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Product
PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyze
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Your product description goes here.
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Product
Compute Express Link (CXL)
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Compute Express Link (CXL) is a new high-speed CPU-to-Device and CPU-to-Memory interconnect designed to accelerate next-generation data center performance. CXL technology maintains memory coherency between the CPU memory space and memory on attached devices, which allows resource sharing for higher performance, reduced software stack complexity, and lower overall system cost. This permits users to simply focus on target workloads as opposed to the redundant memory management hardware in their accelerators. CXL is based on a PCI Express 5.0 Physical layer with speeds up to 32GT/s. Teledyne LeCroy provides protocol analysis test equipment to support development and debug of CXL based devices.
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Product
PCI Express 5.0 and Compute Express Link Protocol Exerciser
Summit Z516
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The Summit Z516 is a PCIe 5.0 and CXL protocol traffic generation test tool used for critical test and verification intended to assist engineers in developing and improving the reliability of their systems. The Summit Z516 can emulate PCI Express 5.0 and CXL root complexes or device endpoints, allowing new designs to be tested against corner case issues.
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Product
PCI Express (PCIe) 5.0 and Compute Express Link (CXL) Protocol Analyzer
Summit T516
Protocol Analyzer
The Summit T516 is targeted at high-speed PCI Express 5.0 and CXL I/O-based applications such as workstation, desktop, graphics, storage, and network card applications.
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Product
MXI-Express Cable, Gen 1 x1, Copper, 1m
779500-01
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
COM Express® Type 6 R3.1 Reference Carrier Board In ATX Form Factor
Express-BASE6 R3.1
Computer on Module
Express-BASE6 R3.1 is an ATX COM-Express Type 6 Basic / Compact size module reference carrier board based on PICMG COM-Express Revision 3.1. Together with the COM-Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Industrial Computer
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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Product
COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
Computer on Module
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
Computer on Module
ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
Computer on Module
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
Computer on Module
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Product
MXI-Express Cable, Gen 1 x4, Copper, 3m
779725-03
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
Computer on Module
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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Product
COM Express® Type 6 Reference Carrier Board in ATX Form Factor
Express-BASE6
Computer on Module
The Express-BASE6 is an ATX size COM Express Type 6 reference carrier board. Together with the COM Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
PXIe High Performance System Module: Dual Port (x16), Gen 3
M9023A
PXI Express Module
The M9023A is a PXIe System Module and is installed in the system slot of a PXIe chassis. When combined with an appropriate host adapter, it will provide a high data BW connection between the host PC and the chassis. The M9023A has a flexible configuration capability. Each card has two Gen 3 x8 PCIe cable links capable of achieving speeds up to 8 GB/s on each port. These two ports can be combined into a single x16 cable link providing a speed of up to 16 GB/s. This means a data-intensive system can be built using high-performance desktop or rack-mounted computers.
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COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
Computer on Module
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
Computer-On-Module
SMARC
Computer on Module
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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Product
MXI-Express Cable, Gen 1 x1, Fiber Optic, 10m
778959-10
MXI Express
MXI-Express Cable with Communication Levels up to Gen 3 x8 - The MXI-Express Cable connects a host interface to a PXI or PXI Express chassis. You can also use it for data communication between multichassis systems. NI offers it in different MXI communication levels and lengths.
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Product
4x 3U OpenVPX MOSA Mission Computer
SIU34-MCVARM-01
Mission Computer
SIU34-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
COM Express
Computer on Module
COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
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COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
Computer on Module
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
Computer-On-Module
ETX®
Computer on Module
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
Computer on Module
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
