Hot Box
Known functioning product as test bed.
See Also: Boxes, Decade Box, Anechoic Boxes, Black Box, Breakout Boxes, White Box, Shielded Box, RF Box, Programmable Resistance Box
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Product
Edge AI Compact Box PC With Intel® Core™ Ultra Processor (Series 3)
UNO-258
Box PC
Intel® Core™ Ultra series 3 processors (code name: Panther Lake H) with 25W and 45W TDP supportIntegrated AI acceleration providing up to 180 TOPS total AI performance (120 GPU + 50 NPU + 10 CPU)Xe3 GPU architecture providing up to 2× the graphics performance compared to Arrow Lake-HDual-channel DDR5 SO-DIMM memory supporting up to 128GB (64GB per channel)M.2 E-Key, B-Key, M-Key (supports NVMe) expansion for storage, LTE/5G, and Wi-FiBuilt-in 1000Mbps & 2500Mbps LAN ports with TCC and TSN supportModular I/O board design offering dual LAN or isolated DIO/CANBUS/COM
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Product
Small-Size Modular Embedded Box PC With Intel® Atom™ E3845/Celeron® J1900/J3455
UNO-2372G
Box PC
Intel Atom® E3845, Celeron® J1900/J3455 quad-core processor with 4G DDR3L memoryCompact, robust, fanless and cable-free system with high stabilityModular design with optional SSD/ NVME/ Wi-Fi/Bluetooth/cellular scalabilityMicrosoft Azure IoT Edge and Amazon AWS IoT Greengrass certified
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Modular Embedded Box PC With Intel® Core™ Ultra CPU (Series 2)
UNO-2484V3
Box PC
Intel® Core™ Ultra Processors (Series 2), including Ultra 5 225U & Ultra 7 255U (formerly Arrow Lake)Wide operating temperature: -20 ~ 60 °C; power input: 10 ~ 36 VDCUp to four display outputs (DP + HDMI + 2 x Type-C)4 x LAN, 3 x USB 3.2 Gen2, 1 x USB 2.0, 2 x Type-C4 x RS-232/422/4852 x M.2 M-key, 1 x M.2 E-key, 1 x M.2 B-keyUser-friendly design: side-extractable SIM card, easy RAM & logo replacement, reserved punch-out holes for antennasOptional DDR5 slots x2, each channel supporting up to 32GB, enabling flexible memory expansion and optimized system performance
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Product
Compact Embedded Box PC
Box PC
UNO-2000 box pc series serves as IoT automation gateways, offering flexible configurations with iDoor expandability and stackable modular design.
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Product
NXP I.MX8MPlus Cortex-A53 Edge AI Box Computer
EPC-R3720
Edge AI Box
NXP i.MX8M Plus Cortex-A53 Quad/Dual up to 1.8GHz.On-board LPDDR4 6 GB, 4000MT/s memory.HDMI up to 3840 x 2160 at 30Hz resolution.Dual GbE LAN, 1 USB2.0 and 1 USB 3.2 Gen 1.1 Micro SD Socket & 1 Nano SIM Slot.1 mini-PCIe for 3G/4G, 1 M.2 2230 Key E Slot.Supports Windows 10 IoT Enterprise on Arm, Yocto Linux and Android BSP.4 Kinds of Rear I/O for Each Vertical Focus: IEM, Self Service, Automation and Networking.
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Product
Industrial Fanless Mini PC (Dual 4K Media Player)
EMP-100 Series
Box PC
- Palm size and slim design (H: 28mm)- Intel® Celeron® N6210/J6412 processor- Support 2x HDMI output- Support 12V DC input- 1 x DDR4 SO-DIMM, up to 16GB- 1 x M.2 2280 Key M for optional storage device- 1 x M.2 2230 Key E for optional Wi-Fi/BT Module- 3 x USB 3.2 Gen.1 (Type-A)
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Product
Ruggedized Solutions
ROCK-301
Box PC
Fanless IP65 System with 13th Gen. Intel® Core for Mission-Critical Applications
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Product
Easy I/O Flexibility Fanless Embedded Box PCs
ARK-2000 Series
Box PC
The Fanless PC ARK-2000 series is a brand new design with rich I/O, high flexibility and easy expansion capabilities. The rugged features of this Embedded Fanless PC include wide-input power ranges from 12V to 24V or 9~36V, wide temperature ranges from -20 ~ 70° C and structural strengthening. Multi-functional design technology simplifies your Embedded System applications.
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Product
Mini-ITX Series Fanless Embedded Box PCs
ARK-6300 Series
Box PC
The Fanless PC ARK-6300 series is integrated with a Mini-ITX motherboard with reserved iDoor module for diverse applications .This compact, rugged industrial Embedded System is a convenient yet reliable custom system focused on machine automation, industrial plants, and the IoT market.
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Product
Hot Swap & Hot Plug
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Renesas offers several hot swap and hot plug controllers that enable inserting and/or removing components without interruption to a system.
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Product
Hot Swap & ORing
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Renesas' positive and negative hot swap controllers enable power supply designers to increase the long-term reliability of their systems. Our latest hot swap controllers include advanced features such as IntelliTrip™ (dual-response to degree of overcurrent condition), adjustable current regulation duration, load current monitoring and integrated charge pumps, making them ideal for hot swap applications.
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Product
Breakout Box
FV-EXT
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The handy FiberVision devices FV-EXT1 and FV-EXT2 are designed for the easy integration of FiberVision and Vision Component (VC) smart cameras into your production environment.Central interface for all supply- and communication-cables (switch board)Remote control for all VC based smart cameras such as Caminax or PictorTest of digital camera I/Os and the production environment
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Product
Box IPC
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These IPC are compact design with front I/O and aim at industrial automation and equipment manufacturing applications, such as machine vision and AOI.
