ADLINK Technology Inc.
ADLINK Technology Inc. (TAIEX:6166) leads edge computing, the catalyst for a world powered by artificial intelligence. ADLINK manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing– more than 1600 customers around the world trust ADLINK for mission-critical success. ADLINK contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across 24+ consortiums, driving innovation across industries. For over 25 years, with 1800+ ADLINKers and 200+ partners, ADLINK enables the technologies of today and tomorrow, advancing technology and society around the world.
- +886-3-216-5088
- +886-3-328-5706
- service@adlinktech.com
- No. 66, Huaya 1st Rd.,
Guishan Dist.
Taoyuan City, 333411
Taiwan, Province of China
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Product
SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC
LEC-RB5
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The ADLINK LEC-RB5 is a SMARC module powered by the Qualcomm® QRB5165 SoC with 8 Arm Cortex-A77 cores and up to 15 TOPS Qualcomm® Hexagon™ Tensor Accelerator. The module is designed for robotics and drone applications and integrates several IoT technologies in a single solution. The LEC-RB5 SMARC module provides on-device artificial intelligence (AI) capabilities, support for up to 6 cameras, and low power consumption. It is capable of powering robots and drones in consumer, enterprise, defense, industrial and logistics sectors.
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Product
Medical Grade All-in-One Panel Computer with 13.3”/15.6” Full HD Display
MLC-AL/ MLC-KL
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The MLC-AL/MLC-KL Series of medical panel computers feature a fully sealed aluminum housing for easy cleaning. As a result of its hygienic surface design that eliminates exposed screw heads and air vents, the MLC-AL/MLC-KL Series can be easily and quickly cleaned using all common disinfectants and cleaning agents.The MLC-AL/MLC-KL comes in two display sizes, 13.3” and 15.6”, which are ideal for ICUs, emergency rooms and the hospital wards. In addition to the standard galvanically isolated network connections, the MLC-AL/MLC-KL can be optionally equipped with galvanically isolated USB and serial interfaces for connection to external non-medical devices. Compliant with 2x MOPP, the MLC-AL/MLC-KL meets the comprehensive requirements of the IEC/EN-60601-1 (Edition 3.1) and IEC/EN-60601-1-2 (4th Edition) standards.
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Product
Low-Cost 16-CH 250 kS/s 16-Bit Multi-Function DAQ Cards
DAQ-2213/2214
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- 16-bit A/D and sampling rate up to 250kS/s- 16-CH single-ended or 8-CH differential inputs- 512-configuration channel-gain queue- Analog and digital trigger
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
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The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
2-CH PCI Express® 10 GigE Vision PoE+ Grabber
PCIe-10GPoE
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ADLINK's PCIe-10GPoE PCI Express® PoE+ frame grabber supports 2-CH independent Gigabit Ethernet ports for multiple GigE Vision connections transferring up to 10Gb/s per port. PoE+ provides up to 30W power and automatic detection for stable, reliable connections, reducing costs, simplifying installation, and easing maintenance burdens. Exclusive comprehensive PoE Protection secures assets prevents overcurrent and overvoltage avoiding equipment damage. Smart PoE Management, easy-to-use utility and API provide realtime PoE status monitoring and control, lowering maintenance costs and predicting possible failure in advance. ToE (Trigger Over Ethernet), FPGA-based Trigger over Ethernet synchronizing multi-camera acquisitions significantly reduce ownership costs.
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Product
Industrial Mini-ITX Motherboard With 14/13/12th Gen Intel® Core™ I9/i7/i5/i3 Processors
AmITX-RL-I
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- 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 processors and Q670 chipset, up to 65W- Dual-channel DDR5 4800 MHz memory up to 64 GB- Quad. independent display: HDMI 2.0b, HDMI 1.4b, DP 1.4a, LVDS or eDP- Dual GbE ports: 1x 1GbE, 1x 2.5GbE- Expansion slots: 1x PCIe x16, 4x USB 3.2 Gen2, 2x USB 3.2 Gen1, 4x USB 2.0, 1x M.2 B-key, 1x M.2 E-key, 2x M.2 M-key- Support ATX (24+4 pin) or 12V DC-in power input
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Product
9U 8-Slot CompactPCI® Chassis with Redundant Power Supplies
cPCIS-3330 Series
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The cPCIS-3330 Series is a 19" 8-slot 6U CompactPCI Subsystem ideally suited to Network Equipment Providers, Computing Telephony Integrators and Voice over IP applications. This flexible and reliable development platform with optimized I/O and storage provides the best solution for equipment manufacturers and system integrators and shortens time-to-market for fast growing business revenues.
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Product
1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 10 PCI™ Slots Backplane
EBP-13E2
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- Segment: 1- Slots: 1 PICMG® CPU, 1 PCI-E® x16, 1 PCI-E® x4, 10 *PCI™- Support ATX power supplies- Dimension: 330 mm x 318 mm
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Product
8DI/8DO Modbus RTU Remote I/O
ND-6150
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The NuDAM modules provide direct communications with a wide variety of sensors; perform signal conditioning, scaling, linearization and conversion; can acquire measurements of temperature, pressure, flow, voltage, current; and handle multiple digital signal types broadly used in IoT and other industrial applications, such as facility monitoring, environment monitoring, and industrial process control. The new ND-6117, ND-6124, ND-6150, and ND-6160 modules feature Modbus/RTU as the best remote data transmission protocol, which provides customers a comprehensive product offering.
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Product
9-Slot 3U PXI Express Chassis with AC - Up to 8GB/s, All Hybrid
PXES-2590
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The ADLINK PXES-2590 is a 9-slot PXI Express chassis equipped with advanced features and functions. Compliant with PXI Express and cPCI Express specifications, the PXES-2590 offers one system slot, one system timing slot, and seven hybrid peripheral slots for versatile test and measurement applications requiring enhanced bandwidth. The hybrid-slot design accepts installation of CompactPCI, PXI, CompactPCI Express, and PXI Express modules into any peripheral slots in PXES-2590, maximizing flexibility. The PXES-2590 is built on a four-link PXI express chassis with 8 GB/s system bandwidth, and 2 GB/s slot bandwidth for all peripheral slots.
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
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ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Embedded System supporting FHFL dual-width PEG slot with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-4000 Series
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- NVIDIA® Quadro® PEG card support- 8th/9th Gen Intel® Core™ i7/i5/i3 processor- Dual SODIMMs for up to 32GB DDR4 non-ECC memory (dependent on CPU)- 1x DVI, 1x HDMI, 1x DP (from CPU), additional display outputs from PEG cards- 1x Mini PCIe slot for Wi-Fi/Bluetooth or LTE module- 300W/500W Flex ATX PSU
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
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The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Multipurpose Debug Board
DB40-HPC Debug Module
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The DB40-HPC Debug Card is designed for debugging of COM-HPC modules with FFC (FlexFoil Cable) debug connector. It includes an 80 port for Power on and Self-test (POST) via I2C interface, interface to SPI Flash for BIOS update, interface to EC for Embedded Controller (EC) update, Power and Reset buttons, and Status LEDs and Test Point for various debug tests.
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Product
COM-HPC
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The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of the industrial edge computing market.






















