Semi-conductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
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Product
5.0 MP NVIDIA® Jetson Nano™ Camera
E-CAM50_CUNANO
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e-CAM50_CUNANO is a 5.0 MP 2-lane MIPI CSI-2 fixed focus color camera for NVIDIA® Jetson Nano™ developer Kit. This camera is based on 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® with built-in Image Signal Processor (ISP). This powerful ISP helps to brings out the best image quality from the sensor and making it ideal for next generation of AI devices.
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Product
IQ Mixers
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The new MMIC IQ mixers from Fairview (also known as IQ modulators) utilize a highly reliable GaAs MESFET semiconductor process which integrates a pair of matched double balanced mixer cells, a 90-degree hybrid and a 0-degree splitter/combiner that produces exceptional amplitude and phase balance performance. This level of integration offers size and performance advantages in comparison to discrete module assemblies. With the addition of an external 90-degree IF hybrid module, these IQ mixers can be used as either a Single Sideband Up-converter Mixer or an Image Reject Down-converter Mixer. The benefit of image rejection and sideband suppression can reduce overall system cost and complexity by removing the need for pre-selection filtering. Typical applications include point-to-point and point-to-multipoint radio, VSAT, military radar, electronic warfare, satellite communications, test equipment, and sensors.
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Product
Semiconductor Solutions
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Bruker's suite of technologies for semiconductor manufacturing address critical metrology and process needs across the broadest range of applications from R&D to process improvement. 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation products.
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Product
Laser Head
5517EL
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The Keysight 5517EL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Semiconductor Device Parameter Analyzer/Semiconductor Characterization System Mainframe
B1500A
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Current-voltage (IV) measurement capabilities of spot, sweep, sampling and pulse measurement in the range of 0.1 fA - 1 A / 0.5 V - 200 VAC capacitance measurement in multi frequency from 1 kHz to 5 MHz and Quasi-Static Capacitance-Voltage (QS-CV) measurement capabilitiesAdvanced pulsed IV and ultra-fast IV measurement capability from minimum 5 ns sampling interval (200 MSa/s)Up to 40 V high voltage pulse forcing for non-volatile memory evaluation
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Product
High Precision TMAH Concentration Monitor
HE-960H-TM-S
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Accurately measures the concentration of TMAH (Tetra Methyl Ammonium Hydroxide), which is the main component of the photoresist developer solutions in semiconductor manufacturing. Repeatability: within +/- 0.003%. Measurement range : 0 - 3 %. Have the chemical resistant carbon sensor.
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Product
Bonding Tester
PTR1102
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In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Product
4K Multi-Camera System (TRICAM)
E-CAM130_TRICUTX2
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e-CAM130_TRICUTX2 (TRICamera) is a multiple camera solution for NVIDIA® Jetson TX2 developer kit that consists of three 13 MP 4-Lane MIPI CSI-2 camera board and an base board to interface with the J22 connector on the Jetson TX2. Each camera is based on the camera module e-CAM137_CUMI1335_MOD, 1/3.2" AR1335 color CMOS image sensor from ON Semiconductor® and integrated high performance Image Signal Processor (ISP).
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Product
Optical Metrology
YieldStar
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Our YieldStar optical metrology solutions for the semiconductor industry can quickly and accurately measure the quality of patterns on a wafer.
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Product
Laser Head
5517DL
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The Keysight 5517DL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Product
Vison Inspection System
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High Speed stroboscopic 2D vision inspection system for die attached and wirebond quality in back-end semiconductor processes. User friendly HMI for easy recipe creation and management. Able to configure with various defect identification module. (Strip Mapping, Inker, Scriber, Pucher, Bristle, Laser wire cutter and Laser clip bonding cutter.)
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Product
Enterprise Software
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In the race to digitize semiconductor manufacturing operations, Onto Innovation’s productivity software delivers the competitive advantage you need to capture market share. Our software connects information on a tool, within a factory, or across an entire global supply chain to capitalize on the potential of your biggest asset: your data.
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Product
Datapaq Reflow Tracker System
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Monitor the temperatures for every soldering application – including wave, reflow, vapor phase, selective and rework stations – in real-time with the Datapaq Reflow Tracker Systems. Ideal for the electronics manufacturing and semiconductor applications.
