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Product
Phased Array Ultrasound Instrument
TOPAZ64
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TOPAZ64, a fully integrated, portable 64 channel Phased Array UT device delivering faster, more reliable inspections. It intelligently combines the power of 64 active channels for Phased Array UT applications with the industry’s most advanced Full Matrix Capture (FMC) and Total Focusing Method (TFM) capabilities. Bipolar pulsers provide more energy to punch through thick components.
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Product
Packaging Material testing
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Guangzhou Biaoji Packaging Equipment Co., Ltd.
Packaging Material testing including OTR barrier, COF, lamination bond strength, material analysis, physical properties, tear strength , tensile strength, puncture, slip, blocking, scuffing, film thickness variation, WVTR and so on..
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Product
Thick Film Bleeder
GBR-350
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GBR-350 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 96%). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Product
Automated Metrology System
EVG®50
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High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Product
Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
WAFERMAP
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WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Product
Dimension & Displacement Measurement
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Ono Sokki Dimension & Displacement Measurement - digital linear gauge, rotary encoder, non-contact thickness meter, laser doppler surface velocity meter.
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Product
Cupping Tester
1620
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This robust and user-friendly Elcometer 1620 Cupping Tester is used for assessing the cupping ability of coatings applied to metal sheets up to 1.2mm (0.05”) thick.
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Product
Digital Signage Player With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, DisplayPort++, HDMI, 2 GbE LAN And 4 USB
DSP300-318
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The DSP300-318 is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake). It can deliver dazzling visual images and video advertising in 4K resolution. Measuring only 20 mm in thickness, the ultra slim DSP300-318 is sleek enough to fit in a small area behind signage displays and its fanless and cable free design enables easy installation without any environment limitation. The super slim DSP300-318 is designed to be fanless and cableless, which ensures solid reliability and easy maintenance. It supports HDMI and Dual-Mode DisplayPort (DP++) outputs with support for dual displays. The system also has one M.2 Key E 2230 for Wi-Fi and Bluetooth modules, one M.2 Key B 3042 for 4G LTE and one SIM card slots for 3.5G radio connectivity. Additionally, one M.2 Key M 2280 and one optional 64GB eMMC 5.0 are available for storage. The Intel® Apollo Lake-based DSP300-318 offers a cost-effective, compact yet powerful computing platform that allows plenty of digital signage solutions for advertising, brand promotion and digital menu board applications.
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Product
Flatness, Bow, Warp, Curvature, Glass Thickness
1D-glass Thickness Profile Measuring Instrument GPM2
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Optik Elektronik Gerätetechnik GmbH
Highly accurate automatic measurement of glass thickness distributions. The glass thickness profiler GPM has the function to execute a fast and precise determination of the thickness profile of flat glass samples or another transparent material with a thickness range from 30µm to 700µm (option with sensor type 1) and width to 1200mm. The measuring point distance of the profile measurement can be varied over a micro-step-controlled positioning steering between 0.1mm and 1mm. The measured value accommodation for a scanning point takes place with the help of a special hardware module for image processing algorithms within 40 ms. The entire measuring time for a sample results thus as product from the sample width which has to be measured, the measuring point distance and the measuring time per measuring point.
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Product
Thin Film Composition and Thickness Monitor
P-1000
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The Precision P-1000 readily analyzes compound thin films utilized in semiconductor, superconductor, magnetic and applications.
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Product
Thickness and Flaw Inspection
OmniScan MX ECA/ECT
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With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Product
Profilometer
MicroCam™
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MicroCam™ fiber-based optical non-contact 3D profilometers deliver: High-Speed Non-Contact Surface and Cross-Sectional Inspection 3D Online Measurements, GD&T and Imaging Long Stroke Profilometry with Sub-Micron Resolution Thickness, Roughness and Vibration Measurements Fiber-based Probes which reach into Bores, Tubes, and Crevices
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Product
Silicon O/C Content Tester
OCT-2000
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Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Product
Multiple Angle Laser Ellipsometer
PH-LE
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The multiple angle laser ellipsometer provides film thickness, refractive index and absorption index at the HeNe laser wavelength 632,8 nm with an extraordinary precision and accuracy. It can be utilized to characterize single films, multiple layer stacks and bulk materials.
