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Thermal Test
Designed to produce a temperature change in a device. The magnitude and rate of this change should induce a sufficient thermal stress fatigue to identify sources of potential failure without causing catastrophic failure of all components. (sigmasystems.com)
See Also: Thermal, Thermal Shock
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Device Thermal Test Systems
Thermal Engineering Associates, Inc.
Thermal test system combines the test and measurement capability of dedicated instruments with the ease of operation and data collecting capability offered by graphical-user-interface-driven software operating on an integrated computer.Diodes (PN, Schottky, LED, varactor, PIN), Stacked Diodes (Hi-V Rectifiers & LEDs), Laser Diodes, Transistors (Bipolar, MOSFET, IGBT) & Diodes, Integrated Circuits (Application & Thermal Test Die).
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Bypass Diode Thermal Test System
King Design Industrial Co., Ltd.
* Power: the heating board control panel uses 220V single-phase power.* Power consumption: 1.0KVA, 1000W(Max)* Volt: 220VAC* Current: 4.5A* Heating board: one controller per board* Power rate: room temperature raise to 75°C± 5°C within one minute.* Heating board dimension: 500mm x 1,000mm* 6-sheet electrical heating boards test: used to test the 2,200mm x 2,600mm module. It can be customer-designed.* The length of board power cable and thermal sensor cable shall exceed 3,000mm.* To get uniform heating effect, the electrical board is sandwiched by 2mm aluminum sheets at both sides of board.
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MCB Thermal Verification Test Bench
The test system is a special version of the thermal test test system in the sense that the test jig is primarily designed to hold and connect multi pole MCBs for thermal verification so that each pole can be verified to trip within the IEC time band after the MCB has been riveted. This test ensures the trip verification of MCB so as to trip all the 4 poles at once when overload is detected in one single pole. In short, this is a verification-only bench.
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Thermal Stability Test System
Premier Electrosystems' Thermal Stability Test Setup is used to test thermoplastics and PVC (Plasticized Polyvinyl Chloride) materials. When exposed to continuous heat, these materials degenerate and emit harmful acidic gases. The instrument is manufactured for testing PVC materials for their thermal stability at higher temperature.
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Thermal Shock Test Chambers
How well does your product stand up to the shock of extreme thermal temperature changes? Tenney Environmental's thermal shock test chambers take products from 200°C to -65°C in just seconds.
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Thermal Abuse Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBELL Thermal abuse test chamber protect for short circuit caused by incorrect operation of the operator and battery electrode, battery positive and negative connection, etc
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Thermal Abuse Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell's Thermal abuse test chamber is suitable for standard IEC 62133-2017, UL 1642 and GB 31241-2014.
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IEC60884 Fig38 Thermal Compression Test Device For Plug Testing
IEC60884 fig38
Shenzhen Chuangxin Instruments Co., Ltd.
IEC60884 fig38 thermal compression test device for plug testingUsed to evaluate the pressure resistance of electrical accessories and wall mounted mounting boxes under heatStandard: GB2099.1-2008 Articles 24.19 and 25.4 and Figure 38, IEC60884-1 Figure 38, etc.
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Thermal Test Chip
Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Thermal Shock Test Chamber (3 Zone)
Guangdong Test EQ Equipment co., Ltd.
- Divided into a high-temperature zone, low-temperature zone, and test zone. The test product is placed in the test zone, and the temperature from the high-temperature zone or low-temperature zone is applied to the test zone for thermal shock. The test product remains static during the test.- Equiped with a touch-screen control interface for easy operation.- Temperature is transferred to the test zone using a wind route switching method to perform thermal shock testing.- The maximum duration of high-temperature or low-temperature shock can reach 999 hours, and the maximum cycle period can reach 9999 cycles.- The system can operate in automatic cycle mode or manually select specific shocks. It can be set to perform two-zone or three-zone shocks, as well as cold-to-hot or hot-to-cold transitions.- The cooling system utilizes a dual refrigeration system, providing fast cooling. Water cooling is employed as the cooling method.- Testing can be performed at room temperature.
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Automated Thermal Stress System
ATSS Series
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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Semiconductor Package Wind Tunnel
WT-100
Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Precise Temperature Forcing System
TA-5000A Series
The ThermalAir TA-5000 Series of temperature forcing systems bring precise thermal testing capabilities directly to your test application, exactly localizing to where thermal conditioning temperature cycling is required. ThermalAir TA-5000 temperature systems provide flexible thermal test solutions for an array of products and technologies.
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Targets
Targets from group A are developed to support mostly testing infrared imaging systems understood as thermal imagers. These targets can be used also in testing visible/near infrared cameras or SWIR cameras but such application is not optimal. IR targets are mostly used in DT systems for testing thermal imagers and in MS systems for testing multi-spectral systems.
