Inspection
check and evaluate to a quality control value.
See Also: Inspection Systems, Inspection Services
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Product
CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
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DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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PHOTOMASK INSPECTION MACHINE
NEGATIVE FILM
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Negative film and photomask inspection originated from the extensive use of printed circuit boards. Negative films and photomasks are used in large quantities. The early detection method is to use the "inspection light table" for inspection, which requires too much manpower and material resources, and manual testing may be due to eye fatigue and negligence.
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Printing Quality Inspection Machine
TQM AVI
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Landrex Technologies Co., Ltd.
Printing Quality Inspection Machine
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Product
Video Inspection Scope
BK3000
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• Integrated 8.5 mm high-res imager allows for ease of use and ensures the product is always ready to go. Imager is resistant to dust, dirt, and water ingress for 30 minutes at depths of up to 3 meters.
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Connector Inspection
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The USB Connector Inspection System features easy focusing with high resolution imaging. The system includes standard software that provides image display, image capture, digital zoom, auto calibration, and basic analysis tools. Pass/Fail analysis and reporting features are optional software features. The Inspection System scope is fully compatible with the FiberWarrior Pro OTDR as well as other FiberWarrior Pro test sets, providing a full fiber optic testing solution.
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Articulating Inspection Cameras
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Articulating Inspection Cameras with probes whose tips can be precisely turned (articulated) by the user up to 150 in two directions. Articulation enables inspection of targets located off-axis (even "behind" the probe) or in a tight space without removing the probe. The Inspection Cameras currently offered include the DCS16HPART, its wireless cousin the DCS18HPART, and the DCS665-ART Articulating Inspection Cameras.
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Product
Automatic Double-Sided Bare PCB Final Inspection AVI System
FI-18 Series
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InScan Limited (SIP) Co., Ltd.
InScan FI-18 is a compact and high performance fully automatic double sided AVI system for Final Inspection of PCB boards.The setup is based on golden board and CAD data which greatly simplifies the setup process. The FI-18 series inspects and processes a double sided board sized 210X300 mm 5.5 sec. Superior interline high resolution CCD sensor.
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Real-time X-ray Medical Device Inspection System
The Bench-X
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Our latest real-time, compact system used for Medical Device X-ray Inspection. Very configurable and compact with high resolution at relatively low radiation levels.
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Product
Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, ITA.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Fiber Optic Inspection & Cleaning
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One of the most basic and important procedures for the maintenance of fiber optic systems is to clean the fiber optic equipment.
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Solder Paste Inspection Machine
3D SPI
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The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Installation of Visual Inspection of the Inner Surface of Hollow Cylindrical Parts
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Create an installation that allows visual inspection of the inner surface of hollow cylindrical parts with the ability to display the resulting image on a personal computer monitor with its subsequent saving in the JPEG format.
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TO-CAN Package Inspection System
7925
System
Chroma 7925 is an automatic inspection system for TO-CAN package. The appearance defects over 30 um like lens scratch, partial are clearly conspicuous by using advanced illumination technology. Because the height variation of tray and package exists, Chroma 7925 can calculate the focus distance and compensate to overcome the variation with auto focus function.
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PosiTector Inspection Kits
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PosiTector Inspection Kits contain a PosiTector gage body (Standard or Advanced) and 3 probes – coating thickness, environmental and surface profile, as well as, accessories in a convenient hard shell carrying case.
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3D Inspection Service
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The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Inspection Scope
KI-TK1010
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Inspection scope & cleaning materials for SC, FC, ST connectors, universal 2.5 mm & 1.25 mm ferrules (LC / 1.25 mm option)
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First Article Inspection Services
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API’s, on-site, first article measurement services provide inspection data on parts and assemblies with direct comparison against CAD models or drawings. Generated 3D measurement data from our portable metrology equipment and 3D scanners offers a comprehensive analysis of the physical part under measurement. Inspection reports can include 3D color maps or generated 3D models for detailed computer analysis.
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Bare Wafer Inspection System
LS-6700
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Hitachi High-Technologies Corp.
High sensitivity (50nm:Bare). High accuracy for COP/CMP discrimination (85%). High throughput (80 wph @300mm).High positioning accuracy (+/-30m). Wafer Size 300mm / 200mm.
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Real-time X-ray Inspection Systems
JewelBox Series
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JewelBox x-ray inspection systems feature ultra-high resolution, powerful microfocus x-ray tubes, five-axis, and positioners. The JewelBox Series is divided into three broad categories: JewelBox 70-T, JewelBox 90-T and Ultra Compact each of which can be customized for specific applications.
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Inspection Instrument for Indicators
i-Checker
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The i-Checker is specially designed to calibrate measuring accuracy of dial indicators, dial test indicators, and other electronic comparison gage heads with a stroke of up to 100mm (4").±(0.2+L/100)µm indication accuracy. Directly inspects an indicator with a stroke of up to 100mm (4"). The dial test indicator, bore gage and lever-type inductive head can be inspected with optional accessories. Adjustment of the measurement position is very easily accomplished because of semi-automatic measurement and full automatic measurement functions. Creates and prints out the simple inspection certificate. Saves inspection result as CSV file for reusable inspection result by any kind of software.
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Wafer Inspection Products
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Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Defect Inspection System
NovusEdge
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The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Protective Coating Inspection Kit 3
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Measurement parameters include:Surface profileSurface temperatureClimatic conditionsCoating thicknessAdhesion
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Solar Power Plant Inspection Service
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We provide various performance/safety tests including insulation resistance measurement, ground resistance measurement as well as string I-V inspection, EL inspection, and IR inspection using thermography. We provide services of pre-operation voluntary test and pre-operation self check, mandated by revision of FIT scheme in 2017 for solar plants of 500kW – 2,000kW.
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Large Format Infrared Inspection Windows
FLIR IRW-xPC/xPS Series
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The FLIR IRW-xPC/xPS joins the existing FLIR IR Window family to help you inspect more efficiently, make inaccessible components accessible, and save money by preventing unplanned downtime. The rectangular polymer windows are impact resistant and provide the largest viewing area available to monitor completely undisturbed assets inside energized electrical equipment. IR Windows-xPC/xPS are durable and stable in harsh environments, making them suitable for most industrial settings as well as for shipboard use.
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IR Inspection System
EVG®20
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The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
