Interconnects
Links between systems, networks,nodes, equipment, devices, components and circuits.
See Also: Mass Interconnect, Connectors, Cable Assemblies, Interfaces
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Product
USB Type-C Interconnects Compliance Test Software
S94USBCB
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Use the S94USBCB software to test, debug and characterize your USB Type-C cable and connector designs. The PathWave TAP based test sequencer automates the network analyzer (VNA) for each test and generates a comprehensive HTML report. When run with L8990M switch matrix, it enables 20-ports fully automated test without port re-connection.
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Product
PCB Interconnect Stress Test System
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PWB Interconnect Solutions Inc.
Integrated package including PC, Software with real time graphing and all related systems and hardware for 8 head, dual sense testing model IST-HC
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Product
Signal Integrity Studio, Analysis & Simulation SW for WAVEPULSER High-Speed Interconnect Analyzer
WavePulser-Signal Integrity (SI) Studio
Analyzer
WavePulser Signal Integrity (SI) Studio is included as a single license in the WavePulser 40iX-BUNDLE or can be purchased as an additional license for offline access to additional users. WavePulser Signal Integrity (SI) Studio combines S-parameter, Impedance profiling and de-embedding measurements, channel and equalizer modeling, eye diagrams and jitter analysis in a single affordable software package for emulating the complete serial data channel.
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Product
Attenuator Interconnect Kit, 2.4 mm
11716F
Interconnect Adapter
The 11716F attenuator interconnection kit provides the necessary parts to connect 84904/8M and 84904/6L programmable step attenuators in series.
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Product
Cable Assemblies for Interconnect Solutions
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High quality connectors are just the beginning. Circuit Assembly (CA) also has over three decades of experience in producing a wide variety of cable assemblies for various applications. CA has the technical and manufacturing capabilities to provide customers with high-quality and cost-effective cable assemblies tailored to meet their needs. Circuit Assembly utilizes a quality process recognized by ISO 9001, and CA's cable assemblies are UL/CSA certified.
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Product
WAVEPULSER-40IX + WAVEPULSER-SI-STUDIO-NRZ + Adaptors and Calibration Kit
WAVEPULSER-40iX-BUNDLE
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High-speed Interconnect Analyzer, 4-port, S-par @40 GHz, <1 mm Res., 4 phase matched cables, bundle.
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Product
Multiple USB Instruments Configuration Kit
Y1701A
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The Keysight Y1701A includes latch kit for connecting two Keysight USB instruments. Optional interconnect cables are offered for connecting two USB vector network analyzers.
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Product
Tilera GX72 Processor AMC, 72 Core
AMC740
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The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
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Product
Socket Probes
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A lot of companies build test sockets. But only our test sockets are populated with our own proprietary probe technology, developed internally. This assures you that when you purchase one of our test sockets, you are using the most advanced interconnect available.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
High-Density Matrix Switch Card
1260-43
Matrix Switch Module
The Astronics 1260-43 is a high-density matrix switch card. Each module consists of three 8x24 single-wire matrices, which are interconnected via a 10-lane, single-wire bus. On-board configuration relays allow software control of the matrix configuration.
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Product
PCB Connectors
HPH Series
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Smiths Interconnect's HPH series is a high density interconnect available up to 303 contacts with multiple hardware choices and backpotting option
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Product
PXI Test Instrumentation
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The Yelo Pixi general purpose tester is a PXI based functional test system with in-circuit and continuity capability. Built into a free standing 19” rack is a PXI chassis, mass interconnect fixture interface, PC, flat screen and space for additional user selectable instrumentation.
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Product
PXIe-8510, 6-Port PXI Vehicle Multiprotocol Interface Module
784122-01
Interface
2- or 6-Port PXI Vehicle Multiprotocol Interface Module—The PXIe‑8510 is a hardware-selectable controller area network (CAN) and/or local interconnect network (LIN) interface for developing applications with the NI‑XNET driver. The PXIe-8510 excels in applications requiring real-time, high-speed manipulation of hundreds of CAN frames and signals, such as hardware‑in‑the‑loop simulation, rapid control prototyping, bus monitoring, automation control, and more. The NI‑XNET device-driven DMA engine enables the onboard processor to move CAN frames and signals between the interface and the user program without CPU interrupts, minimizing message latency and freeing host processor time for processing complex models and applications.
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Product
Enhanced Time Domain Analysis With TDR
S93011B
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S93011B enhanced time domain with TDR is available on all PNA models (N52xxB) and provides a one-box solution for high-speed interconnect analysis, including impedance, S-parameters, and eye-diagrams
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Product
12-Port PCI Express
PEX 8750
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The ExpressLane™ PEX8750 is a 48-lane, 12-port, PCIe Gen3 switch device developed on 40nm technology. PEX8750 offers Multi-Host PCI Express switching capability that enables users to connect multiple hosts to their respective endpoints via scalable, high-bandwidth, non-blocking interconnection to a wide variety of applications including servers, storage, communications, and graphics platforms.
