Teradyne, Inc.
Teradyne tests and helps build the world’s most innovative products. Our leading-edge testers make sure that new products work right the first time, every time. And our robotics portfolio helps manufacturers to develop and deliver new products quickly, efficiently and cost-effectively.
- +1 800-837-2396
978 370-2700 - 978 370-1100
- customercare@teradyne.com
- 600 Riverpark Drive
North Reading, MA 01864
United States of America
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Product
High-Speed Memory Test Solution
UltraFLEX-M
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The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
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Product
In-Circuit Test System
TestStation LX
Test System
TestStation LX is a cost-effective in-circuit test solution providing high-volume electronics manufacturers with reliable, high-quality test for the latest printed circuit board assembly technologies.
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Product
Software
D2B
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The unique capabilities of Teradyne's D2B software enable EMS and OEM manufacturers and partners to interconnect their global enterprises to optimize printed circuit board assembly test and inspection efficiencies early in the manufacturing / build cycle. D2B is a powerful suite of solutions that provides a standards-based architecture that supports GenCAM and ODB++ file formats enabling electronic manufacturers to outperform their competition, maximize profitability, and get to market first.
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Product
Digital Test Instrumentation
Di-Series™
Test Instrument
The Di-Series tests all levels of integration from board level (SRA/SRU) to box level (WRA/LRU) units under test (UUTs), while maintaining full compatibility with previous generations of Teradyne instrumentation and systems. Excellent usability and reliability reduce programming and support effort, as well as straightforward upgrades of existing test program sets (TPS).
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Product
Wireless Testing
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Thorough testing of wireless technologies is essential, but it can’t result in production slowdowns or increased costs. Teradyne’s industry-leading wireless testers deliver high-throughput and get the newest technologies from the lab to high-volume manufacturing, quickly and cost-effectively.
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Product
Functional Test for Engineering Lab
Spectrum BT
Functional Test
Designed to meet the needs of product engineering labs, production lines, test development centers, and repair depots, the Spectrum BT is a configurable and scalable functional test system. This focused system solves typical functional test coverage challenges throughout the defense/aerospace product life cycle—and it’s upgradable as test requirements evolve.
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Product
Test System for High Volume Production Testing of Integrated Circuits
ETS-364
Test System
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture.
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Product
TestStation Multi-Site Offline
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TestStation Multi-Site Offline provides true parallel test, delivering 200% to 400% greater productivity, and 40% to 50% lower total cost of test.
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Product
Digital and Mixed-Signal Test Solutions
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A digital device processes electronic signals that represent either a one (on) or a zero (off). The ‘ones’ and ‘zeros’ represent data. Each one or zero is referred to as a bit and a group of 8 bits equals a byte
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Product
In-Circuit Test
TestStation LH
Test System
The TestStation LH in-circuit test system is a lower-cost, small footprint, feature scalable version of Teradyne's popular, award winning TestStation product family. TestStation LH features SafeTest protection technologies for accurate, reliable, and safe testing of the latest low-voltage technologies.
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Product
Integrated Solution for Digital Switching & Fiber Optics Operational Verification
VERTA
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When incorporated into defense/aerospace ATE, Verta enables reliable, error-free bus communication and interoperability tests to verify performance of high-speed, optically networked military weapon assemblies.
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Product
Sustainment & Life-Cycle Support Solutions
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Managing long-term ATE effectiveness and sustainment involves more than just maintenance and repair.Total Support Solution combines Teradyne’s long-term product support, unmatched engineering expertise, and deep knowledge in defense logistics to provide support solutions specific to customer’s needs throughout the ATE life cycle, enabling customers from integration labs to factories and MRO shops to achieve optimized test solutions, maximum equipment uptime and minimum life-cycle costs.
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Product
TestStation Product Family
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TestStation In-Circuit Test Systems provide full structural and functional coverage for a wide-range of manufacturing, component, process, and performance for high-performance analog, digital, and mixed-signal devices used on modern PCBs.
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Product
Test System Optimized for High Volume Production Testing of Integrated Circuits
ETS-364 / ETS-600
Test System
The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture. The test system offers separate floating resources for each site, improving site isolation and measurement accuracy coupled with digital instrumentation enabling the most efficient, high-volume testing available. The system supports up to 240 analog pin channels, and offers 133 MVPS digital vector rate with up to 128 digital pin channels. Eagle's scalability includes the ability to double the capacity of an ETS-364, providing more than 480 analog pin channels and up to 256 digital I/O pin channels with the ETS-600.
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Product
Magnum VUx for NAND Protocol Test Enhancement
Magnum VUx
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Teradyne’s Magnum VUx system is a flexible, superset test platform for all NAND and MCP products, both cutting edge UFS 3.0, uMCP, and PCIe Gen 4 mobile and automotive devices, as well as SSD NAND ONFI and Toggle, and legacy NAND products such as UFS 2.1, PCIe Gen 3, e.MMC, and eMCP.

















