Defect
other than specified, imperfection .
-
Product
Pipeline Defect Mapper
-
The non-intrusive measuring device takes measurements along the pipeline and plots the results directly onto the screen of the receiver. There is no need to carry extra logging and display devices. All the data is displayed and logged into the receiver for downloading to a spreadsheet or dedicated analysis program.
-
Product
Counterfeit Defect Coverage Tool
-
The SAE Counterfeit Defect Coverage Tool is a dynamic, web-based application that supplements SAE Standard AS6171 authored by the SAE G-19A Test Laboratory Standards Development Committee. It provides potential test sequences for the identification of counterfeit electrical, electronic, and electromechanical (EEE) parts along a range of risk levels and EEE part types. Allowing users to compare alternative test sequences as a function of resources needed to implement those tests, the SAE CDC Tool is appropriate for those ordering counterfeit detection tests as well as those performing the tests.
-
Product
Defect Isolation
-
*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
-
Product
Surface Defect Inspection System
-
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible
-
Product
Defect Inspection System
NovusEdge
-
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
-
Product
Sapphire Defect Laser Probe and Glasses
LP-100
-
Easy to use and portable■ low price with long lifetime■ can be used to detect many defects, like micro crack, bubbles, impurity, crystal subgrain■ When the laser go though the crystal, if it is monocrystal the light should be scattering, in macro it should be white.
-
Product
Solar EL Defect Detector
-
Jiangsu Keyland Laser Technology Co., Ltd.
Features: - Reveals invisible defects- Improves line yield prior to lamination- Improves quality and reliability of final product- Exceptional optical resolution in its class- Flexible system configuration for framed or unframed modules testing
-
Product
Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
-
The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
-
Product
Transistor-Level Defect Simulator
Tessent DefectSim
-
Tessent DefectSim is a transistor-level defect simulator for analog, mixed-signal (AMS), and non-scan digital circuits. It measures defect coverage and defect tolerance. Tessent DefectSim is perfect for both high-volume and high-reliability ICs. Tessent DefectSim replaces manual test coverage assessment in AMS circuits needed to meet quality standards such as ISO 26262 and provides objective data to guide improvements in DFT. Tessent DefectSim dramatically reduces SPICE simulation time compared to simulating every potential defect.
-
Product
Luminescence Defect Inspection System
INSPECTRA® PL Series
-
This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
-
Product
Defect Inspection and Review
-
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
-
Product
Defect Inspection Module
EB40
-
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
-
Product
ECHO VS System with Image Enhancement
Echo VS
-
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
-
Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
-
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
-
Product
Eddy Current Testing
-
Shanghai Xianda Denshijiki Industry Co.,Ltd
And the eddy current generated on the specimen by the specimen by the action of the magnetic field can not be detected (defect) and the change due to the influence of the material is detected.
-
Product
Automated Excise Stamp Control System
Kama
-
The automated control (verification) system of excise stamps allows for blotting accounting of alcohol, dairy and other products (inspection of the readability of DataMatrix, PDF, QR, Barcode and other barcodes of excise or federal stamps) at a speed of up to 20 pcs / s. This visual inspection allows you to quickly identify defects in DM and PDF printing. The recognition system also analyzes gaps and doubles in a sequence of codes. The system has its own mechanism for rewinding a roll with a volume of up to 5000 marks. All types of stamps (old and new, large and small) are supported. Wide range of options for configuring scanning parameters and automatic generation of reports for the EGAIS department. Possibility of manual scanning (by hand scanner).
-
Product
Destructive Physical Analysis (DPA)
-
Is the process of disassembling, testing, and inspecting a component for the purpose of determining conformance with applicable design and process requirements. This process of sample testing is used to ensure that a high reliability component or device is fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for troublesome production lot problems.
-
Product
E-beam Metrology And Inspection
-
Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
-
Product
Testing for Si Solar Cells Using High Performance CCD
EL Imaging Tester
-
EL Testing for Si Solar Cells using High Performance CCD. The determination of luminescence (photo emissions) in solar cells is an important characterization tool. Typical solar cells often have defects which limit the efficiency or lifetime of a cell. Many of these defects are visualized with Luminescence Imaging. By using this technique, the manufacturing process can be optimized to produce better cells. Luminescence Imaging takes advantage of the radiative inter-band recombination of excited charge carriers in solar cells. The emitted photons can be captured with a sensitive CCD camera to obtain an image of the distribution of the radiative recombination in the cell. This distribution is determined by the local excitation level, allowing the detection of electrical losses, thus mapping the diffusion length of minority carriers as the emitted light is low intensity and in the near infra-red range, the CCD camera has a high sensitivity wavelength from 900 to 1100 nm with little thermal noise. This CCD camera provides excellent resolution of 1024 x 1024 pixels with a large 1μm pixel size, multi-megahertz readout speed, and robust USB 2.0 connectivity. The EL CCD Camera is the ultimate high-performance CCD camera for electroluminescence and photoluminescence imaging for Photovoltaic (PV) Cells and Modules. This camera combines low noise electronics and optimal sensitivity in NIR.
