Semiconductor Substrate
thin crystalline material sliced from ingot.
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Product
Compact Semiconductor ATE
QST286
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Qmax Test Technologies Pvt. Ltd.
The Qmax Model QST286 is a compact small foot print, sophisticated automatic semiconductor tester. Its state-of-the-art hardware design which is freely configurable to user's application requirements and software features makes it ideal for high throughput production testing of wide range of low pin count medium power ICs as listed below but not limited to Optocouplers, Isolators, LEDs, Photo diodes, Photo transistors, Photo sensors, Photo detectors , Analog Mux , Relays and more.
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Product
Semiconductor Device Testers
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are particularly suitable for certain semiconductor test requirements, but other models may also be of interest. Our knowledgeable application engineers can guide you to the most suitable model.
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Product
Semiconductors Testing
test
Our Testers support the production lines of variety of products such as 40/100 GBps Mux/DeMux, LNA, WiMAX RF Transceivers, Microwave & Millimeter Wave components. This high reliability products are being used in (a) Networking & Communications (b) Consumer Electronics (c) Military & Space
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Product
Metrology Solutions for Semiconductors
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Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Product
Semiconductor Test Platform
PAx
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PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
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Product
GaN substrates
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Sumitomo Electric Industries, Ltd.
Gallium Nitride (GaN) substrates are widely used for optical devices in the blue-violate to green ranges due to their excellent material characteristics. In recent years, GaN substrates have been drawing attention for power devices. Many development projects are underway.
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Product
Semiconductor
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Package FunctionSMV(2.9mm*2.8mm) AND GateUSV(2.0mm*2.1mm) NAND GateFM8(5.0mm*4.5mm) NOR GateSM8(2.9mm*4.0mm) OR GateUS8(2.0mm*3.1mm) INVERTER
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Product
Semiconductors
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Meets SDIO card v2.0 specificationSupports SDIO SPI, 1-bit, and 4-bit SD modesHost clock rate from 0-50 MHzSingle SDIO function interfaceSD commands processed in hardwareReset output on completion of initializationIndication of high speed and high power enabling to application logicMaximum block size supported is 1024 bytesThree I/O mode selection pinsCRC7 and CRC16 modulesSupports direct R/W (IO52) and extended R/W (IO53) commandsAPB bus interfaceParallel bus interfaceStandard 8051 split bus interfaceGeneric 8051 bus interfaceUART interface
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
Semiconductor Assembly
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With the know-how that we have cultivated over many years in the semiconductor manufacturing process, we respond to the diverse needs of our customers regardless of prototype production and mass production.
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Product
Semiconductor Products
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International Testware Corporation
International Testware supports all major ATE models for today's semiconductor products.CredenceAdvantestCaesarHewlett-PackardLTXIMSSchlumbergerAndo...and MANY moreTeradyneMosaidOur Solutions offer:Mixed-SignalEMI ReductionR/FCustom TailoredLow NoiseReliable PerformancePrecise Length MatchingSuperior Impedance ControlCrosstalk "Immunity"Minimal Inductance
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Product
Semiconductor CharacterizationSystem
Keithley 4200
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Materials Development Corporation
The MDC CSM/Win-4200 System integrates the extraordinary power of the CSM/Win softwarewith the power of the new Keithley 4200-SCS. Measure capacitance, voltage, and current down to sub-femtoamp levels.
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Product
Semiconductor Testers
Test Instrument
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Product
PXI Semiconductor/IC Test System
Test System
A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Product
Semiconductor Optical Amplifier
SOA
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Amonics SOA is a polarization maintaining optical amplifier with high fiber-to-fiber gain. It is designed for transmitter applications to increase optical launch power to compensate for the loss of other optical devices. The benchtop version incorporates a user-friendly front panel housing a LCD monitor display, key switch, power control knob and optical connectors. RS232 computer interface is also equipped on the rear panel. 1MHz with 10ns pulse width intensity modulation is available. The OEM module version is an ideal building block for OEM system integration, especially in optical communication network and CATV applications. It requires only a single +5V power supply.
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
Fully Automatic Test Machine for Ceramic Substrates
U800CCT
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1. CCD automatic alignment, with an accuracy of ± 10μm2. Support layout test, displacement function3. The upper and lower jigs X, Y, θ are automatically fine-tuned to improve the yield4. Automatic loading and unloading of magazine5. Automatic bad marking and verification of scratches
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Product
Semi-automatic Semiconductor Probe Assembly Equipment
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The components of the incoming parts are pre-assembled and preloaded to two packages. We use a high-speed four-axis robot equipped with high-precision multi-sensor grips to grab these pre-assembled subcomponents. Under CCD visual guidance, a set of rotary grab devices is equipped to capture top plunger. The device uses a multi-set CCD visual module to ensure accuracy, and the positioning accuracy of each motion link is controlled within 15um.
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Product
Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Product
Semiconductor Package Wind Tunnel
WT-100
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Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Product
Design-for-Test And Semiconductor Data Analytics
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Mentor’s comprehensive solution for IC test, including best-in-class design-for-test tools and test data analytics that help ensure the highest test coverage, accelerate yield ramp and improve the quality and reliability of manufactured parts.
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Product
Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
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Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Product
Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8829
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- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 閸?-3%n or 閸?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45闁?/span>(32闁?/span>-104闁?/span>),闁?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Product
Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
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Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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Product
Semiconductor Thermal Transient Tester
T3Ster®
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T3Ster (pronounced "Trister") is an advanced thermal tester from Mentor Graphics MicReD Products for thermal characterization of semiconductor chip packages. Superior to all other thermal characterization equipment on the market due to its speed and ease of use; its extremely accurate temperature measurements (0.01oC); and its 1 micro-second measurement resolution in time.
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Product
Semiconductor Curve Tracer
CS-8000 Series
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The CS-8000 series are equipped with a high-voltage source of up to 5 kV and a high-current source of 2 kA. It features Pulse output, Gate pattern, and very small current measurement capabilities, and it supports the design evaluation of wideband-gap semiconductors such as SiC and GaN.
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Product
Semiconductor Automatic Test
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Qmax Test Technologies Pvt. Ltd.
Semiconductor Automatic Test by QMax
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Product
SERS (Surface Enhanced Raman Scattering) Substrate & SERS Reader – Mini Chemistry Analytic Pack
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The porous carbon SERS substrate provides not only high signal enhancement due to its strong broadband charge-transfer resonance for large chemical enhancement (as opposed to electromagnetic enhancement in traditional metal-based SERS substrates), but also extraordinarily high reproducibility or substrate-to-substrate, spot-to-spot, sample-to-sample, and time-to-time consistency in SERS spectrum (which is not possible with traditional metal-based SERS) due to the absence of "electromagnetic hot spots" by making the entire surface of the substrate "chemically hot", high durability due to no oxidization, and high compatibility to biomolecules due to its fluorescence quenching capability.
