Computed Tomography
use of X-rays or ultrasound to scab abd cross section an object.
See Also: Tomography
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
Computer on Module
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
Computer on Module
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
Computer on Module
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
Computer-On-Module
Open Standard Module (OSM)
Computer on Module
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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Product
Small Size DIN-Rail IPC With Intel® Atom™ E3845
UNO-1372G
Industrial Computer
Intel® Atom E3845 1.91GHz processor with 4GB DDR3L Memory3 x GbE, 3 x USB, 2 x COM, 1 x VGA, 1 x HDMI, Audio, iDoor, mSATA, 2 x mPCIe, 1 x SATA, 4 x DI, 4 x DO, 1 x Power TerminalCompact with Fanless DesignDual Power Input for avoiding Power Down TimeExchangeable RTC Battery with easy Access on the TopDigital I/O with Isolation Protection for Sensing and controllingDiverse system IO and Supports Fieldbus Protocol by iDoor Technology as a Protocol GatewaySupports MRAM by iDoor TechnologyLAN Redundancy (Teaming)
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Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
Computer on Module
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3102 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
Computer on Module
ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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Product
3.5" Single Board Computer With Intel® N97 Processor
SBC35-ALN
Single Board Computer
SBC35-ALN, powered by Intel® N97 Processor, is exceptionally well-suited for a wide range of applications, specifically tailored for EV Chargers. This 3.5-inch Single Board Computer (SBC) from Intel's 13th generation excels in superior performance, power efficiency, and compatibility with cutting-edge technologies.
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Product
AI Application Board
MIO-5355
Single Board Computer
Qualcomm Dragonwing QCS6490/QSC5430 on 3.5" SBC, OS support Yocto BSP, Windows on Arm & Ubuntu. Qualcomm® QCS6490/QCS5430 on 3.5" SBC, support extend operating temperature -20~70°C. Powerful but Low Power with 8x Kryo 670 CPU from 1.9 up to 2.7 GHz + Adreno GPU 643 + up to 12.3 TOPs iNPU.
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Product
PICMG 1.0 Half-Size Single Board Computers
Single Board Computer
PICMG 1.0 half-size Single Board Computers (SBC) suit multiple single board computer requirements. The slot SBC cards offer high speed and wide bandwidth computing platforms, with plug & play, providing flexibility in various industrial applications.
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Product
3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
Single Board Computer
ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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Product
Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
Industrial Computer
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Product
ARM Computer
SYS-398Q-2G-0
Single Board Computer
WINSYSTEMS’ SYS-398Q is an enclosed embedded computer system offering high-performance multimedia graphics and a rich industrial I/O mix. The NXP® i.MX6Q processor's integrated power management provides excellent power efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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Product
Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
Industrial Computer
The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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Product
COM Express Type 2 Starter Kit
Computer on Module
The Starter Kit consists of a COM Express Type 2 core module with ATX size reference carrier board that offers one PCI Express graphics slot x16 , four PCI Express x1 slot, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, USB 2,0, Gigabit LAN, and Super I/O. All necessary cables are included.
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Product
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
Computer on Module
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Product
3U OpenVPX Power PC SBC
68PPC2
Single Board Computer
NAI’s 68PPC2 is a 3U OpenVPX, NXP® , QorIQ® T2080 quad-core processor, PowerPC-based, Single Board Computer (SBC) that can be configured with up to two intelligent function modules. Ideally suited for rugged defense, commercial aerospace, and industrial applications, the 68PPC2 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.
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Product
COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
Computer on Module
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Product
PICMG 1.3 Full-Size SBC With 14/13/12th Gen Intel® Core™ Processors And Intel® Q670E Chipset
NuPRO-E47
Single Board Computer
The NuPRO-E47 is a high-performance embedded single board computer that features with 14/13/12th Gen Intel® Core™ i7/i5/i3 processor and an Intel® Q670E Express chipset, which supports PCIe Gen 3. It comes equipped with 2 DIMM sockets that can support up to 64GB of Non-ECC DDR5 memory running at 4800MHz. The NuPRO-E47 also includes 6 SATA 3.0 ports with RAID support and 4 COM ports (including RS-232/422/485) for increased connectivity options. Additionally, the NuPRO-E47 supports Intel® PCIe bifurcation, allowing for flexible and efficient use of PCIe lanes. This single board computer is designed for use in a variety of industrial applications that require high-performance computing and reliable connectivity
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Product
COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
Computer on Module
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
Power Line Communication (PLC) Module For Single Board Computer
MIOe-PLC
Single Board Computer
Dual QCA7006 for EVSE / Charging Station sideEthernet Host Interface, SPI OptionalExtended Operating Temperature -40~85° C
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Product
SMARC Module
LEC-MTK-I1200
Computer on Module
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
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Product
PICMG® 1.3 Full-Size 6th generation Intel® Core™ i7/i5/i3 LGA1151 Processor-based SHB (Code name: Skylake)
NuPRO-E43
Single Board Computer
The ADLINK PICMG 1.3 SHB, the NuPRO-E43, supporting the 6th Gen IntelR Core i7/i5/i3 processor and equipped with the IntelR Q170 Express chipset. The NuPRO-E43 supports high-speed transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133 MHz memory up to 32 GB.
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Product
PICMG 1.3 Half-Size Single Board Computers
Single Board Computer
PICMG 1.3 half-size Single Board Computers (SBC) suit multiple single board computer requirements. The slot SBC cards offer high speed and wide bandwidth computing platforms, with plug & play, providing flexibility in various industrial applications.
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
Edge Computing Platform
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
Computer on Module
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
