Lithography
nano fabrication of circuitry.
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Lithography
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EVG’s key competencies in lithographic technology lie in the high-throughput contact and proximity exposure capabilities of its mask aligners and its newly developed, revolutionary and highly versatile maskless exposure lithography systems. These capabilities are complemented by its resist coating and resist development systems with advanced in-house process competences and hands-on development skills.
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EUV Lithography
EXE systems
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EXE, or ‘High NA’, systems are the latest generation in EUV lithography. With a numerical aperture (NA) of 0.55, their innovative new optics provide higher contrast and print with a resolution of just 8 nm.
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DWL 2000/4000 GS Laser Lithography Systems
DWL 2000 GS / DWL 4000 GS
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The DWL 2000 GS / DWL 4000 GS Laser Lithography systems are state-of-the-art pattern generators renowned for their speed and flexibility. These systems leverage advanced grayscale lithography technology that not only complies with the highest industrial standards but also generates complex 2.5D topographies essential for micro-optical applications.
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Computational Lithography
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ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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Lithography Systems
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When it comes to shaping what a chip can do, lithography systems lead the way by transferring intricate circuit designs onto substrates with unmatched precision. From prototyping to high-volume manufacturing, these tools define the geometry of modern microchips, as well performance.
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EUV Lithography
NXE systems
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NXE lithography systems are used in high-volume manufacturing of advanced Logic and Memory chips. The first systems to use ASML’s novel 13.5 nm EUV light source, they print microchip features with a resolution of 13 nm, which is unreachable with deep ultraviolet (DUV) lithography. Chipmakers use our NXE systems to print the highly complex foundation layers of their 7 nm, 5 nm and 3 nm nodes. Read about how EUV lithography went from imagination to reality.
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Lithography
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With steppers for advanced packaging and flat panel display technology, Onto Innovation's latest fleet will meet today's manufacturing challenges head on. Systems are designed to maximize throughput without limited resolution and overlay.
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Electron Beam Lithography System
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Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.
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Metrology Systems
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Metrology is essential to control, optimize and ensure the highest yield in semiconductor manufacturing processes. By implementing feedback loops, both process control and process parameter correction are enabled, which allow compliance to tighter process requirements. EVG's metrology solutions are optimized for lithography and all types of bonding applications, and use non-destructive measurement methods. Customers can choose between integration of the metrology technology within fully automated process equipment, or stand-alone metrology systems serving multiple process steps.
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UV Meters
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OAI’s UV Measurement Instrumentation are the standard for Semiconductor Lithography, MEMS, Sensors, Microfluidics, UV Curing, 3-D Printing, Sterilization, Water Purification and Solar/PVC industries. For over 45 years our meters have earned a reputation for accuracy, repeatability and dependability. We offer full calibration and support services worldwide.
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Scanning Electron Microscope
E5620
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The E5620 is a MASK DR-SEM(∗) product for reviewing and classifying ultra-small defects in photomasks and mask blanks. It implements Advantest’s highly stable image capture technology to easily import defect location data from mask inspection systems and automatically image the locations. Compared to the E5610, our predecessor DR-SEM system, the E5620 features a number of improvements designed specifically to target mask requirements for extreme ultraviolet (EUV) lithography.
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Lithography System
JetStep X500
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The JetStep X500 panel lithography system is optimized for volume manufacturing of high-end AICS and advanced packaging panels. The system incorporates a large field exposure system with advanced features to meet the challenging requirements encountered in production of AICS or panel level packaging, such as; fine resolution to 3µm with large depth of focus (DOF), high overlay accuracy of ±1µm, automatic magnification compensation with independent x and y magnification adjustment of ±100 ppm, and automatic handling of panel substrates of various dimensions, thicknesses, and levels of warp.
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EUV Lithography Systems
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Using extreme ultraviolet (EUV) light, our NXE and EXE systems deliver high-resolution lithography and make mass production of the world’s most advanced microchips possible
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Product
Reticle/Mask Particle Remover
RP-1
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The RP-1 automatically removes particles from the reticle/mask by air (or N2) and vacuum suction. Routinely removing the particles before the lithography process extends the replacement cycle of the pellicle and cleaning cycle of the mask, thereby contributing to a reduction in running costs.
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Product
µMLA Maskless Aligner
µMLA
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The µMLA Maskless Aligner represents the pinnacle of tabletop maskless lithography technology, continuing the legacy of innovation established by the MLA family since its inception in 2015. As the entry-level solution built on the advanced µPG platform, it provides unmatched customization and flexibility, making it ideal for research and development applications. With features such as Raster Scan Mode and Vector Scan Mode, users can achieve variable resolution tailored to specific project requirements. This system excels in high-precision microstructuring applications, ranging from microfluidics and sensor fabrication to the intricate patterning of 2D materials and microlens arrays.
