Deep Packet Inspection
check to examine data within a packet. Also known as: DPI
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Product
On-Camera Deep Learning
Firefly DL
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Deep learning is a powerful tool for system designers to quickly automate complex and subjective decision making and deliver higher quality products and improved productivity. Deploy your trained neural network to the FLIR Firefly DL with Neuro technology and reduce system cost and complexity by making decisions on-camera without host PC. With its very small size, low weight and power consumption, the Firefly DL camera is ideal for embedding into mobile, desktop, and handheld systems.
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Product
Packet Sniffer
EtherDetect
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EtherDetect Packet Sniffer is an easy for use and award-winning packet sniffer and network protocol analyzer, which provides a connection-oriented view for analyzing packets more effectively. With the handy tool, all you need to do is to set up the filter, start capturing, and view connections, packets as well as data on the fly.
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Product
Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Product
Test & Inspection
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Our test and inspection products support maintenance, product quality testing, diagnostics, and quality control. The extensive range of products covers almost any application need you to have.
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Product
Deep Dive Application Monitoring
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Application performance management (APM) is critical to business success today. Dynatrace automatically sees and analyzes every single user transaction, all the time. All relevant metrics, environment changes, and application deployments are shown in real-time.
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Product
3D Inspection Service
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The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Product
Deep Ultraviolet Spectrophotometer System
VUVAS-10X
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A new ultraviolet spectrophotometer system for optical metrology just arrived at NASA Goddard! The VUVAS-10X spectrophotometer works best in the 90 to 160 nanometer wavelength range, also known as deep or vacuum ultraviolet (VUV) region. It uses a windowless hydrogen plasma light source and differential pump section to reach many wavelengths beyond those of conventional deuterium lamps. The source also works with other gases, or gas mixtures, for atomic spectral line emission from about 30 nanometers (double ionized Helium gas) up to the Visible light range. The new spectrophotometer system, McPherson VUVAS-10X, uses a one-meter focal length high-resolution monochromator with the special light source, scintillated detector and Model 121 goniometric sample chamber. The system is ideal for optical transmission, absorbance and specular reflectance at incident angles up to 60 degrees. This McPherson spectrophotometer system will help develop, inspect and qualify optical materials and coatings used for very high altitude and extraterrestrial space flight missions.
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Product
X-ray Inspection System
RTX-113™
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Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Product
Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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Product
Deep Target System
NX15®
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Geophysical Survey Systems, Inc.
NX15® Deep Target System is designed for inspecting thick concrete, slab-on-grade surfaces, and structural elements. Engineered for enhanced penetration, it offers a depth range of 0–150 cm (0–60 in) in ideal conditions.
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Product
MT Inspection Scope
Um
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● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
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Product
Protective Coating Inspection
Kit 4
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The Elcometer Protective Coating Inspection Kit 4 provides a range of test equipment to help an inspector assess a substrate prior to the application of a coating.
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Product
Magnetic Particle Inspection
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Magnetic Particle InspectionMagnaflux Magnetic Particles are used for magnetic particle inspection method in the detection of SURFACE and SUBSURFACE indications in FERROUS materials.
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Product
Inspection Assist Software
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RVI software is a must for streamlining your inspection processes and improving overall efficiency. Olympus inspection assist software provides support throughout the entire process, whether streamlining on-site inspections or assisting with remote report generation.
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Product
Thick Film Inspection
785
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For thicker coatings such as coal tars, extruded and tape coatings, the Model 785 has a range of infinite voltage settings from 1,000 to 15,000 volts.
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Product
3D Inspection Software
Metrolog X4
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Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Product
PCB Assembly Inspection
a3Di
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a3Di is a revolutionary new technology designed to provide accurate, repeatable and fast PCB inspection. The cost saving potential to your business is significant, reducing your overall product inspection costs, increasing your product throughput rates and reducing customer returns.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
Inspection Systems
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Video Inspection Systems with?or without measurement capabilities are an excellent way to evaluate and test small items or items in?difficult to access locations. Many options are available in addition to the measurement capability. Video Inspection is used for a variety of purposes including the ability to see? and measure items that are much smaller than the eye can see or that hand tools can measure. Video systems can also reduce the eye and/or back strain associated with production environments where an operator must look in a microscope all day.
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Product
Xray Food Inspection
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FlexXray has developed leading, certified technology and processes to use advanced x-ray technology to inspect products specifically for food companies. Although they look like a TSA line at the airport, our systems are highly customized machines and processes built specifically to find contaminants like metal, glass, wood, stone, plastic, and rubber in food products of all types. What we do is find needles in haystacks – but the needles we find are even smaller than needles in a haystack. In fact, FlexXray can find contaminants down to 0.8mm or smaller.
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Product
Defect Inspection Systems
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Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Product
Vison Inspection System
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High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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Product
Multibeam Echosounder - Deep Water
HydroSweep MD/30
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The HydroSweep MD/30 is a deep water multibeam echosounder ideally suited for seabed mapping in medium and deep waters down to 7,000 m water depth. The HydroSweep MD/30 utilizes operating frequencies between 24 and 30 kHz to map the acquire bathytric depth information as well as sidescan and backscatter data.
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Product
X-Ray and CT Inspection
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Systems offer a microfocus X-ray source, a large inspection volume, high image resolution and is ready for ultrafast CT reconstruction. They cover a wide range of applications, including the inspection of plastic parts, small castings and complex mechanisms as well as researching materials and natural specimens.
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Product
Deep Observability For Critical Edge Software
DevAlert
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Get cloud-based observability on anomalies in edge devices and embedded software. Detect and analyse issues remotely, during testing and in deployed devices. Use your familiar desktop tools for secure remote debugging.
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Product
CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
Wireless Inspection Cameras
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General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Product
Inspection Tools
Multi Disk Test System (4-Port)
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16 types of inspection modes can be registered and edited. More accurate acceptance inspections can be performed using various types of inspections.High speed data communications using USB interface for communicating with host computer.Acceleration testing for temperature loaded HDD can also be performed. (Optional)Easy attaching and removing HDD using optional plug-in unit.
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Product
Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
