SODIMM
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Product
DDR3 SODIMM
SQR-HS3I
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Original Samsung/Micron IC chips adapted, Heatsink attached. Data transfer rate: 1600 MT/s, Operating temperature: -40 °C ~ 85 °C, 3years longevity, Fixed BOM, Lifetime warranty.
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Product
DDR3 SODIMM
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compact type of RAM designed for laptops, all-in-one PCs, and small form-factor computers. It is roughly half the size of standard desktop RAM (DIMM) and uses 204 pins to transfer DDR3-generation data at speeds of 800–2133 MT/s.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
260pin SODIMM ECC DIMM
SQR-SD4(ECC)
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ECC SODIMM DDR4 2133/2400/2666, Data transfer rate: 2133/2400/2666 MT/sCapacity: 2GB~16GB. Original IC chip (Samsung/Hynix) ECC function support, Wide temperature range support -40oC~85oC.
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Product
SODIMM DDR4
SQR-SD4N
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Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
Ultra Grade SODIMM DDR4 2666/3200
SQR-SD4E
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Ultra Wide temperature natively support -40~125C, Micron original Ultra High grade IC adopted. An underfill technique to stronger PCB and IC structural, 30u" Golden finger & Locked BOM components list. Exclusive SQ Manager software to monitor and deliver real time information.
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Product
DDR5 SODIMM
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compact, high-speed RAM standard designed for laptops, mini-PCs, and compact devices.
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Product
ECC SODIMM
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compact, small-outline memory module designed for laptops, workstations, and small-form-factor servers that automatically detects and corrects single-bit data corruption.
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Product
Pico-ITX SBC With Intel® Pentium® N3710 & Celeron® N3060 Processor, HDMI (VGA)/LVDS, LAN And Audio
PICO300
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The PICO300, an extreme-compact fanless pico-ITX motherboard, is built with the Intel® Pentium® N3710 or Celeron® N3060 processor (codename: Braswell SoC). One SO-DIMM socket is provided to support up to 8GB of DDR3L-1600 memory. The PICO300 is supported in dual display configurations along with one 18/24-bit single/dual-channel LVDS and a choice of VGA or HDMI. Furthermore, the tiny 2.5” pico-ITX embedded board features Intel® integrated Gfx graphic engine to build excellent media and graphics performance capability. In addition, the compact size of the pico-ITX form factor also makes the PICO300 suitable for space-constrained embedded applications. It runs fanless operation, and supports -20°C to +60°C operating temperature. Combined all features as above, the PICO300 is ideal for any media editing, imaging, graphics and video intensive applications that be applied for a wide array of industrial IoT industries.
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Product
Mini-ITX Embedded Board with AMD® Ryzen™ APU
AmITX-RZ-G
Motherboard
- AMD® Ryzen™ Embedded V1000 processor family- Up to 32GB dual SODIMM socket DDR4- PCIe x16, PCIe x1, M.2 and Mini-PCIe expansion- 4x DisplayPort
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Product
3.5” Embedded SBC With Intel® Celeron® Processor J1900/J1800, DisplayPort, LVDS, VGA, 3 GbE LAN And Audio
CAPA84R
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The CAPA84R is powered by the Intel® Celeron® processor J1900 quad-core or J1800 dual-core. The CPU is located at the rear side of the motherboard, which further aids the heat-extraction process and simplifies maintenance procedures. This fanless embedded board was designed for operational efficiency in rugged architecture with a wide operating temperature range of -20°C to +70°C. The CAPA84R supports one 204-pin DDR3L-1333 SO-DIMM socket with up to 8GB of system memory. There are also one SATA-300 port and one M.2 Key B supporting SATA for storage. The 3.5-inch embedded SBC with the Intel® integrated Gfx graphics is made to bring a true high definition visual experience with dual display configurations through the DisplayPort, 18/24-bit dual-channel LVDS and VGA.
