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3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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3D SPI Series
MS-15
- Exclusive 15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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Dual Projection 3D In-Line Solder Inspection System
KY8030-2
The new KY8030-2 delivers 2x fasterinspection without compromising performanceand accuracy.Using patented dual projection, the systemeliminates the critical Shadow problem thatall 3D SPI systems can be vulnerable to.Easy UI and SPC Plus are included in the systempackage in order to help users achieve faster& easier printer process optimization
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Solder Paste Inspection System
KY8030-3
The new KY8030-3 delivers 3x fasterinspection without compromisingperformance and accuracy.Using patented dual projection,the system eliminates the criticalShadow problem that all 3D SPI systemscan be vulnerable to.Additionally, the new KY8030-3 has solvedthe PCB Warp problem that seriouslyimpacts inspection accuracyand reliability of result.
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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TTL/I2C/SPI Expansion Kit
OP-SB85L
OP-SB85L is the interface expansion kit that has a port to measure TTL / CMOS signal level communications, and the one to measure the voltage of high-speed analog input. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communication between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI on monitoring and simulating.
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3D vision
SICK's 3D vision series offers a wide range of powerful and flexible products designed for reliable operation in harsh industrial environments. They range from versatile high-speed cameras that deliver high quality 3D and contrast images to smart and configurable stand-alone sensors that facilitate rapid development and easy integration. Their scalability ensures a perfect fit with your 3D vision application.
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3D Measurement
PSD-Array
The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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3D Sensors
Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
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Process Improvement Software for SPI & AOI
SIGMA Link
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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3D Sensing
The rapidly growing field of 3D sensing is currently addressed by the following 3D camera technologies: stereoscopic imaging, time-of-flight (ToF) sensing, and structured light.
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USB/RS232/SPI Programmable Attenuator
RUDAT-13G-90
Mini-Circuits’ RUDAT-13G-90 is a general purpose programmable RF attenuator supporting frequencies from 10 to 13000 MHz with attenuation from 0 to 90 dB in 0.5 dB steps. Its unique design maintains linear attenuation change per dB, even at the highest attenuation and frequency settings. The attenuator is controlled via USB, RS232 or SPI. It comes housed in a compact, shielded metal case with SMA(F) input/ output RF ports (RF ports are interchangeable), a USB type Mini-B socket, and a 9-pin D-sub(F) RS232 and SPI port. Power can be supplied via either USB or the D-sub port. The RUDAT-13G-90 is supplied with our easy-to-install, user-friendly GUI software, API objects for Windows® environments, and complete programming instructions for 32 and 64 bit Windows® and Linux® operating systems. See p. 9 for a complete list of included accessories.
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3D Software
Geomagic Wrap
Geomagic Wrap 2017 delivers a new and improved 3D scan-to-model workflow. From expanded file format support to manipulating texture maps for bringing your printed parts to life, the 3D scan data toolbox of Geomagic Wrap provides a wealth of possibilities.
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Handheld 3D Scanner
Peel
Accurate handheld 3D scanner for fast and easy data collection. A next-generation companion to Verisurf software for digitizing/reverse engineering & high volume pointcloud inspection.
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3D Scanner
Artec Leo
The first 3D scanner to offer onboard automatic processing, Artec Leo is able to provide the most intuitive workflow, making 3D scanning as easy as taking a video. As you scan your object, see the 3D replica being built in real time on Leo’s touch panel screen. Rotate the 3D model, check if you have captured all areas, and fill in any parts you may have missed.
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Borehole 3D Geophones
GFA 50/100
3D borehole geo-phone is realized with 3x high sensitive geophones (nat.freq.10 Hz- 1 vertical and 2 horizontal sensors) oriented according to a triad of orthogonal Cartesian axes XYZ. Delivered with a cleat assembly to sustain its weight at the requested depth (GFA cable is graduated in meters), this borehole geophone has a pneumatic-mechanical clamping system.
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3D Guidance®
The 3D Guidance® electromagnetic tracking solution delivers exceptional performance and value for OEM image-guided interventional and therapy systems and medical trainers that require real-time navigation tracking capabilities. The 3D Guidance solution tracks 6DOF sensors that can be embedded into OEM instruments such as ultrasound probes, rigid and flexible scopes, and laparoscopic tools. Continuous in-vivo tracking is maintained through difficult anatomy, even when sensors are out of sight. Low latency and fast update rates ensure the most subtle tool movements are instantly tracked and visualized within the OEM host interface. The 3D Guidance solution is available in the driveBAY™ and trakSTAR™ configurations, as based on the Electronics Unit. The trakSTAR is a standalone desktop unit that connects to a direct power source. The smaller driveBAY fits inside the drive bay of a computer, OEM imaging cart, or medical trainer/simulator, using the host’s power supply. Both share the same tracking accuracy and reliability. The ready-to-use configuration facilitates cost-effective integration and speeds time to market.
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3D AOI Series
MV-6 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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3D Form Measurement
Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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3D Sensors (Main Screen)
surfaceCONTROL
surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as shape deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.
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Universal 3D Measurement Software
Metrolog
Get a real performance accelerator for your 3D measuring devices and more.Not only does Metrolog X4 architecture benefit from current computer and OS technologies significantly increasing the performances and metrology software throughput, but it also simplifies your day-to-day measurement workflow.
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3D Scanner
Artec Eva Lite
Eva Lite is the budget version of the bestselling white light Artec Eva 3D scanner. It features the same accuracy specs, but with reduced functionality: Eva Lite has geometry only tracking and capture. As a result, this affordable 3D scanner can be used for making high quality textureless 3D scans when scanning geometrically rich objects, such as the human body.
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3D Contact Profilometer
NanoMap-LS
NanoMap-LS with large scanning range allows to generate high resolution 3D and 2D images with a press of a button.




























