Computed Tomography
use of X-rays or ultrasound to scab abd cross section an object.
See Also: Tomography
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Product
Industrial Computed Tomography
TomoScope® XS
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Coordinate measuring machine for three-dimensional measurement utilizing computed tomographyFast measurement with high resolution via the next generation transmission tubeReduce measurement time by 90% with OnTheFly TechnologyLow operating costs as a result of the new monoblock designExtremely precise air bearing rotary axis for low measurement uncertaintyLow space requirement thanks to compact designLow weight allows for installation almost anywhereFast amortization through low acquisition costsStandard-compliant calibration for reliable and traceable measurement results, optionally with DAkkS certificateVersatile fields of application such as plastic, metal and multi-material componentsSoftware for 3D real-time reconstruction of workpiece geometries during tomography
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Product
Industrial Computed Tomography
TomoScope® XL NC
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Coordinate measuring machine with x-ray tomography for the most stringent requirement with a small cone beam angle
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Product
Industrial Computed Tomography
TomoScope® XS FOV
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Coordinate measuring machine for three-dimensional measurement according to the principle of computed tomography, Fast measurement in the field of view of the detector without moving axes with high resolution and high power
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Product
Industrial Computed Tomography
TomoScope® L
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High Accuracy Multisensor coordinate measuring machine for 3D measurements using the principle of Computed Tomography, in combination with additional sensors (tactile sensor systems, optical sensors)
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Product
Industrial Computed Tomography
TomoScope® XL
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Micro focus X-ray source up to 225 kV (option: 300 kV micro focus tube) Grater range of x-ray detectors Grater range of x-ray detectors
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Product
MXI Computerized Tomography (CT) Option
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The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.
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Product
Micro-CT for material science
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Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the sub-micron level.
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Product
CT Inspection System
FF35 CT
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The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Product
Micro-CT for Life Science
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Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the micron level.
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Product
CT-PORTABLE
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Computed tomography (CT) has recently gained increasing importance as a non-destructive inspection method for industry. CT enables a quick visualization of a three-dimensional volume model of the external and internal structure of an object, which can also be interpreted by non-experts. So far, however, the acquisition costs and the relatively complicated operation often prevented a widespread introduction of computed tomography systems.
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Product
CT-ALPHA
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The CT-ALPHA system meets the most stringent demands in CT X-ray. With this Computed Tomography system, ProCon X-ray GmbH offers the highest possible flexibility for individual customer requirements.
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Product
Computed Tomography and CT Scanner
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When conventional x-ray images aren’t enough, a diagnosis for soft tissue conditions requires appropriate technology. Whether cross-sectional images are required or entire pictures of internal organs, CT exams and scanning are a vital part of a healthcare or imaging facility.
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Product
Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
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Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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Product
Industrial Computed Tomography
TomoScope® S
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In both design and construction, the measuring machine meets the legal requirements for a fully protective device according to x-ray device regulations. Additional safety features have been included over and above the legal requirements.
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Product
Medical Imaging
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ams offers high-speed, low-noise and low-power sensing solutions that enable manufacturers of Computer Tomography (CT) equipment and digital X-Ray Flat Panel Detectors (FPD) to produce crystal clear images while exposing patients to low doses of radiation. We are taking our leading imaging sensing solutions and expertise forward to achieve an unprecedented level of image accuracy while enhancing convenience and safety for the user.
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Product
Volume4D PRO
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Volume4D software provides advanced computer graphics for CT scan, MRI and other medical imaging. The software allows you to inspect 4D voxel data (image stack) as photorealistic multiple iso-surfaces. The software implements interactive measurement tools, specific voxel counters, area measuring, object segmentation and much more. Computed tomography (CT) and Magnetic resonance images (MRI) are supported. Texture based direct volume visualization module is implemented as additional enhancement feature.
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Product
COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
Computer on Module
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Product
OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
Computer on Module
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
Qseven Module with 4th Generation Intel Atom® Processor E3800 Series SoC (formerly codename: BayTrail)
Q7-BT
Computer on Module
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Streamlined, Fanless, Expandable Edge Computing Platform With 13th Gen Intel® Core™ Processor
MXE-310 Series
Industrial Computer
The MXE-310 is a streamlined, fanless, expandable edge computing platform powered by the 13th Gen Intel® Core™ i7/i5/i3 processors. Designed for high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers extensive connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, making it versatile for various industrial applications.
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Product
SMARC Short Size Module with Rockchip PX30 Quad-Core ARM Cortex A35
LEC-PX30
Computer on Module
LEC-PX30 based on power-efficient quad-core Arm® Cortex®-A35 SoC is a low-power, low-cost, entry-level, small-sized SMARC rev 2.0 module. For applications, such as IoT controllers, IoT gateways, wearable and mobile industrial devices, basic HMI, sensor concentrators, requiring good computing performance at low power consumption (1.5W- 5W) and Linux Yocto capability, LEC-PX30 is an ideal solution.
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Intel® Processor N Series And Atom® X Series Expandable, Cost-Efficient Modular Industrial Computers
MXC-330
Industrial Computer
Intel® latest ADL-N cost-performance embedded Fanless system, DDR5 SO-DIMM, various IO interface for different industrial applications, including Isolation COM port & DIO, 4x GbE LAN, M.2 expansion slot for general application.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
Computer on Module
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
Computer-On-Module
SMARC
Computer on Module
SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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COM-HPC Server Type Modules
Computer on Module
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
Enclosed Fanless Industrial Embedded Computer with NXP® i.MX8M Application Processor
SYS-444Q
Computer System
The SYS-444Q is a rugged enclosed fanless embedded computer system with NXP’s i.MX8M industrial application processor with quad-core Arm Cortex®-A53 for low-power processing. This rugged system has dual Ethernet, industrial I/O, expansion options, TPM 2.0 hardware security, and options for wireless connectivity. The processor supports industry-leading video processing along with an M4 microcontroller for real-time subsystems making it an ideal fit for industrial IoT applications requiring highly reliable performance in harsh conditions such as digital signage, industrial automation, energy management, building automation, and others.
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Product
6th Generation Intel® Core™ i7/i5/i3 Fanless Computer
MVP-6010/6020 Series
Industrial Computer
ADLINK's newly introduced MVP-6010/6020 Series value line of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor, provides one PCIex16 and three PCI or two PCIe x8 and two PCI expansion slots, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost effective price point.
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Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