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Product
Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81 And TPM 1.2
OPS883-H
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The OPS883-H OPS-compliant digital signage player is powered by the 4th generation Intel® Core™ i7/i5/i3 processor (codename: Haswell) with the Intel® H81 chipset. It has one 204-pin DDR3 SO-DIMM socket with maximum up to 8 GB. It offers stunning 4K Ultra High Definition (UHD) content via a HDMI port. The Intel® Core-based OPS883-H is ideal for multi-display applications in airport information board, shopping mall, corporate, education, hospitality, religious organization, bank, retail store, restaurant, performing art center and many more. This smart pluggable signage module is connected to OPS-compliant display via a standardized JAE TX-25 plug connector, and includes DisplayPort, UART, audio, USB 3.0 and USB 2.0 signals. To fill different application needs, the signage unit reserves a wide choice of I/O ports on front panel, including one USB 3.0 ports, two USB 2.0 ports, one COM port, audio (in/out) and a Gigabit Ethernet port. This slim-type OPS system has one internal PCI Express Mini Card slot to connect Wi-Fi or 3G/ LTE modules to satisfied users wireless needs. It features one easy-to-access 2.5” SATA HDD as storage device. Also, it supports TPM 1.2 feature which is designed to secure system.
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Product
Intel® Processor N Series And Atom® X Series Expandable, Cost-Efficient Modular Industrial Computers
MXC-330
Industrial Computer
Intel® latest ADL-N cost-performance embedded Fanless system, DDR5 SO-DIMM, various IO interface for different industrial applications, including Isolation COM port & DIO, 4x GbE LAN, M.2 expansion slot for general application.
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Product
Edge AI Inference System
AIR-310
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Edge AI inference system powered by 12th/13th/14th Gen Intel® Core™ processors with MXM GPU support. Support Intel ® 12th/13th/14th Gen. Core™ i3/i5/i7/i9 processor up to 65W. DDR5 SO-DIMM memory support up to 64 GB.
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® Q170, 2 HDMI, DisplayPort, 4 GbE LAN, 8 USB, 2 PCI Express Mini Card Slots
eBOX670-891-FL
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The eBOX670-891-FL supports the 7th/6th generation Intel® Core™ i7/i5/i3 and Celeron® processors with flexible I/O configurations. This outstanding embedded box PC is equipped with dual DDR4-2133 SO-DIMM slots with system memory up to 32 GB. The eBOX670-891-FL provides high flexibility with reserved I/O module space on the rear side. The embedded system integrator can expand the system quickly and easily by installing suitable I/O modules. The fanless embedded box computer features wireless communication capabilities with two internal PCI Express Mini Card slots and one SIM card slot. Four Gigabit Ethernet ports are for customers who need mass data transmission or LAN port teaming functions for each virtual machine. For storage needs, it is equipped with one easy-access CFast™ socket, one mSATA interface, and dual 2.5” SATA hard drive bays with RAID 0&1 support.
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Product
16G SO-DDR4-3200 1GbX8 1.2V SAM -40~85C
AQD-SD4U16N32-SEW
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-512-FL
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The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Product
Rugged PC Compatible
SYS-ITX-N-3900
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WINSYSTEMS’ SYS-ITX-N-3900 is an Industrial Embedded Computer (SBC) based on the Intel® Atom™ E3900 Apollo Lake processor family. It uses less than 12 watts for fanless applications and performs reliably in industrial operating temperatures ranging from -20º to +60ºC. It includes a SODIMM socket supporting up to 8 GB of DDR3 system memory and internal mounting support for one 2.5” SATA HDD/SSD. Additional expansion is available through MiniPCIe.
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Product
Multimedia Modular
DPX-M275
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Intel® 12/13/14th Generation Core™-i9/i7/i5/i3 Embedded Multi-media Gaming Board. Very high-performance Intel Hybrid Multi-core CPU’s. Two SoDIMM DDR5-4800/5600MT/s up to 64GB.
