as Stealth and Plasma dicing using new algorithmic and technologies such as Back Light illumination, as well as various handling solutions.
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Product
GHW Series 13.56 MHz, 1.25, 2.5, And 5.0 KW High-Reliability RF Plasma Generators
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The GHW Series RF power generators deliver maximum rated output powers of 1250, 2500 and 5000 Watts at a frequency of 13.56 MHz. The GHW generators offer field-proven reliability, exceptional stability, and unsurpassed repeatability for high uptime and process yield. They are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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Plasma-Enhanced Chemical Vapor Deposition (PECVD)
VECTOR Product Family
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Dielectric film deposition processes are used to form some of the most difficult-to-produce insulating layers in a semiconductor device, including those used in the latest transistors and 3D structures. In some applications, these films need to conform tightly around intricate structures. Other applications require dielectric films to be exceptionally smooth and defect free since slight imperfections are multiplied greatly in subsequent layers.
