Deposition
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Deposition Systems
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When a thin film requires the most stringent structural or compositional properties consistently across every layer, Veeco’s Ion Beam Deposition (IBD) technology is often the answer. Using a focused beam of ions to sputter material from a target, this physical vapor deposition technique builds dense, uniform films with standout adhesion and stability.
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Atomic Layer Deposition Systems
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Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
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Matrix Vapor Deposition System
iMLayer
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The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Parylene Deposition Equipment
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SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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Particle Deposition Systems
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MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Differential Quartz Crystal Microbalance
Dike
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During an experiment to detect an affinity reaction on biological material, a molecule of interest is attached to the quartz crystal of the measurement channel, this deposition can be achieved by direct binding or by capture through another protein, the result of this process is to make the quartz sensitive to the molecule to be detected.
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Remote Plasma Sources For Process Applications
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MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.
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In-Situ Spectroscopic Ellipsometer for Real-Time Thin Film Monitoring
UVISEL Plus In-Situ
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The UVISEL Plus in-situ spectroscopic ellipsometer can be easily mounted on process chambers (PECVD, MOCVD, sputter, evaporation, ALD, MBE) for the real-time control of thin film deposition or etch processes.The UVISEL Plus in-situ provides the unique combinations of very high speed, sensitivity, dynamic range and accuracy making the instrument able to control deposition / etch at the atomic layer thickness level, even for rapid processes.
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Dynamic Scale Deposition Loop System
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Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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In-Situ Metrology Etch
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In-situ metrology systems are attached to deposition systems on one or several viewports for monitoring the progression of the etch dept during the process in real time. No matter if the required stop depth lies within a layer or at an interface.
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ICP Plasma System
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The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Reticle Manufacturing
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An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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Surface Quality Monitors
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PET manufactures and markets non-destructive, non-contact surface contamination and thin film detection models and automated systems (surface quality monitoring system) capable of detecting thin layer contamination, thin films and coating down to the Angstrom level. These systems represent a major breakthrough by providing, for the first time, a quantitative measure of surface cleanliness. As surface cleanliness verification instruments, in a part cleaning environment, these products are capable of validating the cleaning quality of all the part cleaning equipment available in the market. Any of SQM model series is capable of verifying metal contamination; monitoring absence/presence of organic and/or inorganic on virtually on surfaces of all metals. They are, price/performance, the most sufficient product available for testing surface of metals for surface cleanliness. These systems operate in an ambient environment, require no sample preparation or deposit of any agents on the surface. In any parts cleaning environment where the quality and efficiency of part cleaning equipment for removal of surface contamination is highly desired, these systems provide a scientific solution by quantitatively measuring the surface cleanliness. The SQM series has the sensitivity and operational simplicity required to provide fast and cost effective surface evaluation for all metals.
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SpectrOil M/F-W Fuel Analyzer
SpectrOil M
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The SpectrOil M/F-W is a compact, rugged and easy to use fuel analysis spectrometer. It is designed specifically for the analysis of ash-forming contaminants in fuel such as sodium, potassium and vanadium that cause corrosion or deposits at turbine operating temperatures. It measures trace quantities of dissolved or suspended contaminant particles in a fuel sample using the time-tested and reliable rotating disc electrode (RDE) technique.
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Plasma-Enhanced Chemical Vapor Deposition (PECVD)
VECTOR Product Family
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Dielectric film deposition processes are used to form some of the most difficult-to-produce insulating layers in a semiconductor device, including those used in the latest transistors and 3D structures. In some applications, these films need to conform tightly around intricate structures. Other applications require dielectric films to be exceptionally smooth and defect free since slight imperfections are multiplied greatly in subsequent layers.
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Oil In Water/Soil Analyzer
InfraCal 2 TRANS-SP
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The InfraCal 2 TRANS-SP is recommended for measuring oil in water, TPH in soil or FOG in wastewater concentration levels using the traditional EPA methods 413.2 and 418.1 or ASTM method D7066-04 and Freon-113, hydrocarbon-free grade of perchloroethylene, AK-225, S-316 or other spectroscopic infrared transparent solvent as the extracting solvent. Since the extract is deposited into a 10 mm quartz cuvette cell with Teflon stopper, light end volatile components are retained for measurement. Accurate down to 0.1 ppm.
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Custom Aluminum Nitride Ceramic Substrate
CAN1
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CAN1 Custom Aluminum Nitride Ceramic Substrate is a custom aluminum nitride ceramic substrate for sensor platforms, MEMS devices, thermal management studies, thin-film deposition, and electronic materials research. The substrate can be supplied for prototype development, coating trials, and small-batch R&D projects where stable ceramic material and custom dimensions are required.
