SoC
A complete computer "System on a Chip".
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Product
SoC Tester
UltraFLEXplus
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The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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Product
SoC Verification
TrekSoC
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TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Product
SoC Integration At RTL
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Before logic synthesis, STAR enables full implementation capabilities towards IP and connectivity insertion with a real-time monitoring of the integration progress. This enables SoC creation in minutes and maximize design reuse from existing projects.
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Product
Automotive System-on-Chip (SoC)
R-Car
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"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Product
SMARC Short Size Module With Qualcomm® QRB5165 Series Octa-Core SoC
LEC-RB5N
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- Qualcomm® Kryo™ 585 CPU (8x Arm Cortex-A77 cores)- Qualcomm® Hexagon™ Tensor Accelerator (HTA) running up to 15 TOPS- 4K HDMI/MIPI DSI display, MIPI CSI cameras- 2x PCIe x2 Gen3- 2x GbE Ethernet- 2x USB 3.1/2.0 and 4x USB 2.0- GPIO/SD and UFS- 5VDC +/-5% voltage input
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
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The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
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The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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Product
High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
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The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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Product
COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
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The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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Product
SOC Battery Tester
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This sophisticated battery test equipment allows the battery tester to exercise and explore the battery’s internal profile and produce a true state of charge revealing the batteries true AHR capacity and ability to perform under load.
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Product
SoC Test System
T2000
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SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
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Product
Intel® Celeron N3160/N3060 SoC, Intel® Atom E8000 SoC, 3.5" SBC, DDR3L, VGA, HDMI, 48-Bit LVDS, 2GbE, Mini PCIe, MSATA, SUSI API
PCM-9310
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Intel® Celeron QC/DC SoC, Intel® Atom QC, DDR3L-1600MHz SODIMM up to 8GBDirectX11.1, OpenGL4.2, OpenCL1.2, 3 independent display: VGA + HDMI + LVDS/eDP*Rich I/O: 4 x COM, 2 x SATA, 2 x USB3.0, 4 x USB2.0, TPM2.0, SMBus/I2C, GPIO, full-size Mini PCIe w/ SIM holder, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
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The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
Intel® Xeon™ D SoC (Skylake-D), PCIe Gen3 And Dual 40GbE, 6U VPX
VPX762
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The VPX762 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel Xeon D-2183IT or D-2143IT processor, the efficient SoC design has low power consumption and integrated PCH technology.
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Product
COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
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Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
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The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
I-Pi SMARC Development Kit Based On Intel® 6th Gen Atom® X6425E Quad-Core SoC
I-Pi SMARC Elkhart Lake
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The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit powered by Intel Atom x6425E quad-core SoC with integrated Intel UHD graphics and comprehensive high speed interfaces. Development-focused, this kit also supports the latest version of the Intel® Distribution of OpenVINO™ toolkit, which features more deep-learning models, higher inferencing performance, and fewer code changes, making developing ever simpler.
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Product
Test System Optimized for High-Performance Digital and SoC
ULTRAWAVEMX44 and ULTRAWAVEMX20-D16
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Teradyne is the leader in RF/wireless device testing and has a large installed base of UltraFLEX test systems with the UltraWave24 RF instrument. As new devices for handset and base station applications are introduced using mmWave technology, Teradyne’s mmWave instrumentation has expanded in anticipation of new testing demands.
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Product
PCIe/104 OneBank SBC w. Dual 1GHz ARM9 & 1Gbyte DDR3
EMC²-Z7015
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Sundance Multiprocessor Technology Ltd.
The EMC²-Z7015 is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC, Artix-7 FPGA fabric and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-Z7015 is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
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The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
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ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
Battery Test Equipment
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Improper functioning of battery systems installed in utilities, power plants, telecommunication systems, industrial applications and etc., can cause severe failures of the supported equipment and loss of critical information. Therefore, the battery test verifies their actual SOC (State of Charge) or SOH (State of Health) and prevents unwanted scenarios which could result in a significant budget loss as well as endanger of human lives.DV Power battery test equipment is able to perform the following battery measurements, using BLU and BVR devices:- Voltage (String and Cell)- Capacity- Temperature- Density of electrolyteAll of the above-mentioned measurements are performed with the highest accuracy. The advanced DV-B Win PC software enables collecting both numerical and graphical results. These features provide an easier and more efficient analysis. After the test, DV Win software generates a test report with a single click. A user can easily customize the report and save it in different formats, such as CLS, PDF, Word, or RTF.
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
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LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Product
Computer-On-Module
CM22301
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LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
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Product
RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, CANbus, 2 LANs And DIO (2-in/1-out)
IFB112
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The IFB112.supports the low power consumption NXP (Freescale) i.MX6UL ARM® Cortex™-A7 528MHz SoC. The design concept of IFB112 is aiming to meet the demands of mission-critical applications. The gateway controller with IP30-rated aluminum and steel enclosure supports an extended operating temperature ranging from -40°C to 70°C, a wide voltage range of 9V - 48V DC power input with terminal block, and has been designed to withstand vibration up to 5G. For system integrators with wireless communication needs, the IFB112 has one PCI Express Mini Card slot, one SIM card slot, and two internal antennas. It supports one serial port, two LANs and one CANbus port to enable fast and efficient data acquisition and communication. Its digital I/O port provides users with a convenience of digital devices connection.
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Product
Automotive Infotainment SoCs
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ST’s portfolio of infotainment systems on chips (SOCs) includes a complete offer of automotive-grade devices for a wide range of infotainment systems ranging from turnkey Accordo2 processors for car radio applications and Display Audio systems, featuring smartphone mirroring and support of rear-view cameras, up to powerful Accordo5 multi-core processors with best-in class 3D graphics and video decoding capabilities, to address multi-standard smartphone replication technology as well as Digital Instrument Cluster applications.
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Product
Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, HDMI/LVDS And LAN
PICO312
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The PICO312 is a palm-sized fanless pico-ITX motherboard built with the latest 14 nm Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake SoC). One 204-pin DDR3L-1867 SO-DIMM socket supports system memory up to 8GB. The tiny 2.5” pico-ITX embedded board features Intel® Gen9 graphics engine bringing a true high definition visual experience with dual display configurations through one LVDS and HDMI. In addition, it was designed for special needs of fanless operation under temperature from -20°C to +70°C. The PICO312 features a full-sized PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors with additional signals including one PCIe x1 lane, one LPC, one DDI, four USB 3.0 ports, one SMBus and one HD audio, giving this SBC high expandability to meet all requirements.
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Product
Gate-Level Design Optimization
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After logic synthesis, STAR helps reaching power, performance and area (PPA) requirements for complex SoCs is becoming a real challenge. Large design netlists are restructured and optimized to reach aggressive PPA requirements, cost-effectively.
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Product
3U OpenVPX FMC Carrier
VF361
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Sundance Multiprocessor Technology Ltd.
The VF361 is a 3U OpenVPX module that leverages on the ALTERA Arria ® V SoC FPGA, ARM Cortex-A9, and Texas Instruments Keystone Multicore DSP technology to provide a high bandwidth processing platform, ideally suited for computation and bandwidth intensive applications such as RADAR, networking, SIGINT, EW, SDR and Video.
