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Product
PCI to Star Fabric Module
51-921-001
Remote Control Interface
This module resides in the Slot 1 position of a PXI chassis and interfaces to the backplane of the PXI chassis. When located in a generic peripheral slot, it can be used to drive two extension PXI chassis.
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Product
Xeon E3-1125 Processor AMC, Fabric Mix
AMC723
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The AMC723 is a Processor AMC (PrAMC) in a single module, mid size AdvancedMC™ (AMC) form factor based on the Intel® Corei Processor with Cave Creek PCH.
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Product
10 Gigabit Ethernet AdvancedTCA® Fabric Interface Switch Blade
aTCA-3430
Switch Blade
The aTCA-3430 is a high performance 10G Fabric switch blade for AdvancedTCAR platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controllers, DPI/security network, IPTV, IP multimedia subsystems, RNC/BSC, broadband access/bearer networks, data centers, and LTE/4G network applications. The aTCA-3430 provides 10GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.
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Product
Fabric Tactile Tester
DRK549A
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Shandong Drick Instruments Co., Ltd.
Fabric feel style is not only one of the important evaluation indexes of textile comfort, but also an important factor affecting textile sales. Therefore, textile feel style measurement instrument has always been the research direction of textile science and technology.
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Product
9U Blade Server for 12 Blades with Dual Fabric Switch Slots
cPCIS-3300BLS
Blade Server
- PICMG® 2.16 Packet Switching Backplane architecture- Dual PICMG® 2.16 fabric slots for high availability- 21 slots, including 12 node slots, two fabric slots, three redundant 6U CompactPCI® power modules and one CMM slot- Hot swappable 800 W + 400 W redundant CompactPCI® power supply with universal AC input
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Product
Plano Optical Substrate Fabrication
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Keysight has the technology and expertise to fulfill all your requirements for precision plano substrates up to 300mm:
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Product
40 Gigabit Ethernet AdvancedTCA® Fabric Interface Switch Blade
aTCA-3710
Switch Blade
The aTCA-3710 is a high performance, high bandwidth, 40G Fabric switch blade for AdvancedTCA® platforms. This product is ideal for bandwidth intensive telecom applications such as wireless access controller, DPI/security network, IPTV, IP multimedia subsystem, RNC/BSC, broadband access/bearer network, data center, and LTE/4G network applications. The aTCA-3710 provides 40GbE hub-to-node connectivity and integrated switch silicon that supports load balancing, priority queues, packet classification, and flow control to enable strict bandwidth management for implemented applications.
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Product
Mechanical Testing
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The Mechanical Testing Department at IMR is well equipped to perform most standard mechanical testing, as well as specialized tests designed to the customer's requirements. A complete in-house machine shop supports the department with precise specimen preparation and fixture fabrication.
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Product
1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - XMC
Model 71141
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- µSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Product
FTB Ecosystem
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Imagine test tools that actually help you deliver services with speed and quality. Imagine if you could institutionalize operational efficiencies, eliminate silos and make every component of your deployment, turn-up and monitoring part of one tightly woven fabric.
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Product
SOSA Aligned LVDS with Optical I/O Kintex UltraScale FPGA - XMC
Model 71813
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Supports the emerging SOSA™ Technical Standard- PCI Express (Gen. 1, 2 & 3) interface up to x8VITA 42.0 XMC compatible with switched fabric interfaces- Optional front panel optical interface- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Destructive Physical Analysis (DPA)
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Is the process of disassembling, testing, and inspecting a component for the purpose of determining conformance with applicable design and process requirements. This process of sample testing is used to ensure that a high reliability component or device is fabricated to the required standards. Destructive Physical Analysis is also used effectively to discover process defects for troublesome production lot problems.
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Product
RF Power Transistors
Silicon MOSFET
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Macom Technology Solutions Holdings Inc.
At MACOM we offer a broad range of silicon bipolar transistor products designed for applications ranging from DC to 3.5 GHz. Our silicon bipolar transistors are ideal for civil avionics, communications, networks, radar, and industrial, scientific, and medical applications. Our all-gold metallization fabrication processes ensure high performance and long term reliability for ground and space applications.
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Product
33 lane, 9 port, PCI Express
PEX 9733
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Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe. Yet ExpressFabric works seamlessly with other standards used within the rack and in rack-to-rack connectivity.
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Product
Coefficient Of Friction Tester
COF-02
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Jinan Leading Instruments Co., Ltd.
COF-02 Coefficientof Friction Tester is applicablein static and kinetic coefficient of friction tests of plastic films, sheets,rubber, paper, PP woven bags, fabric style, metal-plastic composite strips/belts for communication cable, conveyor belts, wood, coatings, brakepads, windshield wipers, shoe materials and tyres, etc. With the materialsmoothness testing, users can control and adjust material quality technicalindexes to meet application demands. Besides, this tester is applicable for thesmoothness measurement of cosmetics, eye drop and other daily chemistry.