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Product
Thermal Control Products
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WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Product
Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Manual Semiconductor Metrology System
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Front USB port enables easy storage of measurements and other data to flash drivesMTI Instruments’ Proprietary Capacitance Circuitry for Outstanding Accuracy and DependabilityNon-contact measurements76-300 mm diameter wafer rangeOptional wafer measurement ringsWafer stops for exact centeringEthernet interfaceFull remote control software (Windows compatible)Optional calibration wafers
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Product
MOSFETs, MESFETs, and Schottky Diodes
Semiconductor Module
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The Semiconductor Module allows for detailed analysis of semiconductor device operation at the fundamental physics level. The module is based on the drift-diffusion equations, using isothermal or nonisothermal transport models. It is useful for simulating a range of practical devices including bipolar, metal semiconductor field-effect transistors (MESFETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), Schottky diodes, thyristors, and P-N junctions.
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Product
Configurable OSAT Friendly Pick-and-Place Handler
Delta Eclipse
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Eclipse delivers scalable performance for testing a wide range of semiconductors, from analog ICs to high-performance CPUs and mobile processors. The Eclipse is a high-speed pick-and-place handler designed to test up to 16 Integrated Circuits (ICs) in parallel, at temperatures from -45°C to +155°C*, with throughput up to 13,000 UPH.
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Product
RF & Microwave Signal Generator
SMA100B
Microwave Signal Generator
The R&S®SMA100B RF and microwave signal generator delivers uncompromising maximum performance. It provides the purest output signals while maintaining the highest output power levels with the lowest harmonics, far outpacing the competition. As the world's leading signal generator, it can handle the most demanding module and system T&M tasks in the RF semiconductor, wireless communications, aerospace and defense industries.
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Product
Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
Industrial Computer
The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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Product
Semiconductor Device Testers
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are particularly suitable for certain semiconductor test requirements, but other models may also be of interest. Our knowledgeable application engineers can guide you to the most suitable model.
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Product
Materials Metrology
VeraFlex Family
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World-class XPS and XRF metrology technologies for semiconductor process control.
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Product
Semiconductor Package Wind Tunnel
WT-100
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Thermal Engineering Associates, Inc.
The WT-100 Forced Convection (Moving Air) Wind Tunnel is designed in accordance with the EIA/JEDEC JESD51-6 standard for thermal characterization of semiconductor packages and devices. The vertical design minimizes laboratory floor space requiements. Air is drawn in at the bottom and exhausts at the top. The test section is large enough to accommodate the largest JEDEC and SEMI thermal test boards. Air velocity can be adjusted over the range of 0.5 to 5 m/s; air velocity is monitored with an included hot-wire anemometer connected to a digital display. A Type-T thermocouple is mounted in the test section for monitoring the moving air temperature.
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Product
Custom Coatings
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MICROMATTER provides custom coating services (single or multi-layer) on customer supplied glass, metal and semiconductor substrates.
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Product
Display ICs For Automotive
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Renesas has invested in key technologies to address the latest trends within the automotive market. Offering both standard and AEC-Q100 qualified products for automotive applications, Renesas' automotive display IC product line is defined by feature rich, highly integrated semiconductor solutions that incorporate many key function blocks for front console, rear seat entertainment, and rear camera display applications.
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Product
High-resolution, SWIR InGaAs camera
Wildcat+ 640 Series
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The Wildcat+ 640 series is based upon a state-of-the-art InGaAs detector with 640×512 pixels and 20 μm pixel pitch. The camera offers superior, high resolution SWIR imaging capabilities, comes in a versatile and industry-proven Wildcat camera package (GenICam compliant) and offers advanced on-board image processing.The Wildcat+ 640 camera outputs full frame images up to 300 Hz via either a CameraLink or USB3 Vision interface.The Wildcat+ 640 is suitable for semiconductor inspection, display inspection (mobile phone and TV), and laser beam analysis.Benefits & Features- Compact and industry-proven camera design- High-resolution SWIR imaging- Advanced on-board image processing performance- GenICam complaint- Flexible optical mount and lens options
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Product
Electrostatic Capacitance-Type Non-Contact Thickness Meter
CL-5610 series
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The CL-5610/5610S is used to perform non-contact thickness measurement of objects under measurement including conductors, semiconductors and insulators in combination with the new-developed VE series capacitance type gap detector. The CL-5610/5610S can be connected up to 2 gap detectors and also used as 2-ch displacement meter.
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Product
DELTA™ IV 4-zone Flow Ratio Controller
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DELTA™ IV 4-zone Flow Ratio Controller is a digital controlled, browser-enabled, process control instrument providing the latest gas flow ratio measurement and control technology to meet the demands of multi-channel flow distribution for semiconductor, flat panel, and solar panel process uniformity and control. It is available in EtherCAT® or DeviceNet™ providing the latest gas flow ratio measurement and control technology to meet the demands of multi-channel flow distribution.
