EV Group
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
- +43 7712 5311 0
- Sales@EVGroup.com
- DI Erich Thallner Strasse 1
St.Florian am Inn, A-4782
Australia
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
Hybrid And Fusion Bonding Systems
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Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
