CSP
Test connector assemblies that mate with the pads on an integrated circuit's chip size packaging.
See Also: WLCSP
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Product
Ultra High Speed Pick & Place
MC889
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The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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Product
Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Product
DC Power Supply
CSP-2
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● A wide range selectable to meet various application● 230K~300Khr. MTBF● RoHS version in option● Compact size with DIN rail mounting