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Product
Junction Boxes
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Junction boxes are used for complex power and signal distribution. The junction boxes have redundant mechanical barriers. The mechanical integrity of the junction box is verified during helium leak testing and hydrostatic testing of the jumper assembly. Thermal and pressure compensation is provided by the radially compliant hose or by purpose built bladder compensators, hose lengths must be sized according to the junction box internal dead volume.
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Product
Ultra Slim Digital Signage
DS-015
Edge AI Box
Power by Nvidia 6-core & 8-core Arm® Cortex-A78AE v8.2 64-bit. Multiple AI workloads up to 157 TOPS (INT8) Ultra-slim design with intelligent fan cooling. Connectivity: 3 × USB 3.2 Gen 1 ports, 1 × USB Type-C (for download mode only) Display & Camera Support: HDMI 4K@60 output and GMSL camera interfaces.
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Product
DI Boxes
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Applied Research and Technolgy
Instrument DIs for stage and studio, plus specialized tools to connect virtually any source to a mixer, interface, or PA.
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Product
HOT STICKS & PHASING STICKS
HS-15
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Hot Sticks and Phasing Sticks are voltmeters designed so to permit testing of high-voltage lines or bus bars. The meter is conveniently located, and tilted downwards for easy reading to 5% of full scale.
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Product
CorEdge Box PC's
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The CorEdge line of Box PCs were designed with “Edge Computing” in mind. Corvalent’s edge computing solutions cover a wide range of technologies built to solve problems in mission-critical industrial environments. CorEdge Box PCs support the infrastructure that exists close to the sources of data through expandable IoT embedded systems.Corvalent’s CorBox family is a full line of innovative, x86 processor based systems, providing the latest Intel microprocessor technology. The CorBox family of Industrial Embedded Systems offer a powerful, flexible, and reliable platform, which is the first step to achieving ready-to-go system solutions and improving time-to-market. Each system can be customized to the individual needs of the project, including software pre-installation, hardware installation and configuration, and system branding. Systems can be shipped “ready to plug-in” to manufacturing facilities, or directly to end users in non-branded packaging.5 Box PCs:-CorBox C246 Box PC-CorEdge ARM i.MX 6-CorEdge Box PC Atom J1900-CorEdge Box PC i5-4300U-CorEdge Box PC POE
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Product
RF Shield Box
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A small versatile manual shielding box that is designed for small scale device testing such as wireless network cards and wireless communication equipment.
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Product
Box Recorders
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Generous memory stores 500 event records and over a years worth of summary data. Graphs, charts and summary reports are easily produced using the included ProVision™ software package.
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Product
Breakout Box
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A piece of electrical test equipment used to support integration testing, expedite maintenance, and streamline the troubleshooting process at the system, subsystem, and component-level by simplifying the access to test signals
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Product
Hot Tack Tester
HTT-01
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Jinan Leading Instruments Co., Ltd.
HTT- 01 Hot tack tester is applicable in hot tackproperty test for plastic film, laminated and other packaging film.Meanwhile, it is applicable in peel, shear, tension and other foradhesive, adhesive tape, laminated film, plastic film, paper and other flexiblematerials.
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Product
Shield room / box
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Shield room is the equipment to shut-out the electric/magnetic wave signals from outside and not to leak the electric/magnetic wave signals from inside. We can support as custmized request on room/box size, performance.
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Product
Metal Box Locator
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The Elcometer Metal Detection range includes Valve Box Locators that are rugged and simple to use making them the ideal choice for all location work in all types of terrain.
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Product
Hot Wire Anemometer
CENTER 332
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Air Velocity Measurement: m/s, km/hr, ft/min, MPH, Knots & Build In Temperature ºC / ºF, Humidity %RH, Air Velocity Compensation In Atmospheric Pressure, Air Flow Measure: CMM, CFM, Telescoping Hot Wire Probe
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Product
Medical Box PC
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ADLINK’s medical box pc, compliant with IEC 60601-1 (3.2 edition) / IEC 60601-1-2 (4.1 edition) for safety and performance of medical equipment, is designed to build in space-limited medical devices, such as C-arm and surgical navigation system. The medical grade platform features ADLINK’s MXM Graphics Module supporting NVIDIA GPU, ensuring the acceleration of image reconstruction and beamforming and moreover, significantly reducing data transmission delay, lowering latency and enhancing image quality with AI to assist doctors in detecting diseases or other abnormalities.
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Product
Hot Swap
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Hot swap products from Analog Devices perform all the housekeeping functions necessary to hot swap plug-in boards. These parts also integrate with industry-leading converter and amplifier cores for power monitoring and control with patented circuitry delivering unmatched ±0.3% monitoring accuracy. These devices safely and accurately monitor the power usage in a typical server rack system, which enables operators to remotely monitor each rack individually thus saving energy and minimizing system downtimes.
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Product
Hot Embossing Systems
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EV Group’s series of high-precision hot embossing systems are based on the company’s market-leading wafer bonding technology. Excellent pressure and temperature control as well as uniformity over large areas allow for high accuracy imprints. Hot embossing is a cost-effective and flexible fabrication technology with very high replication accuracy for feature sizes down to 50 nm. The systems are well suited for embossing complex micro- and nanostructures and high-aspect ratio features into a wide range of polymer substrates or spin-on-polymers. The combination with stamp-to-substrate alignment allows alignment of hot embossing to pre-processed substrate structures.
