-
Product
PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyze
-
Your product description goes here.
-
Product
PCI Express 5.0 and Compute Express Link Protocol Exerciser
Summit Z516
Protocol Exerciser
The Summit Z516 is a PCIe 5.0 and CXL protocol traffic generation test tool used for critical test and verification intended to assist engineers in developing and improving the reliability of their systems. The Summit Z516 can emulate PCI Express 5.0 and CXL root complexes or device endpoints, allowing new designs to be tested against corner case issues.
-
Product
Compute Express Link (CXL)
-
Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
-
Product
PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyzer
Summit T516
Protocol Analyzer
The Summit T516 is targeted at high-speed PCI Express 5.0 and CXL I/O-based applications such as workstation, desktop, graphics, storage, and network card applications.
-
Product
MXI-Express Cable, Gen 3 x4, Copper, 3m
785549-03
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
-
Product
PCI Express® Bus to 3U PXI Express™ Chassis Expansion Kit
PCIe-PXIe-8565
PXI Express Module
Includes PCIe-8560 peripheral card, PXIe-8565 3U system module, and ACL-EXPRESS cable in 1, 3, or 7 meter lengthsCompliant with PXI-5 PXI Express hardware specification Rev.1.0 and PCI Express Base Specifications Rev. 1.0a250 MB/s maximum system throughput
-
Product
PXIe-8398, Gen 3, x16 PXI Remote Control Module
784178-01
MXI Express
PXIe, Gen 3, x16 PXI Remote Control Module—The PXIe-8398 enables control of a PXI Express chassis from an external host, such as a desktop PC, rackmount controller, or a separate master chassis. Using a Gen 3 x16 PCI Express link, the PXIe-8398 provides up to 16 GB/s of data transfer between the chassis and host over a copper cable connection.
-
Product
MXI-Express Cable, Gen 1 x1, Copper, 7m
779500-07
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
-
Product
COM Express Type 2 Starter Kit
Computer on Module
The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.
-
Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
-
Product
Computer On Modules
COM Express Basic
Computer on Module
COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
-
Product
Computer On Modules
COM Express Compact
Computer on Module
Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
-
Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
-
Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
-
Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
Computer on Module
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
-
Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
Computer on Module
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
-
Product
Computer On Modules
ETX/XTX
Computer on Module
ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. Advantech is a founding member of the ETX Industrial Group (ETX-IG).
-
Product
SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors (formerly codename: Elkhart Lake)
LEC-EL
Computer on Module
The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
-
Product
Computer-On-Module
ETX®
Computer on Module
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
-
Product
Computer-On-Module
SMARC
Computer on Module
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
-
Product
Compact PCI-Express/PXI-Express Module
ACE1553-3U-x-DS
PXI Express Module
The ACE1553-3U-x-DS is a member of AIM’s new family of compact PCI-Express/PXI-Express modules for analyzing, simulating, monitoring and testing MIL-STD-1553A/B databuses providing 1 or 2 dual redundant bus streams.
-
Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
-
Product
MXI-Express Cable, Gen 1 x4, Copper, 7m
779725-07
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
-
Product
COM Express
Computer on Module
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
-
Product
Ultra-Compact, Fanless, Low-Power Edge Computing Platform Powered By Intel® Processor N Series Or Atom® Processor X Series
MXE-230 Series
Industrial Computer
The MXE-230 Series computers, powered by the Intel® Processor N Series or Atom® Processor X Series, deliver low power consumption at just 12W. With an ultra-compact size of 165 x 120 x 62 mm (1.2L), they are ideal for space-constrained environments. The system supports up to 16GB DDR5 4800MHz memory, operates in temperatures from -20°C to 60°C, and offers two independent 4K 60fps display outputs. It also includes multiple I/O expansion options, such as M.2 and adaptive function modules, along with built-in TPM 2.0 for enhanced security.
-
Product
MXI-Express Cable, Gen 2 x8, Copper, 5m
782317-05
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
-
Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
-
Product
Computer-On-Module
Open Standard Module (OSM)
Computer on Module
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
-
Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
Computer on Module
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
-
Product
14/13/12th Generation Intel® Core™ Processor-Based Expandable Modular Industrial Computers
MVP-6200 Series
Industrial Computer
The MVP-6200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