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IDA Electrodes
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Interdigitated Array (IDA) electrode is an electrode developed for electrochemical measurements to be performed in a very small quantity of the sample. IDA electrode could be applied for the detection and reaction analysis of the compounds in a small quantity of the sample. IDA electrode is a microelectrode pattern fabricated by using the lithography technology. The Electrodes are composed of 65 pairs. In each one of the pair has a function of the oxidation and reduction electrodes.
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DWL 66⁺ Laser Lithography System
DWL 66⁺
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The DWL 66⁺ Laser Lithography System is a cutting-edge platform that combines advanced grayscale capabilities and the highest resolution available in direct-write laser systems. This machine is expertly designed for research and development in fields such as microelectronics, MEMS, and photonics, providing unparalleled versatility in both direct writing and low-volume mask making. With its minimum feature size of just 200 nm and 65,536 grayscale levels, the DWL 66⁺ surpasses traditional optical lithography solutions, ensuring precise pattern generation for a multitude of applications including sensors, optics, and quantum devices.
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Dry Systems
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Chips are made up of many layers stacked on top of one another, and it’s not necessarily the latest and greatest immersion lithography machines that are used to produce these layers. In a given chip, there may be one or two more complicated layers that are made using an EUV lithography machine, but the rest can often be printed using ‘older’ technology such as dry lithography systems. This is certainly more cost-effective for customers, since these older machines are less expensive to purchase and maintain. Read about how dry lithography systems are enabling progress.
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Semiconductor
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Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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LITHOSCALE® Maskless Exposure Lithography Systems
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Maskless exposure lithography systems represent an entirely new product platform of EVG lithography equipment.
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Product
Laser Head
5517FL
Laser Head
The Keysight 5517FL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Product
Variable Angle Spectroscopic Ellipsometer
VUV-VASE
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The VUV-VASE variable angle spectroscopic ellipsometer is the standard in optical characterization of materials used in lithography applications. Its measurement range spans vacuum ultraviolet (VUV) to near infrared (NIR). This provides incredible versatility to characterize numerous types of materials: semiconductors, dielectrics, polymers, metals, multilayers and now liquids such as immersion fluids.
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Interference Lithography Gratings
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Interference lithography is an optical nanolithography technology for the fabrication of extensive periodic nanostructures. Critical dimensions of less than 50 nm can be realized. At AMO two interference lithography tools are installed. One setup for extensive, high quality gratings with fixed periods, the other more flexible tool allows quick prototyping. We offer grating fabrication on silicon, silicon dioxide and other substrates with tailored pitch, etch depth and size.
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Automated Measurement System
EVG®40NT
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The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography relevant parameters like critical dimension, as well as bond alignment accuracy.Because of the high-measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
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UV LED Light Source
Model 32
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This new UV LED lightsource is designed and engineered by the proven lithography experts at OAI. The lightsource delivers a number of unique benefits, the most consequential of which is consistent intensity over an exceptionally long life. The lightsource is highly energy efficient, requires no maintenance or light replacement, and contains no mercury.
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CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
Laser Head
5517EL
Laser Head
The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Patterning Simulation
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KLA’s patterning simulation systems use advanced models to explore critical-feature designs, manufacturability and process-limited yield of proposed lithography and patterning technologies. Our patterning simulation software allows researchers to evaluate advanced patterning technologies, such as EUV lithography and multiple patterning techniques, without the time and expense of printing hundreds of test wafers using experimental materials and prototype process equipment.
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Refurbished Systems
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Refurbishing ‘classic’ PAS 5500 and TWINSCAN lithography systems for a new life and a new purpose
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Product
VPG 300 DI Maskless Stepper
VPG 300 DI
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The VPG 300 DI is an innovative direct write lithography system that redefines the capabilities of microfabrication. Tailored specifically for high-resolution applications, the VPG 300 DI seamlessly integrates the precision of traditional i-line steppers with the advantages of a maskless workflow. Leveraging an ultra-high-speed exposure optical engine, this system accelerates the innovation cycle from weeks to mere hours while maintaining exceptional imaging quality and patterning accuracy. With a minimum feature size as small as 500 nm, this state-of-the-art equipment is engineered to meet the rigorous demands of both industrial environments and academic research.
