3D
three dimensions.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Laser Scanning Systems
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QFP markets manually handled and optically tracked 3D laser scanners that set new standards in the metrology measurement industry. The products are characterized by exceptional performance, ease of use and cost-effectiveness and are the perfect solution for the metrology room as well as for the production line, stand-alone or automated.
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Product
3D Machine Vision Systems
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Whether performing a single profile measurement or scanning an entire surface in 3D, Cognex has the most powerful and robust 3D machine vision tools. Manufacturers in all industries trust Cognex technology to deliver high accuracy surface feature measurements that go beyond the capabilities of 2D machine vision technology.
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Product
The Ranger Series
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The Ranger Series is designed for the most demanding mapping applications, no compromises made. With a 1350 meter laser range, this system produces photorealistic 3D point clouds of very large regions. The Ranger is a true universal payload in that it’s designed for manned and unmanned aircraft as well as ground vehicles.
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Product
Micro-spot DUV Spectroscopic Reflectometry
FilmTek 2000 PAR
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Scientific Computing International
A low-cost solution for high-throughput, fully-automated mapping of patterned wafers for development and production environments. Utilizes patented parabolic mirror technology to measure wavelengths from DUV to NIR with a spot size as small as 13µm. Fully user-customizable wafer mapping capabilities rapidly generate 2D and 3D data maps of any measured parameter.
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Product
Portable Measuring Arms
A-LINE
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Trimos A-line portable articulated measuring arms allow an extremely easy and accurate 3D measurement.
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Product
3D SPI
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Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Product
Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
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In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Product
Reverse Engineering 3D Scanner
peel 3.CAD
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peel 3.CAD is your go-to fully integrated 3D scanning solution for all your reverse engineering needs. Extract all the information you need and send them right to your preferred CAD software.
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Product
Laser Scanning Microscope
OLS4100
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The LEXT OLS4100 is a Laser Scanning Microscope to perform non-contact 3D observations and measurements of surface features at 10 nanometer resolutions. It also features a fast image acquisition and a high-resolution image over a wider area.
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Product
Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
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The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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Product
Global Standard Model For 4 Point Probe Sheet Resistance Automatic Measurement System
RT-3000/RG-1000F
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*Fully automatic system for large sizes of flat panel with glass loading robot*Tester self-test function, Measurement position correction function, wide measurement range*Min. 0.1 mm meas. resolution and user programmable test pattern*Host (CIM) communication and 2-D/3-D Mapping software
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Product
Stereo Vision
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Our active Stereo Vision systems from ams provide high quality 3D imaging, representing an attractive cost versus performance ratio solution.With the hardware and software stack offered by ams, 3D vision and applications such as face-ID can be easily designed in to a product and brought up to high volume production.
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Product
X-ray Microscopy
Xradia Family
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✔ Characterize the properties and behaviors of your materials non-destructively.✔ Reveal details of microstructures in three dimensions (3D).✔ Develop and confirm models or visualize structural details.✔ Achieve high contrast and submicron resolution imaging even for relatively large samples.
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Product
HDMI / 3G Reference Media Player
VQS-300
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Versatile destop/rackmount unit, loaded with unique sophisticated set of static and dynamic test patterns - see more details in separate VQL for VQS Presentation Multi-format HDMI and 3G-SDI outputs, digital and analog AV outputs 2.5 ppm accurate system clock to meet full 3G-SDI broadcast specs Front side bay for detachable SATA HDD – up to 2 TB of content VQL - Library of unique sophisticated dynamic test patterns and sequences LIve clips and 3D Video Tests, 5.1 Surround Sound and LR Stereo Audio Tests All commonly used resolutions, aspect ratios, frame rates and interlace modes Easy expansion with any external USB storage device: BD/DVD, HDD, FD.
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Product
Semi-Automatic Probe Sheet Resistance/Resistivity Measurement
CRESBOX
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• Multi-points measurement and Mapping display- 2-D map / 3-D map graphic display- Multipoint pattern measurement is programmed (maximum 1225 points) and random pattern is programmable by operator.• Film thickness conversion function from sheet resistance• Measurement data base link with Excel via CSV format file• Software language can be switched in English /Japanese by operator
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Product
Areal Confocal 3D Measurement
µsurf
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The measuring system of the µsurf-product line enable automated 3D surface measurements of roughness, topography, layer thickness and volume. µsurf-measuring systems are available in different designs: from compact mobile systems and laboratory solutions up to multisensor setups on granite portal for use near production lines.
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Product
Machine Vision Software
Scorpion
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Scorpion Vision Software is a powerful, flexible and extremely expeditious system software tool for industrial vision. The most advanced 2D and 3D solutions are made without any kind of programming.
