3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
-
Product
3D Solder Paste Inspection system
PI Series
-
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
-
Product
3D Solder Paste Inspection (SPI)
-
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
-
Product
3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
-
Saki's 3D SPI identifies critical defects and assists with process improvement.
-
Product
3D Solder Paste Inspection
aSPIre 3
-
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
-
Product
3D Solder Paste Inspection (SPI)
TR7007 SII
-
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
-
Product
Tool, Inspection Depth Gauge, Mini Coax, ITA
910121157
Inspection Tool
Used to verify the depth setting of the center conductor of the ITA mini coax contacts.
-
Product
Tool, Inspection Depth Gauge, Mini Coax, Receiver
910121156
Inspection Tool
Used to verify the depth setting of the center conductor of receiver mini coax contacts.
-
Product
Tool, Inspection Depth Gauge, Micro Coax, ITA
910121180
Inspection Tool
Tool, Inspection Depth Gauge, Micro Coax, ITA.
-
Product
3D Inline Solder Paste Inspection System
TROI 7700 SERIES
-
Using Moire' pattern, Pemtron's three-dimensional lead applicationdosage tester combines 2D color images with 3D measurement data toprovide more detailed, near-real PCB images, unlike traditionalcolor maps. We will also provide you with the best solution forhigh-quality and high-precision PCB production with a varietyof statistical programs, along with information you need toquickly and accurately judge positive/failure.
-
Product
Solder Paste Inspection
3D SPI
-
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
-
Product
High Speed Solder Paste Inspection
VisionPro HSi
-
The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
-
Product
Solder Paste Wetting Tester
SP-2
-
SP-2 is wettability testing machine forsolder paste, parts electrode and PC board,adopted SP-Tension-Method (Temperature Profile Method).
-
Product
Solder Paste Analysis
SPA1000
-
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
-
Product
High-speed 3D Solder Inspection Machine
YSi-SP
-
a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
-
Product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Soldering Fixture
Used to solder Mini Coax Solder Sleeve contacts.
-
Product
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA
910121178
Soldering Fixture
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA.
-
Product
Solder Paste Analyser
SPA 1000
-
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
-
Product
Solder Paste Inspection System
LaserVision SP3D Mini
-
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
-
Product
Simple 3D Measurement & Inspection
XG-X Series Vision System
-
Abundant processing power is available even with multiple camera connections, including the 21 megapixel color camera, line scan cameras, or 3D cameras. XG-X Series offers high-speed, high-resolution cameras for high-accuracy inspection, providing powerful solutions for a variety of problems that arise in manufacturing.
-
Product
Solder Paste Inspection Machine
3D SPI
-
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
-
Product
Soldering Inspection Video Microscope
MS-1000
-
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
-
Product
Solder Paste Printers
-
Shenzhen Leadsmt Technology Co.,Ltd
Is mainly used to print the solder paste to the circuit board, is one of the essential equipment in electronic manufacturing.
-
Product
3D Measurement And Inspection
LOTOS
-
LOTOS automatic measuring systems can measure the full outer contours or individual areas of any measurement object quickly and precisely, irrespective of the shape, and test them for imperfections. The three-dimensional, non-contact measurement is carried out using optical measurement sensors with accuracy in the μm range. The result is a representation of the measurement object as a 3D model. Powerful, intuitive software allows the measurement results to be assessed extremely quickly.
-
Product
Dimensional Inspection (3D Inspection)
-
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
-
Product
3D Automated Optical Inspection
Zenith UHS
-
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
-
Product
3D Automated Optical Inspection Systems
New 3Di Series
-
To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency.
-
Product
3D X-ray hybrid inspection system
YSi-X
-
Ideal for 100% inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target. X-ray, optical, infrared, and laser height measurement as standard equipment; hybrid and high reliability with multiple inspection modes.
-
Product
3D Sensors
-
Teledyne DALSA offers powerful, innovative 3D sensors combining industry-leading performance with cutting-edge feature sets and value.
-
Product
Solderability Tester
LBT210
-
Microtronic Microelectronic Vertriebs GmbH
Microtronic's LBT-210 solderability tester has software that offers statistical information such as mean value, standard deviation, etc. A camera option offers video of the test cycle and storage in memory with the appropriate test measurements and data. Additionally, it has the feature to test under nitrogen. This function can be switched on in the software. An enclosure that is flooded with nitrogen lowers and rises with the device under test.
-
Product
3D Bundle
-
Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