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Product
Flat One Side Baseplates
BE-FOS
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Bemcoil-FOS (Flat One Side) is made from 18 gauge, 304 stainless steel sheet combined with 11 gauge (0.120 inch thick), 304 stainless steel plate. Bemcoil-FOS can be circuited to allow tapped or clearance hole penetrations for mounting. This material is sometimes specified as a liquid nitrogen cooled water getter plate material in optical testing systems.
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Product
Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
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*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
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Product
UPG-07 Ultrasonic Precision Thickness Gages - Color
UPG-07
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100K thickness datalogger with export to Excel 8 0z. Operates on 2 AA batteries Measures all engineering material Store and Recall setup for use with multiple materials All software options are field-upgradeable Vibrate and color change on alarm Illuminate the keypad on alarm condition Inform the operator when to replace the transducer Simple user-interface
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Product
Ultrasonic Thickness Gauge
SONOWALL® 50
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The SONOWALL 50 features a highly accurate data read out and a large measurement range. An integrated data logger and its user-friendly operation make the device ready for a wide variety of applications. The included software is a convenient tool to store and evaluate the measurements.
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Product
Fuel Cells
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continuously variable contact pressure ensures complete reproducibility of the test conditions ● independent of the thickness of the fuel cell components due to the self-adjusting piston and special sealing concept ● no connection and disconnection of hose- or cable connections for the exchange of cellFixture necessary ● fast &Easy clamping of the cellFixture without tools and precise exchange of the internal cell components ● maximum power density by determining the optimal contact pressure on the active cell surface ● developed for high stress in the field of quality assurance and laboratory environment
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
Memory Module
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Underwater Thickness Gauges
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Cygnus have created a range of versatile underwater and subsea thickness gauges for use by divers and engineers. These measuring devices provide a simple and time-saving method of obtaining ultrasonic thickness measurements in underwater conditions.
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Product
Ultrasonic Thickness Gauge
UTG-1500
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The new PHASE II UTG-1500 is a hand held microprocessor controlled ultrasonic thickness gauge specifically designed for measuring the thickness of metallic and non-metallic materials such as aluminum, titanium, plastics, ceramics, glass and any other good ultrasonic wave-conductor as long as it has parallel top and bottom surfaces.
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Product
Underwater Thickness Meter
Multigauge 3000
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Large bright 10mm display. Integral battery with 55 hours runtime. Can be easily upgraded to a topside repeater. 500m depth rating.
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Product
Multi-Element Standards
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These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
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Product
Thick Film Bleeder
GBR-351
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GBR-351 series resistors are made in a thick film technology, on ceramic substrates (Al2O3 - 965). High voltage resistors have an application as bleeders, which have a task to unload electric charge after disconnection of supply voltage.
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Product
Ultrasonic Thickness Gauge
72DL PLUS
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The Olympus 72DL PLUS™ ultrasonic thickness gauge delivers precision thickness measurements at high speed in a portable, easy-to-use device. With fast scanning, advanced algorithms, and our lowest-ever minimum thickness capability, you can confidently measure the thickness of very thin layers in the most challenging applications.
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Product
Advanced Hydraulic Wedge Action Grips
2742 and 2743 Series
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The Instron advanced hydraulic wedge action grips deliver controlled, constant gripping force using an external hydraulic supply across static and dynamic testing. They support capacities up to 600 kN (static) and 500 kN (dynamic), with interchangeable jaw faces for round or flat specimens. The design ensures jaw face positions remain fixed during gripping (eliminating preload), compensates for changes in specimen thickness, and is ideally suited for use with metals, composites, and plastics.
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Product
Microscope Spectrophotometer
508 PV
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The 508 PV™ Microscope Spectrophotometer is designed to add spectroscopy, color imaging, thin film thickness measurement and colorimetry capabilities to your optical microscope or probe station. It can also be used to upgrade an older microspectrometer with cutting edge optics, electronics and software.