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Product
Robust DIN-rail Fanless Embedded System With Intel® Celeron® Processor N3350/Pentium® Processor N4200, Isolated COM, LAN And DIO
ICO300-83B
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The ICO300-83B is powered by the low-power consumption Intel® Celeron processor N3350 (Formerly codename: Apollo Lake). ICO300-83B’s proven rugged construction ensures harsh operating conditions with an extended temperature range of -20°C to 70°C (-40°C to +70°C for option), a wide voltage range of 12V-24V DC power input with overvoltage and reverse protection, and up to 2G vibration endurance. It supports one DDR3L-1866 SO-DIMM slot with up to 8 GB of system memory. Additionally, the ICO300-83B is equipped with two full-size PCI Express Mini Card slots, one for an mSATA storage card and another for 3G/GPRS/Wi-Fi - allowing it to provide flexible communication and data transfer options for use as an IIoT gateway.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
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The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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Product
COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
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The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Product
PICMG 1.3 Half-size CPU Card With Intel® Celeron® Processor J1900 (up To 2.42 GHz), SATA2, CFast™, VGA/LVDS And Dual LANs
SHB215
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*Intel® Celeron® Processor J1900 up to 2.42 GHz*1 DDR3L-1333/1600 SO-DIMM, up to 8GB*VGA and LVDS with dual-view supported*1 CFast™ socket onboard
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Product
Robust DIN-rail Fanless Embedded System With Intel® Celeron® Processor N3350, 2 COM, LAN, 2 USB And DIO
ICO100-839
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The ICO100-839 is a DIN-rail fanless embedded system designed to support the low-power Intel® Celeron® processor N3350. This DIN-rail industrial IoT gateway supports one DDR3L SO-DIMM slot with up to 8 GB system memory. Its proven rugged construction ensures reliable operation in harsh environments with an extended temperature range of -20°C to 70°C and anti-vibration up to 2G. Additionally, the wide range 12V-24V DC power input with a lockable terminal block type connector is suitable for industrial automation fields. The overvoltage and reverse protection lowers the risk of crucial data loss. The outstanding Intel® Atom™-based ICO100-839 is a perfect solution for industrial IoT applications such as smart factory automation and smart energy. The DIN-rail industrial IoT gateway offers an outstanding price/performance ratio with good quality. It comes with sufficient I/O connectivity while measuring only 31 x 100 x 125 mm. The I/O interfaces include two RS-232/422/485 ports, two USB 2.0 ports, one Gigabit Ethernet, one VGA and one DIO. Furthermore, the Intel® Apollo Lake-based ICO100-839 is equipped with two PCI Express Mini Card slots, one for mSATA storage card and another for 3G/GPRS/Wi-Fi connections.
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Intel® Pentium N4200, Celeron N3350 & Atom™ E3950, 3.5" MI/O SBC
PCM-9366
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Intel® Pentium N4200, Celeron N3350 & Atom™ E39501 x DDR3L-1866/1600 SODIMM, up to 8GBDirectX11, OpenGL3.2, OpenCL1.2, multi-display: VGA+LVDS/eDP+ HDMI/ DP*Support 9-36V wide range power input2 GbE, rich I/O: 4COM, SATA, USB3.0, SMBus/I2C, 2 8bit GPIO, 2 CANBUS, M.2 key E, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350,HDMI/LVDS, GbE LAN And Audio
PICO316
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*Intel® Pentium® processor N4200 & Celeron® processor N3350*1 DDR3L SO-DIMM, up to 8GB*2 USB 2.0 ports and 3 USB 3.0 ports*PCI Express Mini Card slot with mSATA supported
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Product
COM Express Type 6 Compact Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM313
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The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Product
COM Express Compact Size Type 6 Module with 11th Gen Intel® Core™ and Celeron® Processors (formerly codename: Tiger Lake-UP3)
cExpress-TL
Computer on Module
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if features support for 2.5GbE Ethernet, leveraging existing Cat5e cable infrastructure being used for 1GbE Ethernet, it supports four USB 3.2 ports with transfer rates up to 10Gb/s. The modules have a configurable power range of 15 to 28 watts, which suits them for fanless space-constrained embedded applications. Typical industries in need of such high-performance/low-power characteristics are transport, medical, industrial automation and control, edge controllers, robotics and multi-camera-based AI. cExpress-TL features the Intel® Iris® Xe, a new graphics core, and supporting AVX-512 Vector Neural Net Instructions (VNNI) can significantly improve the number of elements processed per cycle, providing AI inferencing performance that is up to 3x that of previously available from non-VNNI platforms. Intel® Iris® Xe provides 96 execution units and is able to be configured to support two 8K independent displays or four 4K independent display (HDMI/DP/eDP). Additional support includes In-Band ECC (IBECC), providing ECC level error correction on DDR4 SODIMM memories for mission critical or rugged applications.
