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Memory Test System
T5833/T5833ES
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
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Memory Test System
T5801
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
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Memory Test System
T5851/T5851ES
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
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DDR4 Pro Memory Test Adapter
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Memory Test Systems
T5503HS2
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Flash Memory Test System
T5830
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
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Memory Test System
T5835
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
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Memory Test System
T5511
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
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High-Speed Memory Test Solution
UltraFLEX-M
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Memory Test Software
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Memory Test System
T5221
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
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Memory Test Systems
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
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Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
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Memory Test System
T5830/T5830ES
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
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NI HIL and Real-Time Test Software Suite
Suites combine LabVIEW Professional Development System with NI's most popular application softwareIncludes LabVIEW Professional, VeriStand, and the LabVIEW Real-Time and LabVIEW FPGA modulesEach new suite includes a one-year NI Training and Certification membershipSoftware is shipped on USB 3.0 media with NI device drivers included to speed up your installationConfigure real-time test applications quickly and easily; add custom functionality
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Standardize Production Test Software For PCBAs And Electronic Devices
The vast majority of test project man-hours are spent on software development, so the choices that teams make in software tools and architecture have significant impact on deployment schedules. Standardizing software across a team or organization increases both efficiency and proficiency, lowering the risk of missed deadlines and improving test quality and reliability. Test software must:
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NI Automated Test Software Suite
The NI Automated Test Software Suite features all three NI IDEs and NI's most popular application software and add-ons specifically for building your automated test system with confidence. This package offers the power of LabVIEW, LabWindows/CVI, and Measurement Studio combined with the TestStand ready-to-run, test executive and the Switch Executive intelligent switch management application
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NI Real-Time Test Cell Reference System
780590-35
VeriStand Full Development License with NI Standard Service , Include 1 Year SSP
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Photonics Module Test System
58625
Chroma 58625 provides characterization testing for 3D sensing illumination devices. various test modules are combined for validation testing under precise temperature control.
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Audio and Acoustic Functional Test Solution
With the growing popularity of Internet of Things devices worldwide, many electrical products are adopting voice commands as their user interface. This means that acoustic and audio test challenges are likely to impact more products than ever before. Test teams must meet extended test coverage requirements to ensure product quality while maintaining throughput and operational efficiency. For a solution to meet these sorts of demands, it must:
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PXI Semiconductor/IC Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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CDMA2k Analysis Using NI PXI RF Test Instruments
NI-RFmx CDMA2k
NI-RFmx CDMA2k is completely interoperable with all NI-RFmx APIs. It provides simple access to the most advanced optimization techniques such as multi-measurement parallelism and multi-DUT measurements. The result is extremely fast and high-quality measurements with minimal software development effort.
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RF Testing Platform for ATx05
AT118
The functional test of modern devices with wireless connectivity always requires RF isolated cameras, as the only way to have the parameters controlled and to guarantee operation under the specified conditions.
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Interactive Benchtop Test
Strict time-to-market deadlines make it vital to efficiently debug and validate product designs. Virtual instrumentation provides a unified interface that gives engineers an advantage over traditional box instruments.
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Functional Test Fixtures
Forwessun’s Functional Test Fixtures are tailored to validate the performance of your electronic assemblies, ensuring each product meets critical quality and functional standards. With customisable designs and precision engineering, these fixtures support a range of testing needs—from checking connectivity and function to confirming performance under real-world conditions. Built to handle rigorous demands, Forwessun's solutions are ideal for industries requiring reliable and repeatable results. Whether for high-volume production or specialised testing, our fixtures provide robust, adaptable support to maintain efficiency and accuracy throughout the testing process. We also create, and work with Ingun to create fixtures using the Ingun kit.
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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6TL24 Combinational Base Test Platform
H71002400
The 6TL24 is the Base platform ideal for Combinational test (ICT+FCT) in low to mid volume, high-mix electronics productions. A dual-stage pushing mechanism will allow performing both, the FCT and the ICT test, without the need of changing the test platform and with a low cost fixturing technology. To do so, the exchangeable cassette fixture must be designed with two-level probes. IN the 6TL24, the second level is reached thanks to a pneumatic actuator.