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Product
Interface Pin
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Smiths Interconnect offers interface probes for all major test equipment manufacturers. We also provide a variety of interface pins for use in test fixtures.
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Product
Open Flanges Test Rig
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Flexible cell dimensions: cells of Ø 8 to Ø 80 mm (or square till 70x70 mm) can be successively installed Quick start of experiment: less than 20 minutes to remount a new cell with different dimension, thanks to the simple design without sealing Other SOFC components: the open flanges test rig is also useful for conductivity measurements (electrolyte, electrode material, interconnect etc.) and sealing tests End of broken cells and secure testing: the cell is squeezed by a soft alumina felt that prevents any damages, the excess fuel burns continuously in the alumina felt at the cell edges
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Product
VPX Switches & Routers
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Curtiss-Wright Defense Solutions
Our OpenVPX switches and routers, some with SOSA-aligned options, provide systems integrators with a fast and powerful way to interconnect chassis, cards, and processors through switched Gigabit, 10 Gigabit, and 40 Gigabit Ethernet interfaces.
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Product
Switch Path Manager Signal Routing Software
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Our signal routing software, Switch Path Manager (SPM), simplifies signal routing through switching systems and speeds up the development of switching system software. Switch Path Manager supports our switching modules and the interconnection between them. Once a switching system model has been created, simply defining the endpoints that are required to be connected together can perform signal routing.
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Product
High-Density PXI Multiplexer Switch Modules
Switch Module
This range of High-Density Multiplexer Switch Modules provides a compact array of MUX solutions with differing combinations of channel counts and poles. Most of our high-density solutions include isolation relays that allow the MUX to be disconnected from the single input/output port, enabling the convenient interconnection of other channels.
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Product
SIM 90 Series Modules
The SIM Modules
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Snap-In-Modular (SIM) modules delivers a flexible, high‑density interconnect solution that supports multiple high‑performance contact technologies within a single module. The VTAC, Micro Coax, and QuadraPaddle SIM modules.
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Product
Phase Sequence Indicator
8PK-ST850
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Two functions in one unit incluidng open phase and phase sequence. Large size alligator clips : able to clip on switch-board terminals easily. Identify 3 phase sequence and open phase check Ideal for installing conveyor lines, pump systems and interconnected drivers. No exposed metal parts. Safety features are incorporated throughout, including the pushbutton switch designed to minimize damage due to negligence. Safety approval: CE marks, IEN 1010 CAT. II.
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Product
Cable Assemblies
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VPC Cable Assemblies provide a reliable interconnect between the instrument and receiver interfaces. Connector‑to‑connector cable assemblies are also available.
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Product
Embedded Components
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Teledyne Labtech prides itself in being at the forefront of RF/Microwave PCB development. Teledyne Labtech were also one of the first companies to successfully develop techniques for embedding SMD resistors and capacitors within multilayer structures and the embedding of connector pins in buried stripline circuits.The advantages of such a structures ensures a much higher density of interconnect. This then removes the need for via-hole connections to the board surface or the need to create access pockets to the inner layers. Consequently you finish with a board with that exhibits much lower RF/Microwave losses. This is particularly important when designing large RF feed networks or 16:1 power dividers.
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Product
BMS Manufacturing Test System
Test System
The Battery Management System (BMS) Manufacturing Test System performs functional testing of product during end-of-line manufacturing. The system hardware includes all instrumentation to test a BMS, including multiple cell simulators, a mass interconnect for quick product transition and bed-of-nail fixtures to ensure less down time, higher throughput, and easy maintenance. The system application easily integrates into manufacturing processes, provides a method to test multiple product types, and optimizes tests to ensure only good product is released from manufacturing.
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Product
In-Line RF Test Station
AP770
RF Test System
ICT, Functional, Hipot, Vision, ISP and RF test with low cost fixtures in a very compact test station footprint Works with PCBs up to 450×550 mm or with palletized devices Space for up to 25 VPC mass interconnect modules or YAV switching units
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Product
CompactPCI
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CompactPCI is a computer bus interconnect for industrial computers, combining a Eurocard-type connector and PCI signaling and protocols. Boards are available in 3U or 6U sizes
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Product
Heavy Duty Modular Connector
HyperMod Series
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Smiths Interconnects’ heavy duty, modular, rectangular HyperMod Series is available with a variety of contacts, special shells for harsh environments and special high creepage/clearance modules. The series conforms to DIN 43652 standards and is NF F61-030 railways approved.
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Product
sbRIO-9860, Non-Enclosed, 2-Port, C Series Vehicle Multiprotocol Interface Module
787325-01
Interface Module
Non-Enclosed, 2-Port, C Series Vehicle Multiprotocol Interface Module - The sbRIO-9860 is a hardware-selectable HS/FD controller area network (CAN) and/or local interconnect network (LIN) interface for developing CAN and/or LIN applications. As part of the NI-XNET product line, the sbRIO-9860 works well for applications requiring high-speed manipulation of hundreds of frames and signals while performing low-level FPGA control and embedded monitoring in the same CompactRIO Single‐Board Controller. Non-enclosed modules are available for OEM applications.