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Product
IC/BGA Tester
Focus-2005
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As a screening checker to detect defective devices(mainly electrostatic destruction)which are returned from fields before failure analysis process of IC/LC in the quality assurance division of semiconductor manufacture.As a screening checker to detect defective devices before acceptance inspection by IC/LSI expensive tester at semiconductor company(trading, manufacture)Short/Open checker for semiconductor sensor device.It is possible to measure two kinds of measurements which are constant voltage biased current measurement and constant current biased voltage measurement. User can set the threshold of 10 ranks. （auto measurement）Only device can be measured. It is also possible to fabricate the test fixture.Various devices can be measured by replacing the socket board.It is no need to generate complex test programs as reference values are calculated from good device.It can be expanded by adding multiplexer boards which are 128pins per one board.(MAX 2048pins)
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Product
CW IMPATT DIODES FROM 30 TO 140 GHz
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Insight Product Company offers IMPATT diodes with CW power up to 400 mW and operational frequency range up to 140 GHz. Silicon p+-p-n-n+ IMPATT diodes are designed to be used in the millimeter wave oscillators and amplifiers. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
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Product
Single-Tenant Colocation Cabinets
SmartCabs
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Benefit from the scale and speed of the cloud while still retaining the control, performance, and security of a dedicated infrastructure. SmartCabs are single-tenant colocation cabinets that come complete with built-in power and network connectivity as well as access to the Digital Exchange, our configurable core network fabric.
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Product
RF Architectural Shielding Products
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EMI (Electromagnetic Interference) is often used interchangeably with RFI (Radio Frequency Interference). However, EMI can be any frequency of electromagnetic noise, whereas RFI is a relatively narrow range of electromagnetic noise on the EM spectrum. EMI Shielding can be used to mitigate electric and magnetic radiation across various spaces. Radio Frequency (RF) Shielding can be used to mitigate RFI with specifically designed enclosures that can block RFI. As well, RF Shielding can include application of RF Shielding paints, fabrics, and other materials.
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Product
97 lane, 25 port, PCI Express
PEX 9797
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Broadcom has extended the reach of PCIe for use as a fabric for data center and cloud computing through its ExpressFabric initiative and platform of hardware and software. ExpressFabric can eliminate expensive bridging devices within the rack, such as adapter cards that translate native PCIe to Ethernet and back to PCIe.
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Product
Rugged Blade Processor W/ Dual Xeon E5
ATC126
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The ATC126 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with up to eight banks of 256 GB DDR4 memory with ECC. Versatile connectivity includes two 10/40GbE Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector.
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Product
Motorized Force Test System
MT Series
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In the past, film extruders, paper producers, converters, and woven/non-woven fabric producers have had the choice of test stands and universal test machines which are either value-priced peak-force-only machines, or expensive computer-operated integral-load cell machines. Now you can have the best of both worlds in a single instrument. The series MT-1500, a simple to use computer operated tester, with Quality Control software for automatic calculation and graphical display of break, elongation, yield, modulus, and other, tension and compression force information.
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Product
Quick Dry Rate Tester
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Sataton Instruments Technology CO., Ltd
Quick dry rate tester is professional designed to determine the dry rate of fabric, which is exposed to a prescribed volume of water, tested surface temperature change, and time of drying. The tester is based on the heated plate method to determine the dry rate. It is applicable to all types of fabrics, including knits, wovens, and non-wovens, as well as to fabrics taken from end product items.
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Product
Sensor
Lepton
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The FLIR Lepton™ is the most compact longwave infrared (LWIR) sensor available as an OEM product. It packs a resolution of 80 × 60 or 160x120 pixels into a camera body that is smaller than a dime. This revolutionary camera core is poised to equip a new generation of mobile and handheld devices, as well as small fixed-mount camera systems, with thermal imaging capabilities never seen before. Lepton contains a breakthrough lens fabricated in wafer form, along with a microbolometer focal plane array (FPA) and advanced thermal image processing. In order to support the lepton and make it easy to use, we have developed a breakout board to support the module along with example source code. Please see the Lepton Thermal Camera Breakout Datasheet for more information.
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Product
Shielded and Unshielded Cable
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Teledyne Marine Cable Solutions
Shielding Types• Braided I Served I Spiral• Foil & Hybrid• Vapor Barriers• Copper & Alloys• Conductive & Static Dissipative Tapes• Conductive Fabrics• Tensile Members• RFI & EMI Tapes & Braids (Serveor Interwoven)• Utilizing Flat & Round Copper• Stainless Steel• Bronze• Aramid Fibers & Textile, amongothersConstruction• Multi-conductor, shielded pairs, pairs with steel tubed fiber or copper conductors with fiber optics, coaxial conductors & aramid strength fibers
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Product
Geo / Cryogenic / NDE Instrumentation
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Tristan designs and fabricates custom magnetometer systems to study the magnetic properties of samples. SQUID systems are extremely sensitive instruments designed to detect small electromagnetic signals. By combining SQUID electronics with various special purpose probes and auxiliary electronics, laboratory systems having a variety of capabilities are made available. - See more at: http://www.tristantech.com/#sthash.JlYDZcjM.dpuf
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Product
ICI Pilling Tester
UI-TX06
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ICI Pilling Tester – ICI pilling and snagging tester – ICI pilling box is applied to test pilling, snagging and fuzzing of fabric surface by tumbling randomly. ICI pilling test method includes ISO 12945.1, BS 5811, GB/T 4802.3, JIS L1076 and etc. UI-TX06 pilling and snagging tester is made with different standard box and can save your cost if different test standards are required.
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Product
EMC Technology Services
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Our experienced and professionally trained technicians have the skills and background required to fabricate nearly any type of cable. EMC technicians are certified to the J-STD-001 standard biannually.
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