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Metrology System
Aspect
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Memory density increases with both layer-pair scaling and tier stacking for memory stacks well over 200 pairs. The Aspect metrology system was designed with these future architectures and scaling strategies in mind. Aspect metrology is demonstrating performance superior to X-ray systems across multiple customer devices through a revolutionary infrared optical system providing full profiling capability to enable critical etch and deposition control, with the speed and process coverage that customers require.
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Long Term Test Kit
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When long term electro-chemical tests (>1000 hours) are run to monitor the cell degradation at the cathode for example, it is important to avoid any contaminant in the gas flow rate.Inconel 601 flange equipped with alumina housing and alumina tube to feed the gas to the electrode during long term test (>1000 h)Typical poisoning is coming from the chromium contained in the steel tubing. The volatile chromium species (Cr6+) will flow into the cathode (with the air) and thanks to the intake of electrons at the electrode, the chromium ion will transform to chromium oxide and be deposited at the cathode triple point. In such a case, the long term test kit is used. The Inconel 601 flange is equipped with an alumina housing (>96 % Al2O3) and the air (or other gas) is led through an alumina tube. The long term test kit is fully compatible with other functionalities proposed with the Open Flanges™ test Set-Up as the integrated steamer or the small pellet test kit. The long term test kit can be implemented on the fuel, on the air or on both sides.
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Physical Vapor Deposition Systems
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Physical Vapor Deposition (PVD) systems use physical processes, like sputtering and evaporation, to deposit thin films with exceptional purity and control. These techniques are widely used in semiconductor manufacturing, optical coatings and protective applications.
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EpiStride SiC CVD System
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Veeco’s latest technology for the compound semiconductor market enables high-performance chemical vapor deposition of Silicon Carbide for both 6 and 8-inch wafer production. The platform enables a return to production in under 5 hours after routine cleaning maintenance. The EpiStride system’s high uptimes, short cycle times and overall stable performance lead to the lowest cost of ownership per wafer compared to competitive systems.
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Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
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Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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Duct Deposit Measuring System
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The Elcometer 456 Duct Deposit Measuring System has been specifically designed to meet the requirements of the DTT (Deposit Thickness Test) in HVCA’s (Heating & Ventilation Contractor’s Association) Guide to Good Practice, for the measurement of dust and grease deposits within ventilation systems and kitchen ducts made of ferrous metals.
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Plasma Emission Controller
RU-1000
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The optical technology developed by HORIBA and the gas control technology offered by HORIBA STEC have been combined to make further advances in plasma control technology. The plasma emission controller RU-100 offers; faster deposition by controlling the transition region, optimized distribution in a large-area, high-capacity chamber, plasma stabilization in a long sputtering process (stable deposition), and mixture optimization of compounds for reactive sputtering.
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Digital Mammography
ITA
Analogic is an established worldwide leader in direct conversion digital detector technology used in digital mammography. We develop and manufacture flat-panel, direct conversion digital detectors used by major medical OEMs in mammography systems. These plates capture image data directly onto a patented detector made with a layer of amorphous selenium deposited onto a thin-film transistor array.
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kSA BandiT
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The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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Excitation Sources
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SPECS Surface Nano Analysis GmbH
o our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.
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Conductivity Electrode
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As current-carrying and potential difference measuring electrodes, platinum was deposited on a quartz glass substrate. Voltage terminal distance can be varied by changing the connection pin. In-situ measurement of the metal transition produced in a conductive polymer insulator doping, 4 terminal electrode is used, where for insulator layer with low doping side 2 terminal method and for metal layer with high doping side 4 terminal method is used for the measurement. With this electrode, become possible to have measurement in 15 distances by combining the connection terminal.
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Digital mammography system
AMULET
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The new format FPD has a proprietary panel structure with a double layer of amorphous selenium that has high X-ray absorption properties, and was developed by combining Fujifilm''s "Device Development Technology" and "Vacuum Deposition Technology." The first layer efficiently converts X-rays into electrical signals, while the second layer employs the unique "Direct Optical Switching Technology," that captures higher resolution and lower noise image electrical signals rather than using electrical switches such as conventional TFTs. By achieving both "50µm fine pixel size (higher resolution) and low noise," the AMULET system can show microcalcifications and tumors in greater detail, both significant indicators for early diagnosis of breast cancer.
