Deep Packet Inspection
check to examine data within a packet. Also known as: DPI
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Product
Robotic Inspection Made Easy
i-Robot
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The i-Robot technology is suitable for all industrial robots; it provides a production-ready metrology solution that is accurate, reliable and flexible. i-Robot is perfectly suited for all applications requiring flexibility and productivity while providing high metrological accuracy.
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Product
Real-time X-ray Inspection Systems
JewelBox Series
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JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Product
Semiconductor / FPD Inspection Microscope
MX61L
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Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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Product
28" Slide Kit, Fits 28"-30" Deep Racks, Supports 180 lbs
310113451
Slide Kit
28" Slide Kit, Fits 28"-30" Deep Racks, Supports 180 lbs.Measure rack depth between mounting rails to determine the slide mounting kit that fits the rack. An extender block kit is available for mounting to racks with recessed rails.
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Product
In-Line Wafer Surface Defect Inspection
ALTO-SD-150/200
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ALTO-SD SERIES IS AN IN-LINE INSPECTION SYSTEM SUPPLYING HIGH THROUGHPUT, FULL SURFACE DEFECT INSPECTION FOR ALL KINDS OF WAFERS INCLUDING SILICON, QUARTZ, SAPPHIRE, COMPOUND AND MEMS WAFERS. HIGH-RESOLUTION CAMERA OPTICS PLUS LED ILLUMINATION GUARANTEE RELIABLE DETECTION OF ALL LOCAL DEFECTS. IT INSPECTS DEFECT SIZE OF 1~ 10 MICRONS, CONFIGURABLE INSPECTION RESOLUTION TO OPTIMIZE DEFECT SIZE VS. THROUGHPUT. THE SYSTEM COMBINES HIGH-PRECISION MEASUREMENT, POWERFUL DATA ANALYSIS AND USER-FRIENDLY OPERATIONS.
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Product
Inspection & Alignment Services
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As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
E-beam Metrology And Inspection
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Our HMI e-beam solutions help to locate and analyze individual chip defects amid millions of printed patterns.
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Product
Solder Paste Inspection System
KY8030-3
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The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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Product
Metrology & Inspection Systems
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Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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Product
ID, CASS, 19 Module, Single Tier, 2.75" Deep Drawn Frame
410113117
ITA
ID, CASS, 19 Module, Single Tier, 2.75" Deep Drawn Frame.
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Product
Macro Inspection
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High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Product
Measuring And Inspection Systems For Rubber And Tires
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The rubber processing industry, as well as the tire production process is supported by Micro-Epsilon with a range of systems for inspection, monitoring and control of miscellaneous processes.
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Product
Vacuum Inspection
INDEC
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INDEC vacuum test systems monitor a wide range of containers during the production process, including bottles, jars and cans, by measuring the cap panel concavity of their closures which is dependent on the vacuum inside. This non-contact inspection reliably identifies defective containers for automatic rejection.
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Enclosure, 50 Module, Hinged Cover Plate, 4" Deep
410112199
Enclosure
The Enclosure for the 50 module ITA is made of aluminum, painted black and secured to the ITA by eight socket head cap screws (included). The top of the enclosure is a hinged cover plate with quarter turn hardware that provides easy access to the ITA’s wiring when required.
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Product
Cargo and Vehicle Inspection
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In a world where threats continue to evolve and concealment techniques become more sophisticated, our customers are facing more complex, difficult missions than ever.
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Product
Pinhole Detection Inspection Kit
Elcometer 270
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The Elcometer 270 Pinhole Detectors Inspection Kit utilises the wet sponge technique and has been designed to set a new standard for wet sponge detectors - a high quality, low voltage detector with similar accessories to a high voltage spark tester.
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Product
Post Wire and Die Bond Inspection Machine
IV-T3300
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IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Product
Thickness and Flaw Inspection
MultiScan MS5800
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Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Product
Evolved Packet Core Commander
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A Subscription based solution for vEPC test automation. The rapid evolution of mobile networking technology is changing MNOs and NEMs requirements for EPC test automation solutions. The new solutions have to be flexible, scalable, quickly and easily deployable in a cloud, and most importantly, affordable.
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Product
Inspection Scope
KI-TK1010
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Inspection scope & cleaning materials for SC, FC, ST connectors, universal 2.5 mm & 1.25 mm ferrules (LC / 1.25 mm option)
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
Laser Sherography NDT Sensor for Post-Production Quality Control or In-Field Component Inspections
FlawExplorer
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The FlawExplorer is a laser shearography NDT sensor designed to be used for post-production quality control applications or in-field (in-service) component inspections. Depending on the application, the sensor can be configured with thermal or vacuum (partial) excitation systems and may also be automated. It incorporates the very latest in phase-shifting technology delivering accurate and reliable measurement results through clear and sharp imaging with sub-micrometer displacement resolution.
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Product
Cleanliness Inspection System / Microscope
CIX90
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The OLYMPUS CIX90 technical cleanliness inspection system is a dedicated, turnkey solution for manufacturers who maintain high quality standards for the cleanliness of manufactured components. The OLYMPUS CIX90 system makes it easy to quickly acquire, process, and document technical cleanliness inspection data to comply with international standards. The system is intuitively designed to guide users through each step of the process so that even novice inspectors can acquire important cleanliness data quickly and easily.
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Product
Nano-focus X-ray Inspection System
X-eye NF120
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Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Product
*Micro-fluoroscopic X-ray Inspection System
Cath-X
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The Cath-X is a bench top system employing Glenbrook’s micro-fluoroscopy technology providing highly detailed x-ray video of the critical components of the needle device. The transparent, safely shielded, view chamber permits the operator to locate the critical areas of the needle for inspection. The x-ray image can be further magnified using the electro-optical zoom feature of the Cath-X.
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Product
Inspection Instrument for Indicators
i-Checker
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The i-Checker is specially designed to calibrate measuring accuracy of dial indicators, dial test indicators, and other electronic comparison gage heads with a stroke of up to 100mm (4").±(0.2+L/100)µm indication accuracy. Directly inspects an indicator with a stroke of up to 100mm (4"). The dial test indicator, bore gage and lever-type inductive head can be inspected with optional accessories. Adjustment of the measurement position is very easily accomplished because of semi-automatic measurement and full automatic measurement functions. Creates and prints out the simple inspection certificate. Saves inspection result as CSV file for reusable inspection result by any kind of software.
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Product
40Gbps Ethernet Packet Generators
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Axtrinet (AXTRINET IS A TRADING NAME )
40Gbps QSFP+ & 10Gbps SFP+ ports, Support optical & copper transceivers, Wire-rate performance on all ports, Compact & Portable, Intuitive Graphical Control Interface, Control multiple units from single GUI, Test Automation with TCL interface
