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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Product
Box IPC
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These IPC are compact design with front I/O and aim at industrial automation and equipment manufacturing applications, such as machine vision and AOI.
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Product
2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
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Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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Product
Desktop 3D AOI Series
MV-3 OMNI
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
Conformal Coating Inspection (CI AOI)
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They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
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Product
Turn-key Capabilities
RoHS Compliant
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Complete turn-key solution involves design service, component procurement service, component manufacturing, final assembly, X-ray/AOI service, functional/parametric testing and customized packaging.
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Product
NXP® ARM Based Open Frame Touch Panel PC
SP2-IMX8 Series
Panel PC
- NXP i.MX8M Plus high-performance processor- Built-in 2.3 TOPS NPU for entry level AI computing (ex. AOI)- PCAP touch screen (7"/10") with true flat design- 32GB eMMC and external Micro SD slot for storage expansion- Expansible I/O design from edge I/O- Support Multi-OS: Linux, Windows, Android- Support Speaker, Mic-in, Line-out and buzzer- Support 1GbE LAN TSN
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Product
Software Products
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Working on the premise to ease system operation, increasing inspection capabilities while providing full traceability MVP Software Products encompass a range of tools driven directly from the data generated at the AOI systems, as well as optional links back to the production lines and monitoring of the data they generate also.
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Product
DSP-Based 4/8-Axis Advanced Pulse-Train Motion Controllers
AMP-204C/AMP-208C
Motion Controller
ADLINK"s new AMP-204C/AMP-208C DSP-based 4/8-axis advanced pulse-train motion controllers incorporate up-to-date floating-point DSP and FPGA technology, enabling high pulse output and encoder input frequency up to 6.5 MHz and 20 MHz respectively. Leveraging ADLINK" s Softmotion technology, the AMP-204C/AMP-208C offer impressive comprehensive and application-oriented motion functionality to reduce development time while maintaining superior throughput and accuracy. Superior synchronous motion control performance combines with point-table function integrating multi-dimensional interpolation, such as 3D linear/circular/spiral interpolation with enhanced trajectory and velocity planning, for contouring applications in semiconductor, display and conventional manufacturing industries. The AMP-204C/AMP-208C also support PWM control with three different control modes for frequency or duty cycle, benefiting laser engraving/marking/cutting applications. Moreover, hardware-based position comparison and trigger output are applicable in AOI applications.
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Product
PWB Visual Inspection Machine (AOI/SPI)
RV-2
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PWB size: 50mm×50mm - 410mm×360mm 630mm×360mm（longer sized PWB)*. Item of inspection: Missing component,Position displacement, Polarity, Front/rear reversal, Unsoldered,Bridge, Quantity of solder, Lack of insertion component, Character recognition*
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Product
Full 3D Inline Metrological & Imaging AOI
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Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Product
Entry Level AOI
iSpector
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The Mek iSpector series AOI machines are fully compatible with Mek’s Catch System for classification, repair and SPC, utilizing the same powerful 22X software that is used in the premier Mek PowerSpector series. There is no compromise on the wide range of inspection algorithms and component libraries.
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Product
Advanced Automated Optical Inspection (AOI)
V510i Optimus 3D
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V510 has high productivity, the superior detection capability and inductory fastest inspection speed. It is by High Speed Multi Frequency Phase Shift Profile technology and simultaneous inspection method of 2D/3D. V510 can inspect that without influencing the surface condition and the warp of the board by unique lighting technology.By much algorithm, inspevtion of the component smoothness and the very small component is possible.
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Product
(AOI) Automated Optical Inspection Systems
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For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Product
Microelectronics And Packaging AOI
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Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Product
AOI/SPI Inspection Systems
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Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AOI/SPI Inspection Systems
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Product
2D/3D AOI Series
MV-6e
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- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
THT AOI
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Mek THT AOI overcomes these challenges of automated through-hole inspection with a unique combination of mechanical, optical and software design alternatives, unavailable in many conventional systems.
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Product
Automated Optical Inspection
K Series3D
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K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Product
Machine Vision Computers
AIIS Series
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Advantech AIIS Series are closely aligned with Machine Automation applications such as Automated Optical Inspection (AOI), Wafer Inspection, and alignment inspection which heavily rely on machine vision.
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Product
Automated X-ray Inspection (AXI)
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Automated X-ray inspection (AXI) is a testing approach based on the same principles as automated optical inspection (AOI). Instead of cameras, X-rays are used to automatically inspect features.
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Product
3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
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Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Product
Automated Optical Inspection System
506
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We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Product
Inspection of Glue Dot Assembly
ScanINSPECT's ADI
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ScanINSPECT provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT uses a simple Windows user interface integrated with an automatic table and image-processing unit. This combination allows 100% inspection of adhesive placement on PCBs after dispensing.
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Product
Centralized Motion Controller
Motion Controller
ADLINK‘s pulse train controllers provide comprehensive and application-oriented motion functions for servo and stepper motors through digital signal processing (DSP)-based and Application Specific Integrated Circuit (ASIC)-based two pulse train mode controllers to achieve excellent synchronous motion control and precise positioning suitable for laser engraving, marking and cutting applications in semiconductor, AOI, and conventional manufacturing industries.
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Product
Advanced 4-CH Encoder Card with High-Speed Triggering Function
LPCIe-8124-C
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The LPCIe-8124-C delivers versatile position comparison & high speed trigger output, making it ideal for a wide range of applications such as AOI and distance measurement. With a PCIe interface, LPCIe-8124-C is compatible with a wide variety of high performance systems.
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Product
2-Phase Stepper Drives Based On EtherCAT Field Bus
Nu-Step DA Series
Stepper Driver
The ADLINK Nu-Step DA Series is a stepper driver based on the EtherCAT bus featuring a 32-bit ARM processor and advanced variable current and frequency conversion technology. The driver generates less heat and motor vibration for more stable operation. It not only supports the standard EtherCAT specification, but also supports table comparison triggers for automated optical inspection (AOI) and linear comparison triggers for line scanning.
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Product
Automated I-V/AOI/EL and Sorting System
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OAI’s High Performance In-line Automated-I-V Testing, AOI/EL Inspection and Sorting/Binning System for Various Si Solar Cells. The 10000A-I-V System is a unique and reliable I-V testing, AOI/EL Inspection and Sorting / Binning system for testing of Mono, Multi-Si, C-HJT and other full Size (156mm x 156mm) and/or Cut-cell (156mm x 39mm or 156mm x 31.2mm or other custom sizes) Si Solar Cells.
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Product
3D AOI Series
MV-6 OMNI
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- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Product
Automated Optical Inspection System
AOI Series
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Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