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Product
BlueViewer Software
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Quickly view .xyz 3D point clouds filesTake accurate point-to-point measurementsSupports a variety of color maps including jet, gradient, and intensityOverlay multiple point clouds
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Product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Product
EM & Thermal Simulation Software
SEMCAD X
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Schmid & Partner Engineering AG
SEMCAD X is the latest generation of 3-D FDTD full-wave simulation software offering unprecedented levels of user-friendliness, speed & memory efficiency. Its application range has been further greatly extended by incorporating the world's first EM ADI-FDTD solver.
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Product
Profilometer
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NANOVEA Optical Profiler is a 3D, non-contact profilometer designed with Chromatic Confocal technology, which uses wavelengths of light to accurately determine physical height. The Optical Profilers NANOVEA offers include compact, stand-alone and portable profilometer models. High-speed sensors are available to scan large surface at high accuracy.
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Product
ATX Industrial Motherboard With LGA1150 Socket Intel® Xeon® E3-v3 Processor, Intel® C226, ECC DDR3, USB 3.0, SATA 3.0, Dual LANs, DisplayPort/DVI-I/HDMI And CFast™
IMB210
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The IMB210 is an advanced ATX industrial motherboard based on the 4th Generation Intel® Xeon® E3/ Core™ i7/i5/ i3/ Pentium®/ Celeron® processors (codename: Haswell) in LGA1150 socket with Intel® C226 PCH. The optimized IMB210 is specially designed for workstations through better computing and visual performance ideally used in every major industry for tasks ranging from financial modeling to designing complex buildings and vehicles. With its built-in Intel® HD Graphics P4000, this industrial grade motherboard delivers great 3D visual performance with triple display capability through DisplayPort, HDMI and DVI-I ports demanded by professional-grade CAD and media/entertainment fields. In addition, the IMB210 supports Intel® Turbo Boost 2.0 technology, Intel® Hyper-Threading technology, Intel® HD Graphics with DX11 support, 3-D Tri-Gate transistors, 32 GB ECC DDR3 1600/1333 memory, and PCI Express 3.0 x16 slot. It also features Intel® Active Management Technology 9.0 (iAMT), Trusted Platform Module 1.2 (TPM), SATA RAID, as well as PCIe x4 expansion making it ideal for applications with added security features.
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Product
Surface Profilers
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Taylor Hobson offers a world leading range surface form, surface finish and metrology solutions for 3D contour,ideal for the most demanding applications.
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Product
Large Surface Defect Gauge
4D InSpec® XL Surface Defect Gauge
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The 4D InSpec XL Surface Defect Gauge expands 4D Technology’s 4D InSpec product line—they’re the first handheld, precision instruments for 3D non-contact surface defect measurement.
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Product
Computer Vision and Visualization
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Fraunhofer Institute for Telecommunications
The Computer Vision and Visualization Department consists of three research and development groups working on innovative technologies in the field of monocular, stereoscopic and multichannel video processing. It covers the entire processing chain from original capture to rendering, with a focus on advanced 2D and 3D analysis, post-production synthesis, computer vision, image understanding, human-machine interaction, and immersive media , The department also has expertise in processing complex systems consisting of multiple cameras, sensors, displays, projectors or screens.
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Product
3D Scanning Reverse Engineering Services
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Reverse engineering is oftentimes a catch-all term used for many design and engineering applications. But trust us, there is so much more to this category for the uses of our 3D scanners, portable CMMs and laser trackers. Also, reverse engineering tends to imply that the 3D scanning will be used solely for product design, when in fact it can be used to address many other engineering functions such as:
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Product
Eyepiece-less Stereo Microscopes
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Vision Engineering’s eyepiece-less stereo microscopes are better for users and for business. Their ergonomic design lets the operator sit back in a comfortable position, and the expanded pupil technology delivers an enhanced 3D view of the subject. The relaxed natural posture makes it easy and to work with tools and to manipulate the subject. Greater comfort and ease of use directly translate into greater productivity and quality.
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Product
DIgital 3D Image Correlation System
Q-400
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The Digital 3D Image Correlation System Q-400 is an optical measuring device for true full-field, non-contact, three-dimensional measurement of shape, displacements and strains on components and structures made from almost any material.The Q-400 system is used for determination of three-dimensional material properties in tensile, torsion, bending or combined tests. In addition, deformation and strain analysis can be applied to fatigue tests, fracture mechanics, FEA validation, and much more.
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Product
3D Sensors (Main Screen)
surfaceCONTROL
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surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as shape deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.