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OSFP-XD Thermal Load with a Controller Board
In an everchanging industry, new form factors are launched to support higher speeds like 800G and later, 1.6T. With the speed per lane increasing exponentially, the need for thermal and cooling tests also rises with new requirements and demands.MultiLane is offering a OSFP-XD thermal load with a controller board, with the goal of emulating transceiver thermal behavior, but also to test cooling systems.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Temperature Humidity Environmental Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Temperature and Humidity Test Chamber is able to simulate a wide range of temperature and humidity environment condition for testing various products and components. It is widely used for basic thermal cycling test and accelerated stress test. We provide 6 standard models, test cabinet from 80L to 1000L, customized size is also available.
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Instruments
Advanced Thermal Solutions, Inc.
ATS designs and fabricates the most extensive line of thermal test instruments specifically designed for the electronics industry. These research-quality, state-of-the-art instruments include Pressure, Temperature and Velocity Measurement Systems, Airflow and Heat Flux Controllers, Micron-level Thermography Systems and Cold-Plate Thermal Characterization Systems.
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MCB Thermal + Magnetic Characteristic Test Bench
The test system is a special version of the thermal + Magnetic test test system. The single power source able to deliver either thermal or magnetic test parameters set on the PC by the user.
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Collimators
Collimators are optical systems used to imitate standard targets placed in "optical infinity" (very long distance). The collimators are used for projection of image of reference targets into direction of tested imagers. According to type of optical elements used in design, collimators are divided into two groups: reflective collimators and refractive collimators. Reflective collimators due to their wide spectral range are almost exclusively used in systems for testing thermal imagers and are also preferable in systems testing TV cameras, SWIR imagers, laser systems or multi-sensor surveillance systems. Refractive collimators are mostly used in systems for testing night vision devices or TV cameras working in visible/near infrared range.
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Temperature Chambers For Thermal Tests
Before anything reaches out for market distribution, you would need to determine its exact quality and performance to that follows to the point with readings. Thermal and environment testing are some of the most positive aspects to get your materials tested for their underlying performance capacity and reliability in quality.
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Thermal Shock Test Chamber
observe the product characteristics and failure occurrences caused by different materials and their thermal expansion coefficients, thermal shock testing is subjected to the product. In thermal shock testing alternating high and low temperatures are fed in the chamber. WEIBER designs and manufactures customised THERMAL SHOCK CHAMBERS with separately controlled temperature zones (2 zone and 3 zone), liquid to liquid (2 zone) depending on configuration of the chamber chosen.
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Temperature Calibration System
Thermal Engineering Associates, Inc.
Systems for determining relationship between temperature-sensing junction voltage versus junction temperature of diodes, integrated circuits and thermal test die. Provides internal current sources, voltage measurement to 1 mV, and temperature measurement to 0.1ºC. 16-channel capability with optional printer and serial port data output.
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Double-deck High and Low Temperature Environmental Test Chamber
Guangdong Bell Experiment Equipment Co.,Ltd
DGBell’s Double-deck High and Low Temperature chamber was designed to test battery cell combined with charge and discharge equipment, and also available to thermal test for small products and components.
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Digital Closed Loop Control Thermal and Mechanical Testing System
3800 System
The Gleeble 3800 is a fully integrated digital closed loop control thermal and mechanical testing system. Easy-to-use Windows based computer software, combined with an array of powerful processors, provides an extremely user-friendly interface to create, run and analyze data from thermal-mechanical tests and physical simulation programs.The result is a system unequaled for physical simulation and thermal-mechanical materials testing.
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Thermal Testing
At E-Labs, Inc., we support thermal cycling and thermal bakeout vacuum testing requirements. During thermal cycling, the unit experiences repeated heating and cooling as it would when exposed to the harsh environment of space. During thermal bakeout, flight equipment is subjected to an outgassing reduction process so as to decrease the chance of molecular contamination of the spacecraft instrumentation.
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2 Zone Thermal Shock Test Chamber
2-Zone Thermal Shock Testing Equipment with programmable electronics.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Temperature/Humidity Vibration Test Systems
EHVC SERIES
The EHVC Series is designed for highly accelerated life testing, the demand of which from customers is increasing today. This is a joint system of the AGREE chamber and thermal shock chamber that we have manufactured and makes the temperature rate up to 20℃/min feasible with a compressor only. With this feature, the highly accelerated life test such as AGREE tests, most thermal shock tests can be performed with one unit.
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Thermal Testing
A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests. Differential Scanning Calorimetry (DSC), Thermogravimetric Analysis (TGA), Thermomechanical Analysis (TMA), and Dynamic Mechanical Analysis (DMA)
