Alignment
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SOSA Aligned 3U VPX
Model 5553
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- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6003 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
SOSA Aligned LVDS with Optical I/O Kintex UltraScale FPGA - XMC
Model 71813
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Supports the emerging SOSA™ Technical Standard- PCI Express (Gen. 1, 2 & 3) interface up to x8VITA 42.0 XMC compatible with switched fabric interfaces- Optional front panel optical interface- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
8-slots 25Gb backplane aligned to SOSA
1SVX308ABP-1X31
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3U 8-slots 25Gb backplane aligned to SOSA, with apertures for VITA 66/67 RF & optical modules.
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Product
FlexVNX+ 3-Slot Test And Development Platform Aligned To SOSA And VITA 90 Standards
39S03VPXZZY2VAND
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Elma’s 3-Slot FlexVNX+ Development Chassis is the industry’s first compact, SOSA™ and VITA-90 aligned VNX+ platform, purpose built for rapid board bring-up, validation, and test of plug-in cards (PICs).
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Product
3U OpenVPX™ SOSA™-Aligned Single Board Computer Intel® Xeon® W Processor (Tiger Lake)
68INT6H
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The 68INT6H is a SOSA™-aligned 3U OpenVPX Intel® Xeon® W Processor (Tiger Lake) w/ 8 Cores & 24 M Smart Cache running up to 2.6 GHz Single Board Computer that can be configured with up to two smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6H delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
7-Slot 3U OpenVPX Backplane Aligned To SOSA | 6 VITA 65 Slots + 1 VITA 62 PSU Slot
1SVX306AXX-XX31
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These six VITA 65 slots plus one VITA 62 slot (6+1) backplanes are designed in alignment with The Open Group® Sensor Open Systems Architecture™ Technical Reference Standard, or SOSA®.
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Product
SOSA Aligned 1-Slot 3U VPX Development Chassis for Quartz Products
Model 8257A
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- Ideal development platform for Mercury's- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 - Processor - SOSA Aligned 3U VPX- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Access to data and control planes provided through RTM- 1-slot, small footprint development chassis- Rear panel access to RF I/O, 100 GigE and chassis manager- Supports VITA-67.3C- Compatible with the Quartz product family- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