-
Product
Manufacturing Defects Analyzer
eloZ1-400
-
The eloZ1 Manufacturing Defects Analyzer is an in-circuit tester of the very latest generation, reliably detecting connection and assembly faults on printed circuit board assemblies. The eloZ1-400 is the compact version of the eloZ1. It is particularly suitable if there is only limited space to fit test appliances. The eloZ1-400 can also be used as a mobile test system.
-
Product
G3 System
Dragonfly
-
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
-
Product
Vacuum Inspection
INDEC
-
INDEC vacuum test systems monitor a wide range of containers during the production process, including bottles, jars and cans, by measuring the cap panel concavity of their closures which is dependent on the vacuum inside. This non-contact inspection reliably identifies defective containers for automatic rejection.
-
Product
Superior Handheld Partial Discharge Detector
PDStar
-
Power Monitoring and Diagnostic Technology Ltd.
PMDT is proud to present one of our latest innovations, the PDStar. It integrates On-Line Partial Discharge (OLPD) testing and Infrared testing for MV and HV equipment, which combines UHF, AE, Ultrasonic, HFCT, TEV, and Infrared testing technologies. It is applicable for online PD testing, as well as abnormal heating and defect detection on all types of substation equipment. PD amplitude, PRPD, PRPS, and infrared spectrums provide critical data for determining the operational condition of electric power equipment. It connects to the PMDTCloud via Wi-Fi/3G/4G to upload test data, download test tasks, and receive diagnostic results in real time. Another uniquely advanced feature of the PDStar is that it integrates with a 100 MSPS (Mega-Samples per Second) HFCT signal processor, which greatly improves the performance for power cable OLPD testing.
-
Product
Thermal Imaging Cameras
-
Thermography tools are indispensable when it comes to non-contact detection of thermal differences. Thermal imagers can be used to find defects in buildings, discover damage during maintenance, or analyze thermal processes.
-
Product
Ultrasonic Optical Flaw Detector
MIV-X
-
Thanks to Shimadzu’s proprietary light imagining technique, which combines an ultrasonic oscillator with a stroboscope, defects near the surface of a material, including peeling of the bonding and adhesive surfaces of heterogeneous materials, as well as paint, thermal sprays, and coatings can be inspected easily and non-destructively.
-
Product
Assembly Testers
-
Systems that build products from components and then rigorously test them to ensure they function correctly, meet quality standards, and match specifications, preventing defects early in manufacturing through processes like electrical checks, functional tests, and physical inspections.
-
Product
DC Magnetic Flux Leakage Testing
ROTOMAT / TRANSOMAT Product Family
-
Foerster Instruments, Incorporated
With the new generation ROTOMAT DA and TRANSOMAT DA flux leakage test systems FOERSTER is setting new standards in continuous quality assurance of ferromagnetic steel tubes. The test systems enable the reliable detection of natural and oblique defects, regardless of their angle or length, in addition to standardized longitudinal and transversal defects. The miniaturization of sensors together with highly integrated electronic components dramatically increases the number of channels. This makes a more precise and finer scan of the surface possible, giving a more complete set of information regarding detected defects. The newly introduced C-Scan visualizes these defects in high-definition and real-time, resulting in a completely new evaluation of the tubes to meet rising quality requirements.
-
Product
PoE Transient Test Meter
Trans-Guard 910016
-
GrayStone Automation's innovative DCVBD voltage breakdown meter measures the breakdown voltage of many lightning protection devices and components to identify transient protection devices that may be damaged or defective and help prevent costly transient damage to critical and expensive equipment.
-
Product
Visual Control System of Label Printing Quality
-
The created system allows detecting the following types of label printing defects:- absence or indistinct image or inconsistency of information applied by typographic method;- absence or indistinct image or inconsistency of information or going beyond the boundaries of the print field of variable information printed on the labeling machine (batch number, expiration date).The system is based on a Basler Scout A1300-32gc digital industrial camera and a panel computer.
-
Product
Solder Paste Inspection Machine
3D SPI
-
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance





























